Kev tswj chaw taws teeb
Kev saib xyuas mob
Chaw taws teeb ua haujlwm thiab kev saib xyuas
Tswj kev nyab xeeb
APQ core modules CMT-Q170 thiab CMT-TGLU sawv cev rau kev dhia mus rau hauv kev cog lus, kev ua tau zoo hauv kev suav daws tsim rau cov ntawv thov uas qhov chaw nyob ntawm tus nqi. CMT-Q170 module ua haujlwm rau ntau yam kev xav tau ntawm kev ua haujlwm nrog kev txhawb nqa rau Intel® 6th txog 9th Gen Core™ processors, txhawb nqa los ntawm Intel® Q170 chipset kom muaj kev ruaj ntseg zoo dua thiab kev sib raug zoo. Nws nta ob qhov DDR4-2666MHz SO-DIMM qhov muaj peev xwm tuav txog 32GB ntawm lub cim xeeb, ua kom nws zoo rau kev ua cov ntaub ntawv hnyav thiab ntau ua haujlwm. Nrog rau ntau qhov sib txawv ntawm I / O interfaces suav nrog PCIe, DDI, SATA, TTL, thiab LPC, lub module yog primed rau kev nthuav dav. Kev siv lub siab-kev ntseeg siab COM-Express connector ua kom lub teeb liab kis tau tus mob ceev, thaum lub neej ntawd ntab hauv av tsim txhim kho electromagnetic compatibility, ua rau CMT-Q170 muaj kev xaiv zoo rau cov ntawv thov uas xav tau kev ua haujlwm zoo thiab ruaj khov.
Ntawm qhov tod tes, CMT-TGLU module yog tsim rau cov xov tooj ntawm tes thiab qhov chaw tsis muaj kev txwv, txhawb Intel® 11th Gen Core™ i3 / i5 / i7-U mobile processors. Cov qauv no tau nruab nrog DDR4-3200MHz SO-DIMM qhov, txhawb nqa txog 32GB ntawm lub cim xeeb kom txaus siab rau cov ntaub ntawv hnyav ua cov kev xav tau. Zoo ib yam li nws tus khub, nws muaj cov nplua nuj suite ntawm I / O interfaces rau kev nthuav dav kev tshaj lij thiab siv lub siab-kev ntseeg siab COM-Express connector rau kev cia siab rau high-ceev teeb liab kis tau tus mob. Lub module tus qauv tsim qhov tseem ceeb ntawm lub teeb liab kev ncaj ncees thiab tsis kam mus cuam tshuam, ua kom ruaj khov thiab ua haujlwm tau zoo thoob plaws ntau yam kev siv. Sib sau ua ke, APQ CMT-Q170 thiab CMT-TGLU core modules yog qhov tseem ceeb rau cov neeg tsim khoom nrhiav kev cog lus, kev ua tau zoo hauv kev suav daws hauv cov neeg hlau, tshuab pom kev, khoos phis tawj, thiab lwm yam kev siv tshwj xeeb uas qhov ua tau zoo thiab kev ntseeg siab yog qhov tseem ceeb.
Qauv | CMT-Q170/C236 | |
Processor System | CPU | Intel®6 ~ 9th Generation CoreTMDesktop CPU |
TDP | 65w ua | |
Qhov (socket). | LWM 1151 | |
Chipset | Intel®Q170/C236 | |
BIOS | AMI 128 Mbit SPI | |
Nco | Qhov (socket). | 2 * SO-DIMM qhov, Dual Channel DDR4 txog 2666MHz |
Muaj peev xwm | 32GB, Single Max. 16 GB ntawm | |
Duab | Tus tswj | Intel®HD Graphics 530 / Intel®UHD Graphics 630 (nyob ntawm CPU) |
Ethernet | Tus tswj | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
Expansion I/O | PCIe | 1 * PCIe x16 gen3, bifurcatable rau 2 x8 2 * PCIe x4 Gen3, bifurcatable rau 1 x4/2 x2/4 x1 1 * PCIe x4 Gen3, bifurcatable rau 1 x4/2 x2/4 x1 (Optional NVMe, Default NVMe) 1 * PCIe x4 Gen3, bifurcatable rau 1 x4/2 x2/4 x1 (Optional 4 * SATA, Default 4 * SATA) 2 * PCIe x1 Gen3 |
NVMe | 1 Chaw nres nkoj (PCIe x4 Gen3 + SATA Ill, Xaiv 1 * PCIe x4 Gen3, bifurcatable rau 1 x4/2 x2/4 x1, Default NVMe) | |
SATA | 4 Ports txhawb SATA Ill 6.0Gb / s (Optional 1 * PCIe x4 Gen3, bifurcatable rau 1 x4 / 2 x2 / 4 x1, Default 4 * SATA) | |
USB 3.0 | 6 Chaw nres nkoj | |
USB 2.0 | 14 Chaw nres nkoj | |
Suab | 1 * HDA | |
Zaub | 2 * TSI 1 * NP | |
Serial | 6 * UART(COM1/2 9-Xov tooj) | |
GPIO | 16 * ntsis DIO | |
Lwm yam | 1 * SPI | |
1 * PIB | ||
1 * SIB | ||
1 * ib2C | ||
1 * SYS FAN | ||
8 * USB GPIO Hwj chim On/Off | ||
Internal I/O | Nco | 2 * DDR4 SO-DIMM qhov |
B2B Connector | 3 * 220Pin COM-Express connector | |
FAN | 1 * CPU FAN (4x1Pin, MX1.25) | |
Fais fab mov | Hom | ATX: Vin, VSB; AW: Vin |
Cov khoom siv hluav taws xob | Kev: 12 V wb: 5v | |
OS Support | Qhov rai | Qhov rai 7/10 |
Linux | Linux | |
Saib xyuas | Tso zis | Qhov System Reset |
Lub sijhawm | Programmable 1 ~ 255 sec | |
Neeg kho tshuab | Qhov ntev | 146.8mm * 105mm |
Ib puag ncig | Ua haujlwm kub | -20 ~ 60 ℃ |
Cia Kub | -40 ~ 80 ℃ | |
txheeb ze humidity | 10-95% RH (tsis-condensing) |
Qauv | CMT-TGLU | |
Processor System | CPU | Intel®11thGeneration CoreTMi3/i5/i7 Mobile CPU |
TDP | 28 W | |
Chipset | SOC | |
Nco | Qhov (socket). | 1 * DDR4 SO-DIMM qhov, mus txog 3200MHz |
Muaj peev xwm | Max. 32 GB ua | |
Ethernet | Tus tswj | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
Expansion I/O | PCIe | 1 * PCIe x4 Gen3, Bifurcatable rau 1 x4/2 x2/4 x1 1 * PCIe x4 (Los ntawm CPU, tsuas yog txhawb nqa SSD) 2 * PCIe x1 Gen3 1 * PCIe x1 (Optional 1 * SATA) |
NVMe | 1 Chaw nres nkoj (Los ntawm CPU, tsuas yog txhawb nqa SSD) | |
SATA | 1 Chaw nres nkoj txhawb SATA Ill 6.0Gb / s (Optional 1 * PCIe x1 Gen3) | |
USB 3.0 | 4 Chaw nres nkoj | |
USB 2.0 | 10 Chaw nres nkoj | |
Suab | 1 * HDA | |
Zaub | 2 * TSI 1 * NP | |
Serial | 6 * UART (COM1/2 9-Wire) | |
GPIO | 16 * ntsis DIO | |
Lwm yam | 1 * SPI | |
1 * PIB | ||
1 * SIB | ||
1 * ib2C | ||
1 * SYS FAN | ||
8 * USB GPIO Hwj chim On/Off | ||
Internal I/O | Nco | 1 * DDR4 SO-DIMM qhov |
B2B Connector | 2 * 220Pin COM-Express connector | |
FAN | 1 * CPU FAN (4x1Pin, MX1.25) | |
Fais fab mov | Hom | ATX: Vin, VSB; AW: Vin |
Cov khoom siv hluav taws xob | Kev: 12 V wb: 5v | |
OS Support | Qhov rai | Windows 10 |
Linux | Linux | |
Neeg kho tshuab | Qhov ntev | 110mm * 85mm |
Ib puag ncig | Ua haujlwm kub | -20 ~ 60 ℃ |
Cia Kub | -40 ~ 80 ℃ | |
txheeb ze humidity | 10-95% RH (tsis-condensing) |
Ua tau zoo, nyab xeeb thiab txhim khu kev qha. Peb cov cuab yeej lav qhov kev daws teeb meem zoo rau txhua qhov kev xav tau. Tau txais txiaj ntsig los ntawm peb cov kws tshaj lij kev lag luam thiab tsim kom muaj txiaj ntsig ntxiv - txhua hnub.
Nyem Rau Nug