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ʻO ka APQ Full-screen Resistive Touchscreen Industrial All-in-One PC PLxxxRQ-E6 Series 11th-U Platform he mīkini hoʻohui kiʻekiʻe i hana ʻia no nā noi ʻoihana. ʻO kāna hiʻohiʻona koʻikoʻi ka hoʻokō ʻana i ka ʻenehana pale pale pale pale piha piha, e mālama ana i nā pono hana like ʻole i loko o nā ʻenehana ʻoihana. Kākoʻo ka hoʻolālā modular o ka mīkini i ka nui o ka pale mai ka 10.1 a i ka 21.5 iniha a hoʻokipa i nā hōʻike ākea a me ka laulā, e hālāwai ana i nā kūlana ʻoihana like ʻole a me nā koi o ka mea hoʻohana. Hāʻawi ka papa mua i ka lepo maikaʻi a me ka pale wai, e hoʻokō ana i nā kūlana IP65. Hoʻohana ʻia e ka Intel® 11th-U mobile platform CPU, e hōʻoiaʻiʻo i ka hana kūpono ʻoiai e hōʻemi ana i ka hoʻohana ʻana i ka ikehu. Hāʻawi nā kāleka pūnaewele ʻelua Intel® Gigabit i nā pilina pūnaewele wikiwiki a paʻa a me ka hiki ke hoʻoili ʻikepili. Eia kekahi, kākoʻo kēia mīkini holoʻokoʻa i loko o hoʻokahi waihona paʻa paʻakikī ʻelua me kahi hoʻolālā huki huki ʻokoʻa 2.5 ″ no ka mālama maʻalahi a me ka hoʻonui. Kākoʻo pū ʻo ia i ka hoʻonui ʻana i ka module APQ aDoor a me ka hoʻonui ʻana o WiFi/4G no ka hoʻokele mamao mamao a me ka lawe ʻana i ka ʻikepili. ʻO ka hoʻokomo ʻana i kahi hoʻolālā fanless a me ka heatsink detachable e hoʻonui i ka paʻa o ka ʻōnaehana.
Ma ke ʻano o ka hoʻonohonoho ʻana, kākoʻo ia i nā ʻano hoʻokomo a me VESA, e hoʻomaʻamaʻa i ka hoʻohui ʻana i nā ʻano ʻoihana like ʻole. Hoʻohana ʻia e kahi lako 12 ~ 28V DC, hoʻololi ia i kahi ākea ākea o ka mana.
I ka hōʻuluʻulu ʻana, ʻo ka APQ Full-screen Resistive Touchscreen Industrial All-in-One PC PLxxxRQ-E6 Series 11th-U Platform kahi koho kūpono no nā kahua o ka ʻenehana ʻenehana a me ka hoʻopili ʻana.
Hoʻohālike | PL101RQ-E6 | PL104RQ-E6 | PL121RQ-E6 | PL150RQ-E6 | PL156RQ-E6 | PL170RQ-E6 | PL185RQ-E6 | PL191RQ-E6 | PL215RQ-E6 | |
LCD | Nui Hōʻike | 10.1" | 10.4" | 12.1" | 15.0" | 15.6" | 17.0" | 18.5" | 19.0" | 21.5" |
ʻAno hōʻike | WXGA TFT-LCD | XGA TFT-LCD | XGA TFT-LCD | XGA TFT-LCD | FHD TFT-LCD | SXGA TFT-LCD | WXGA TFT-LCD | WXGA TFT-LCD | FHD TFT-LCD | |
Max.Resolution | 1280 x 800 | 1024 x 768 | 1024 x 768 | 1024 x 768 | 1920 x 1080 | 1280 x 1024 | 1366 x 768 | 1440 x 900 | 1920 x 1080 | |
ʻO ke kukui | 400 cd/m2 | 350 cd/m2 | 350 cd/m2 | 300 cd/m2 | 350 cd/m2 | 250 cd/m2 | 250 cd/m2 | 250 cd/m2 | 250 cd/m2 | |
ʻAspect Ratio | 16:10 | 4:3 | 4:3 | 4:3 | 16:9 | 5:4 | 16:9 | 16:10 | 16:9 | |
ʻO ka nānā ʻana | 89/89/89/89° | 88/88/88/88° | 80/80/80/80° | 88/88/88/88° | 89/89/89/89° | 85/85/80/80° | 89/89/89/89° | 85/85/80/80° | 89/89/89/89° | |
Max. kalakala | 16.7M | 16.2M | 16.7M | 16.7M | 16.7M | 16.7M | 16.7M | 16.7M | 16.7M | |
Ke ola ʻana o Backlight | 20,000 hola | 50,000 hola | 30,000 hola | 70,000 hola | 50,000 hola | 30,000 hola | 30,000 hola | 30,000 hola | 50,000 hola | |
Laki like ʻole | 800:1 | 1000:1 | 800:1 | 2000:1 | 800:1 | 1000:1 | 1000:1 | 1000:1 | 1000:1 | |
Pākuʻi paʻi | ʻAno pā | 5-uea hoʻopaʻa pale | ||||||||
Mea hooponopono | hōʻailona USB | |||||||||
Hookomo | ʻO ka manamana lima/peni hoʻopā | |||||||||
Hoʻouna Māmā | ≥78% | |||||||||
ʻoʻoleʻa | ≥3H | |||||||||
Kaomi ola | 100gf, 10 miliona manawa | |||||||||
Stroke ola ola | 100gf, 1 miliona manawa | |||||||||
Manawa pane | ≤15ms | |||||||||
Pūnaehana Mea Hana | CPU | Intel® 11thGeneration Core™ i3/i5/i7 Mobile -U CPU | ||||||||
Chipset | SOC | |||||||||
BIOS | AMI EFI BIOS | |||||||||
Hoʻomanaʻo | Socket | 2 * DDR4-3200 MHz SO-DIMM Slot | ||||||||
Kaha Kiekie | 64GB | |||||||||
Kiʻi kiʻi | Mea hooponopono | Intel® UHD Graphics/Intel®Iris®Xe Graphics (pili i ke ʻano CPU) | ||||||||
Ethernet | Mea hooponopono | 1 * Intel®i210AT (10/100/1000/2500 Mbps, RJ45) | ||||||||
Waihona | SATA | 1 * SATA3.0 mea hoʻohui | ||||||||
M.2 | 1 * M.2 Key-M (SSD, 2280, NVMe+SATA3.0) | |||||||||
Nā Kau Hoʻonui | apuka | 2 * a Puka Hoʻonui ʻia | ||||||||
kaa kaa puka | 1 * kaʻaahi Puka (16*GPIO + 4*PCIe + 1*I2C) | |||||||||
Mini PCIe | 1 * Kākoʻo PCIe Mini (PCIe x1+USB 2.0, me Kāleka SIM Nano) | |||||||||
I/O mua | USB | 2 * USB3.2 Gen2x1 (ʻAno-A) | ||||||||
Ethernet | 2 * RJ45 | |||||||||
Hōʻike | 1 * DP: a hiki i 4096x2304@60Hz | |||||||||
Serial | 2 * RS232/485 (COM1/2, DB9/M, mana BIOS) | |||||||||
Hoʻololi | 1 * Hoʻololi i ke ʻano AT/ATX (E hoʻā a hoʻopau i ka mana maʻalahi) | |||||||||
pihi | 1 * Hoʻoponopono hou (e hoʻopaʻa i lalo i ka 0.2 a i ka 1s e hoʻomaka hou, 3s e holoi iā CMOS) | |||||||||
Ka mana | 1 * Mea hookomo mana (12~28V) | |||||||||
I/O hope | SIM | 1 * Kāleka Kāleka Nano SIM (Hāʻawi ke kākoʻo hana ʻo Mini PCIe module) | ||||||||
pihi | 1 * Pākuʻi Mana+ LED Mana | |||||||||
Leo | 1 * 3.5mm Audio Jack (LineOut+MIC, CTIA) | |||||||||
I/O Kuloko | Pane mua | 1 * Panel mua (wafer, 3x2Pin, PHD2.0) | ||||||||
FAN | 1 * PIPA PPU (4x1Pin, MX1.25) | |||||||||
Serial | 1 * COM3/4 (5x2Pin, PHD2.0) | |||||||||
USB | 4 * USB2.0 (2*5x2Pin, PHD2.0) | |||||||||
LPC | 1 * LPC (8x2Pin, PHD2.0) | |||||||||
Waihona | 1 * SATA3.0 7Pin Connector | |||||||||
Leo | 1 * Lepe ʻōlelo (2-W (no kēlā me kēia kaha)/8-Ω Kaumaha, 4x1Pin, PH2.0) | |||||||||
GPIO | 1 * 16bits DIO (8xDI a me 8xDO, 10x2 Pin, PHD2.0) | |||||||||
Lako ikehu | ʻAno | DC | ||||||||
Voltage Hookomo Mana | 12~28VDC | |||||||||
Mea hoʻohui | 1 * 2Pin Mea hookomo mana (P=5.08mm) | |||||||||
Kahiko RTC | CR2032 Coin Cell | |||||||||
Kākoʻo OS | Windows | Windows 10 | ||||||||
Linux | Linux | |||||||||
ʻīlio kiaʻi | Hoʻopuka | Hoʻoponopono Pūnaewele | ||||||||
Kūwaena | Hiki ke hoʻolālā ʻia 1 ~ 255 sec | |||||||||
Mekanika | Mea Paʻa | Radiator/Panel: Aluminum, Pahu/Ka uhi: SGCC | ||||||||
Ke kau ʻana | VESA, hoʻokomo ʻia | |||||||||
Anana | 272.1*192.7*84 | 284*231.2*84 | 321.9*260.5*84 | 380.1*304.1*85 | 420.3*269.7*84 | 414*346.5*84 | 485.7*306.3*84 | 484.6*332.5*84 | 550*344*84 | |
Kaumaha | Upena: 3.2Kg, | Upena: 3.4Kg, | Upena: 3.6Kg, | Upena: 5Kg, | Upena: 4.9Kg, | Upena: 5.7Kg, | Upena: 5.6Kg, | Upena: 6.5Kg, | Upena: 7Kg, | |
Kaiapuni | Pūnaehana hoʻopau wela | Hoʻoheheʻe wela passive | ||||||||
Ka Mahana Hana | -20~60 ℃ | -20~60 ℃ | -20~60 ℃ | -20~60 ℃ | -20~60 ℃ | 0~50 ℃ | 0~50 ℃ | 0~50 ℃ | 0~60 ℃ | |
Ka Mahana Waihona | -20~60 ℃ | -20~70 ℃ | -30~80 ℃ | -30~70 ℃ | -30~70 ℃ | -20~60 ℃ | -20~60 ℃ | -20~60 ℃ | -20~60 ℃ | |
Haʻahaʻa pili | 10 a 95% RH | |||||||||
Haʻalulu i ka wā o ka hana | Me SSD: IEC 60068-2-64 (1Grms@5~500Hz, ʻokoʻa, 1hr/axis) | |||||||||
Haʻalulu i ka wā o ka hana | Me SSD: IEC 60068-2-27 (15G, hapalua sine, 11ms) |
Pono, palekana a hilinaʻi. ʻO kā mākou mea hana e hōʻoiaʻiʻo i ka hopena kūpono no kēlā me kēia koi. E pōmaikaʻi mai kā mākou ʻoihana ʻoihana a hoʻonui i ka waiwai - i kēlā me kēia lā.
Kaomi no ka nīnau