Hooponopono mamao
Nānā kūlana
Hana mamao a mālama
Palekana Palekana
ʻO ka APQ Vehicle-Road Collaboration Controller TAC-3000 kahi mea hoʻoponopono AI kiʻekiʻe i hoʻolālā ʻia no nā noi hui kaʻa-alanui. Ke hoʻohana nei kēia mea hoʻoponopono i nā modula kumu hoʻohui NVIDIA® Jetson™ SO-DIMM, e kākoʻo ana i ka hoʻopili helu AI kiʻekiʻe a hiki i 100 TOPS o ka mana helu. Hele mai ia maʻamau me 3 Gigabit Ethernet awa a me 4 USB 3.0 awa, e hāʻawi ana i ka wikiwiki a me ka paʻa pili pūnaewele a me ka hiki ke hoʻoili ʻikepili. Kākoʻo pū ka mea hoʻoponopono i nā hiʻohiʻona hoʻonui like ʻole, me ka 16-bit DIO koho a me 2 configurable RS232/RS485 COM ports, hoʻomaʻamaʻa i ka kamaʻilio me nā polokalamu waho. Kākoʻo ia i ka hoʻonui ʻana no nā mana 5G/4G/WiFi, e hōʻoiaʻiʻo ana i nā pilina kamaʻilio kelepona paʻa. Ma ke ʻano o ka lako mana, kākoʻo ka TAC-3000 i ka DC 12 ~ 28V ākea ākea ākea, e hoʻololi ana i nā wahi mana like ʻole. Hoʻohui ʻia, ʻo kāna hoʻolālā ultra-compact fanless me kahi kino ikaika kiʻekiʻe-metala āpau e hiki ke kū i nā kūlana kūlohelohe koʻikoʻi. Kākoʻo ia i nā papa kuhikuhi a me nā koho DIN rail mounting, e ʻae ana no ka hoʻonohonoho ʻana a me ka hoʻonohonoho ʻana e like me nā pono noi maoli.
ʻO ka hōʻuluʻulu manaʻo, me kona mana mana AI computing hiki, kiʻekiʻe-wikiwiki pili pūnaewele, waiwai I/O interfaces, a me ka hoʻonui nui, ka APQ Vehicle-Road Collaboration Controller TAC-3000 hāʻawi i ke kākoʻo paʻa a maikaʻi no nā noi hana kaʻa-alanui. Inā ma ka halihali naʻauao, kaʻa kaʻa kūʻokoʻa, a i ʻole nā ʻoihana ʻē aʻe e pili ana, kūpono ia i nā pono o nā hiʻohiʻona noiʻi paʻakikī.
Hoʻohālike | TAC-3000 | ||||
Pūnaehana Mea Hana | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
Hana AI | 472 GFLOPS | 1.33 TFLOPS | 21 NUI | ||
GPU | 128-core NVIDIA Maxwell™ hoʻolālā GPU | 256-core NVIDIA Pascal™ hoʻolālā GPU | 384-core NVIDIA Volta™ architecture GPU me 48 Tensor Cores | ||
ʻO ka pinepine GPU Max | 921MHz | 1.3 GHz | 1100 MHz | ||
CPU | Kaʻina hana ʻo ARM® Cortex®-A57 MPCore quad-core | Kālua-core NVIDIA DenverTM 2 64-bit CPU a me quad-core Arm® Cortex®-A57 MPCore processor | 6-nui NVIDIA Carmel Arm® v8.2 64-bit CPU 6MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz Cortex-A57: 2 GHz | 1.9 GHz | ||
Hoʻomanaʻo | 4GB 64-bit LPDDR4 25.6GB/s | 4GB 128-bit LPDDR4 51.2GB/s | 8GB 128-bit LPDDR4x 59.7GB/s | 16GB 128-bit LPDDR4x 59.7GB/s | |
TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
Pūnaehana Mea Hana | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
Hana AI | 20 NUI | 40 NUI | 70 NUI | 100 NUI | |
GPU | 512-core NVIDIA Ampere hoʻolālā GPU me 16 Tensor Cores | 1024-core NVIDIA Ampere hoʻolālā GPU me 32 Tensor Cores | 1024-core NVIDIA Ampere hoʻolālā GPU me 32 Tensor Cores | ||
ʻO ka pinepine GPU Max | 625 MHz | 765 MHz | 918 MHz |
| |
CPU | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm® Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.5 GHz | 2 GHz | |||
Hoʻomanaʻo | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
Ethernet | Mea hooponopono | 1 * GBE LAN Chip (hōʻailona LAN mai System-on-Module), 10/100/1000 Mbps2 * Intel®I210-AT, 10/100/1000 Mbps | |||
Waihona | eMMC | 16GB eMMC 5.1 (ʻAʻole kākoʻo ʻo Orin Nano a me Orin NX SOM i ka eMMC) | |||
M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (ʻO Orin Nano a me Orin NX SOMs ka hōʻailona PCIe x4, aʻo nā SOM'ē aʻe he hōʻailona PCIe x1) | ||||
TF Slot | 1 * Kāleka Kāleka TF (ʻAʻole kākoʻo ʻo Orin Nano a me Orin NX SOMs i ka kāleka TF) | ||||
Hoʻonui ʻO nā kau | Mini PCIe | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, me 1 * Nano SIM Kāleka) (Nano SOM ʻaʻohe hōʻailona PCIe x1) | |||
M.2 | 1 * M.2 Key-B Slot (USB 3.0, me 1 * Nano SIM Kāleka, 3052) | ||||
I/O mua | Ethernet | 2 * RJ45 | |||
USB | 4 * USB3.0 (ʻAno-A) | ||||
Hōʻike | 1 * HDMI: Hoʻoholo a hiki i 4K @ 60Hz | ||||
pihi | 1 * Pihi Mana + LED mana 1 * Pūnaehana hoʻoponopono hou | ||||
ʻaoʻao I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
pihi | 1 * Pihi Ho'ōla | ||||
Antenna | 4 * Puka Antenna | ||||
SIM | 2 * Nano SIM | ||||
I/O Kuloko | Serial | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
PWRBT | 1 * Pihi Mana (wafer) | ||||
PWRLED | 1 * LED mana (wafer) | ||||
Leo | 1 * Audio (Line-Out + MIC, wafer) 1 * Amplifier, 3-W (no ke kahawai) i loko o kahi 4-Ω Load (wafer) | ||||
GPIO | 1 * 16 mau bit DIO (8xDI a me 8xDO, wafer) | ||||
CAN Bus | 1 * CAN (wafer) | ||||
FAN | 1 * PPU PAPA (wafer) | ||||
Lako ikehu | ʻAno | DC, AT | |||
Voltage Hookomo Mana | 12~28V DC | ||||
Mea hoʻohui | Paʻa pahu, 2Pin, P=5.00/5.08 | ||||
Kahiko RTC | CR2032 Coin Cell | ||||
Kākoʻo OS | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
Mekanika | Mea Paʻa | Radiator: Aluminum alloy, Pahu: SGCC | |||
Anana | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Ke kau ʻana | Papakaukau, DIN-rail | ||||
Kaiapuni | Pūnaehana hoʻopau wela | Hoʻolālā liʻiliʻi ka pā | |||
Ka Mahana Hana | -20 ~ 60 ℃ me 0.7 m / s kahe ea | ||||
Ka Mahana Waihona | -40~80 ℃ | ||||
Haʻahaʻa pili | 10 a hiki i ka 95% (ʻaʻole condensing) | ||||
Haʻalulu | 3Grms@5~500Hz, kaawale, 1hr/axis (IEC 60068-2-64) | ||||
Haʻalulu | 10G, hapalua sine, 11ms (IEC 60068-2-27) |
Pono, palekana a hilinaʻi. ʻO kā mākou mea hana e hōʻoiaʻiʻo i ka hopena kūpono no kēlā me kēia koi. E pōmaikaʻi mai kā mākou ʻoihana ʻoihana a hoʻonui i ka waiwai - i kēlā me kēia lā.
Kaomi no ka nīnau