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Palekana Palekana
ʻO ka APQ Embedded Industrial PC E5 Series he kamepiula ʻenehana ultra-compact i hoʻolālā kūikawā ʻia no ka ʻenehana ʻenehana a me nā noi helu lihi. Hoʻohana ia i ka Intel® Celeron® J1900 ultra-low power processor, e hāʻawi ana i kahi lākiō maikaʻi maikaʻi o ka ikehu a me ka hoʻolālā wela haʻahaʻa, e hōʻoiaʻiʻo ana i ka hana paʻa i nā kaiapuni ʻoihana like ʻole. Hoʻohui kēia pūʻulu i nā kāleka pūnaewele Intel® Gigabit ʻelua, e hāʻawi ana i nā pilina pūnaewele wikiwiki a paʻa e hoʻokō i nā pono o ka lawe ʻana i ka ʻikepili a me ke kamaʻilio. Hoʻolako ʻia me ʻelua mau kikowaena hōʻike ma luna o ka papa, kākoʻo ia i nā mea hōʻike hōʻike like ʻole, e ʻoluʻolu e hōʻike i ka ʻikepili manawa maoli a me ka nānā ʻana i nā kiʻi ma nā monitor like ʻole. Kākoʻo ia i kahi lako uila uila ākea 12 ~ 28V DC, hoʻololi i nā ʻenehana mana like ʻole a me ka hōʻoia ʻana i ka hana paʻa ma lalo o nā kūlana hana. Eia kekahi, kākoʻo ia i ka hoʻonui ʻana o WiFi/4G, hoʻomaʻamaʻa i nā pilina uea a me ka mana, e hoʻonui hou i kāna mau hiʻohiʻona noi.
ʻO ka hoʻolālā kino ultra-compact e kūpono i ka APQ Embedded Industrial PC E5 Series no nā hiʻohiʻona i hoʻopili ʻia. Inā i loko o nā lako automation a i ʻole i nā wahi i hoʻopaʻa ʻia, hāʻawi ka E5 Series i ke kākoʻo hoʻopili paʻa a maikaʻi.
Hoʻohālike | E5 | |
Pūnaehana Mea Hana | CPU | Intel®Celeron®Kaʻina hana J1900, FCBGA1170 |
TDP | 10W | |
Chipset | SOC | |
BIOS | AMI UEFI BIOS | |
Hoʻomanaʻo | Socket | DDR3L-1333 MHz (Ma luna o ka moku) |
Kaha Kiekie | 4GB | |
Kiʻi kiʻi | Mea hooponopono | Intel®Nā Kiʻi HD |
Ethernet | Mea hooponopono | 2 * Intel®i210-AT (10/100/1000 Mbps, RJ45) |
Waihona | SATA | 1 * SATA2.0 Connector (2.5-inch hard disk me 15 + 7pin) |
mSATA | 1 * mSATA Slot | |
Nā Kau Hoʻonui | apuka | 1 * a Hoʻonui ʻia ka puka |
Mini PCIe | 1 * Kākoʻo PCIe Mini (PCIe2.0 x1 + USB2.0, me 1 * Kāleka SIM Nano) | |
I/O mua | USB | 2 * USB3.0 (ʻAno-A) 1 * USB2.0 (ʻAno-A) |
Ethernet | 2 * RJ45 | |
Hōʻike | 1 * VGA: ka hoʻonā kiʻekiʻe a hiki i 1920*1200 @ 60Hz | |
Serial | 2 * RS232/485 (COM1/2, DB9/M) | |
Ka mana | 1 * Mea hookomo mana (12~28V) | |
I/O hope | USB | 1 * USB3.0 (ʻAno-A) 1 * USB2.0 (ʻAno-A) |
SIM | 1 * Kāleka SIM slot | |
pihi | 1 * Pihi Mana + LED mana | |
Leo | 1 * 3.5mm Laina-waho Jack 1 * 3.5mm MIC Jack | |
Hōʻike | 1 * HDMI: ka hoʻonā kiʻekiʻe a hiki i 1920*1200 @ 60Hz | |
I/O Kuloko | Pane mua | 1 * TFront Panel (3 * USB2.0 + Front Panel, wafer) 1 * Pane mua (wafer) |
FAN | 1 * SYS FAN (wafer) | |
Serial | 2 * COM (JCOM3/4, wafer) | |
USB | 2 * USB2.0 (wafer) 1 * USB2.0 (wafer) | |
Hōʻike | 1 * LVDS (wafer) | |
Leo | 1 * Audio mua (Line-Out + MIC, poʻo) 1 * ʻŌlelo (2-W (no kēlā me kēia kaha)/8-Ω Kaumaha, wafer) | |
GPIO | 1 * 8bits DIO (4xDI a me 4xDO, poʻo) | |
Lako ikehu | ʻAno | DC |
Voltage Hookomo Mana | 12~28VDC | |
Mea hoʻohui | 1 * DC5525 me ka laka | |
Kahiko RTC | CR2032 Coin Cell | |
Kākoʻo OS | Windows | Windows 7/8.1/10 |
Linux | Linux | |
ʻīlio kiaʻi | Hoʻopuka | Hoʻoponopono Pūnaewele |
Kūwaena | Hiki ke hoʻolālā ʻia 1 ~ 255 sec | |
Mekanika | Mea Paʻa | Radiator: Aluminum alloy, pahu: Aluminum alloy |
Anana | 235mm(L) * 124.5mm(W) * 35mm(H) | |
Kaumaha | Upena: 0.9Kg Huina: 1.9Kg (Hoʻokomo i ka ʻeke) | |
Ke kau ʻana | VESA, Kau i ka paia, Kau pakaukau | |
Kaiapuni | Pūnaehana hoʻopau wela | Hoʻoheheʻe wela passive |
Ka Mahana Hana | -20~60 ℃ | |
Ka Mahana Waihona | -40~80 ℃ | |
Haʻahaʻa pili | 5 a hiki i ka 95% RH (ka hoʻopaʻa ʻole) | |
Haʻalulu i ka wā o ka hana | Me SSD: IEC 60068-2-64 (3Grms@5~500Hz, ʻokoʻa, 1hr/axis) | |
Haʻalulu i ka wā o ka hana | Me SSD: IEC 60068-2-27 (30G, hapalua sine, 11ms) | |
Palapala hōʻoia | CCC, CE/FCC, RoHS |
Pono, palekana a hilinaʻi. ʻO kā mākou mea hana e hōʻoiaʻiʻo i ka hopena kūpono no kēlā me kēia koi. E pōmaikaʻi mai kā mākou ʻoihana ʻoihana a hoʻonui i ka waiwai - i kēlā me kēia lā.
Kaomi no ka nīnau