Lacus Alneus Septentrionalis AK5/AK61/AK62/AK7
Administratio remota
Monitorium condicionis
Operatio et sustentatio remota
Imperium Salutis
CONTACTA NOSDescriptio Producti
Productum praecipuum APQ E-Smart IPC, Moderator Intelligens in modum Magazzini seriei AK, configurationem 1+1+1 adhibet — scilicet, unitatem principalem + magazinam principalem + magazinam auxiliarem + magazinam programmatum. Haec dispositio, per tres suggestus et novem genera magazinarum composita, plus quam 72 combinationes functionum efficit, variis necessitatibus applicationum, ut visione, imperio motus, robotica, et digitalizatione, occurrens, cum flexibilitate mutandi magazinam ad applicationem specificam satisfaciendum, ita sumptus sustentationis pro clientibus per automatam operationem machinae minuendo.
Series AK officium APQ repraesentat ad creandum moderatorem fidum et in industria praesentem, cui clientes Sinenses confidere possint. Singularis in agro roboticae, moderator AK systemata ARM, X86, et MCU complectitur, moderationem dominii chassis et moderationem dominii gubernationis autonomae integrans. Optima electio pro suggestu moderationis dominii industriae se praebet.
AK, ut moderator visionis, rationem pretii et efficacitatis in sectore 2-4 camerarum praeclaram assequitur. Etiam est electio primaria pro applicationibus PLC mollibus et optima electio suggestus ad integrationem profundam chartarum moderationis motus et IO.
| Modellum | AK5xxx | AK5xxx-1A/1B | AK5xxx-2A | AK5xxx-3A | |
| CPU | CPU | Intel®Processorius Seriei Alder Lake-N | |||
| TDP | 12/15W | ||||
| Microprocessus | SOC | ||||
| BIOS | BIOS | BIOS UEFI AMI | |||
| Memoria | Socket | 1 * Slot DDR4 SO-DIMM, usque ad 3200MHz | |||
| Capacitas Maxima | 16GB | ||||
| Graphica | Moderator | Intel®Graphica UHD | |||
| Aethernet | Moderator | 2 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) | 2 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i350 GbE LAN Chip (10/100/1000 Mbps) | 2 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) | 2 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) |
| Repositorium | M.2 | 1 * Clavis M.2-M (SATA3.0, 2280) | |||
| Areae Expansionis | Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum spatio pro scheda SIM) | |||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 | 1 * PCI | |
| I/O anterior | USB | 4 * USB 3.0 (Typus-A)2 * USB 2.0 (Typus-A) | |||
| Serialis | 2 * RS232/485 (COM1/2, DB9/M, viae plenae, commutator BIOS) | ||||
| Ostendere | 1 * HDMI: resolutio maxima usque ad 4096*2304 @ 24Hz 1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz 1 * VGA: resolutio maxima usque ad 1920*1200 @ 60Hz | ||||
| LAN/POE | Duo * RJ45 | Duo * RJ45 AK5xxx-1A: 2 * RJ45, Intel®i350-AM2, modulus POE optionalis, 802.3at/af, summa 60W AK5xxx-1B: 4 * RJ45, Intel®i350-AM4, modulus POE optionalis, 802.3at/af, summa 60W | Duo * RJ45 | Duo * RJ45 | |
| Fons Lucis | N/A | 4 * Egressus Fontis Lucis (24V, Max. 1A per canalem, moderatio PWM) | N/A | N/A | |
| GPIO | N/A | 1 * 16bit DIO (8xDI, isolatio optica; 8xDO, isolatio optica) | N/A | N/A | |
| Potestas | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | |
| SIM | 1 * Spatium pro scheda Nano SIM (modulus Mini PCIe functionem sustinet) | ||||
| Globulus | 1 * Globulus Potestatis + LED Potestatis 1 * Coniunctor PS_ON | ||||
| I/O Inferioris | Commutatio | 1 * AT/ATX Modus Commutator (Automatice potentiam activat/inactivat) | |||
| Globulus | 1 * Repone (Preme 0.2 ad 1s ad incipiendum, 3s ad CMOS purgandum) 1 * OS Rec (recuperatio systematis) | ||||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 | 1 * PCI | |
| Fons Potentiae | Typus | DC | |||
| Tensio Potentiae Ingressae | 12 ~ 28VDC Nota: Cum fonte lucis uteris, ingressus 24V adhibendus est. | ||||
| Coniunctor | 1 * 4Pin Connector Potestatis Ingressae (P = 5.08mm) | ||||
| Accumulator RTC | Cellula Nummaria CR2032 | ||||
| Auxilium Systematis Operativi | Fenestrae | Fenestrae 10/11 | |||
| Linux | Linux | ||||
| Custos | Exitus | Restitutio Systematis | |||
| Intervallum | Programmabile per programmatum ab 1 ad 255 secundas | ||||
| Mechanica | Materia clausurae | Radiator/Arca: Mixtura aluminii, Tegmen superius/infimum: SGCC | |||
| Dimensiones | 53mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | |
| Montatio | Murale, DIN, escritorio | ||||
| Ambitus | Systema Dissiptionis Caloris | Dissipatio Caloris Passiva | |||
| Temperatura Operativa | -20~60℃ (SSD Industrialis) | ||||
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | ||||
| Humiditas Relativa | 5 ad 90% RH (non condensans) | ||||
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | ||||
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | ||||
| Modellum | AK61xxA2 | |
| CPU | CPU | Intel® 11thProcessorius Generationis Core™ i3/i5/i7 Mobilis -U |
| Microprocessus | SoC | |
| BIOS | BIOS | BIOS UEFI AMI |
| Memoria | Socket | 1 * Slot DDR4 SO-DIMM, usque ad 3200MHz |
| Capacitas Maxima | 32GB | |
| Graphica | Moderator | Intel®Graphica UHD/Intel®Graphica Iris® Xe (Pro CPU) |
| Aethernet | Moderator | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) |
| Repositorium | M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3, NVMe SSD, 2280). |
| Expansin | Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum spatio pro scheda SIM) |
| Armarium Optionale | 1E | |
| I/O anterior | USB | 4 * USB 3.0 (Typus-A) |
| Serialis | 2 * RS232/485 (COM1/2, DB9/M, viae plenae, commutator BIOS) | |
| Ostendere | 1 * HDMI: resolutio maxima usque ad 4096*2304 @ 24Hz | |
| LAN | Duo * RJ45 | |
| Potestas | 1 * Introitus Potentiae DC | |
| SIM | 1 * Spatium pro scheda Nano SIM (modulus Mini PCIe functionem sustinet) | |
| Globulus | 1 * Globulus Potestatis + LED Potestatis | |
| I/O Inferioris | Commutatio | 1 * AT/ATX Modus Commutator (Automatice potentiam activat/inactivat) |
| Globulus | 1 * Repone (Preme 0.2 ad 1s ad incipiendum, 3s ad CMOS purgandum) | |
| Fons Potentiae | Typus | DC |
| Tensio Potentiae Ingressae | 12 ~ 28VDC | |
| Coniunctor | 1 * 4Pin Connector Potestatis Ingressae (P = 5.08mm) | |
| Accumulator RTC | Cellula Nummaria CR2032 | |
| Auxilium Systematis Operativi | Fenestrae | Fenestrae 10/11 |
| Linux | Linux | |
| Custos | Exitus | Restitutio Systematis |
| Intervallum | Programmabile per programmatum ab 1 ad 255 secundas | |
| Mechanica | Materia clausurae | Radiator/Arca: Mixtura aluminii, Tegmen superius/infimum: SGCC |
| Dimensiones | 53mm (L) * 145mm (L) * 186.4mm (A) | |
| Montatio | Murale, DIN, escritorio | |
| Ambitus | Systema Dissiptionis Caloris | Dissipatio Caloris Passiva |
| Temperatura Operativa | -20~60℃ (SSD Industrialis) | |
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | |
| Humiditas Relativa | 5 ad 90% RH (non condensans) | |
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | |
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | |
| Modellum | AK62xx | AK62xx-1A/1B | AK62xx-2A | AK62xx-3A | |
| CPU | CPU | Intel®DuodecimthNucleus GenerationisTMCPU i3/i5/i7 Mobile -P | |||
| TDP | 28W | ||||
| Microprocessus | SOC | ||||
| BIOS | BIOS | BIOS UEFI AMI | |||
| Memoria | Socket | Duae * DDR5 SO-DIMM fissurae, canalis duplex usque ad 5200MHz | |||
| Capacitas Maxima | 64GB, Singulum Maximum 32GB | ||||
| Aethernet | Moderator | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i350 GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Repositorium | M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3, NVMe SSD, 2280). | 1 * M.2 Key-M (PCIe x4 Gen 3, NVMe SSD, 2280). 1 * Clavis M.2-M (SATA3.0, 2280) | 1 * M.2 Key-M (PCIe x4 Gen 3, NVMe SSD, 2280). | 1 * M.2 Key-M (PCIe x4 Gen 3, NVMe SSD, 2280). |
| Areae Expansionis | Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0) 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum spatio pro scheda SIM) | |||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 | 1 * PCI | |
| I/O anterior | USB | 6 * USB3.0 (Typus-A) | |||
| Serialis | 2 * RS232/485 (COM1/2, DB9/M, viae plenae, commutator BIOS) | ||||
| Ostendere | 1 * HDMI: resolutio maxima usque ad 4096*2304 @ 24Hz 1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz 1 * VGA: resolutio maxima usque ad 1920*1200 @ 60Hz | ||||
| LAN/POE | Duo * RJ45 | Duo * RJ45 AK62xx-1A: 2 * RJ45, Intel®i350-AM2, modulus POE optionalis, 802.3at/af, summa 60W AK62xx-1B: 4 * RJ45, Intel®i350-AM4, modulus POE optionalis, 802.3at/af, summa 60W | Duo * RJ45 | Duo * RJ45 | |
| Fons Lucis | N/A | 4 * Egressus Fontis Lucis (24V, Max. 1A per canalem, moderatio PWM) | N/A | N/A | |
| GPIO | N/A | 1 * 16bit DIO (8xDI, isolatio optica; 8xDO, isolatio optica) | N/A | N/A | |
| Potestas | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | |
| SIM | 1 * Spatium pro scheda Nano SIM (modulus Mini PCIe functionem sustinet) | ||||
| Globulus | 1 * Globulus Potestatis + LED Potestatis 1 * Coniunctor PS_ON | ||||
| I/O Inferioris | Commutatio | 1 * AT/ATX Modus Commutator (Automatice potentiam activat/inactivat) | |||
| Globulus | 1 * Repone (Preme 0.2 ad 1s ad incipiendum, 3s ad CMOS purgandum) 1 * OS Rec (recuperatio systematis) | ||||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 | 1 * PCI | |
| Fons Potentiae | Tensio Potentiae Ingressae | 12 ~ 28VDC Nota: Cum fonte lucis uteris, ingressus 24V adhibendus est. | |||
| Auxilium Systematis Operativi | Fenestrae | Fenestrae 10/11 | |||
| Linux | Linux | ||||
| Mechanica | Dimensiones | 53mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) |
| Ambitus | Temperatura Operativa | -20~60℃ (SSD Industrialis) | |||
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | ||||
| Humiditas Relativa | 5 ad 90% RH (non condensans) | ||||
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | ||||
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | ||||
| Modellum | AK7170 | AK7170-1A/1B | AK7170-2A | AK7170-3A | |
| CPU | CPU | Intel®VI~IXthNucleus GenerationisTMProcessorius Computatralis i3/i5/i7 | |||
| TDP | 65W | ||||
| Socket | LGA1151 | ||||
| Microprocessus | Microprocessus | Intel® Q170 | |||
| BIOS | BIOS | BIOS UEFI AMI | |||
| Memoria | Socket | Duo fissurae SO-DIMM, DDR4 duplex usque ad 2666MHz | |||
| Capacitas Maxima | 32GB, Singulum Maximum 16GB | ||||
| Aethernet | Moderator | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i350 GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Repositorium | M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD auto detect, 2280) 1 * Clavis M.2-M (SATA3.0, 2280) | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2280) |
| Expansin Slots | Mini PCIe | 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0) 1 * Mini PCIe (PCIe x1 Gen 2 + USB 2.0, cum spatio pro scheda SIM) | |||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 | 1 * PCI | |
| I/O anterior | USB | 6 * USB3.0 (Typus-A) | |||
| Serialis | 2 * RS232/485 (COM1/2, DB9/M, viae plenae, commutator BIOS) | ||||
| Ostendere | 1 * HDMI: resolutio maxima usque ad 4096*2304 @ 24Hz 1 * DP: resolutio maxima usque ad 4096*2160 @ 60Hz 1 * VGA: resolutio maxima usque ad 1920*1200 @ 60Hz (Optionalis) | ||||
| LAN/POE | Duo * RJ45 | Duo * RJ45 AK7170-1A: 2 * RJ45, Intel®i350-AM2, modulus POE optionalis, 802.3at/af, summa 60W AK7170-1B: 4 * RJ45, Intel®i350-AM4, modulus POE optionalis, 802.3at/af, summa 60W | Duo * RJ45 | Duo * RJ45 | |
| Fons Lucis | N/A | 4 * Egressus Fontis Lucis (24V, Max. 1A per canalem, moderatio PWM) | N/A | N/A | |
| GPIO | N/A | 1 * 16bit DIO (8xDI, isolatio optica; 8xDO, isolatio optica) | N/A | N/A | |
| Potestas | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | 1 * Introitus Potentiae DC | |
| SIM | 1 * Spatium pro scheda Nano SIM (modulus Mini PCIe functionem sustinet) | ||||
| Globulus | 1 * Globulus Potestatis + LED Potestatis 1 * Coniunctor PS_ON | ||||
| I/O Inferioris | Commutatio | 1 * AT/ATX Modus Commutator (Automatice potentiam activat/inactivat) | |||
| Globulus | 1 * Repone (Preme 0.2 ad 1s ad incipiendum, 3s ad CMOS purgandum) 1 * OS Rec (recuperatio systematis) | ||||
| PCIe/PCI | N/A | N/A | 1 * PCIe x4 spatium | 1 * foramen PCI | |
| Fons Potentiae | Typus | DC | |||
| Tensio Potentiae Ingressae | 12 ~ 28VDC Nota: Cum fonte lucis uteris, ingressus 24V adhibendus est. | ||||
| Coniunctor | 1 * 4Pin Connector Potestatis Ingressae (P = 5.08mm) | ||||
| Accumulator RTC | Cellula Nummaria CR2032 | ||||
| Auxilium Systematis Operativi | Fenestrae | Nucleus 6/7™: Fenestrae 7/10/11 Nucleus 8/9™: Fenestrae 10/11 | |||
| Linux | Linux | ||||
| Mechanica | Dimensiones | 53mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) | 72.9mm (L) * 145mm (L) * 186.4mm (A) |
| Ambitus | Temperatura Operativa | -20~60℃ (SSD Industrialis) | |||
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | ||||
| Humiditas Relativa | 5 ad 90% RH (non condensans) | ||||
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | ||||
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | ||||
| Modellum | AK1J19A3 | |
| CPU | CPU | Intel®Celeron®Processorius J1900 |
| Frequentia Basis | 2.0 GHz | |
| Frequentia Turbo Maxima | 2.4 GHz | |
| Repositorium | 2MB | |
| Nuclei/Fila | 4/4 | |
| Microprocessus | SOC | |
| BIOS | BIOS UEFI AMI | |
| Memoria | Socket | 1 * DDR3L SO-DIMM spatium, frequentia 1333MHz |
| Capacitas Maxima | 8GB | |
| Ostendere | Graphicae Microprocessores | Intel®Graphica UHD |
| Rete | Microprocessus Retialis | 3 * Intel®Microprocessores retiarii i210-AT (10/100/1000 Mbps) |
| Repositorium | M.2 | 1 * M.2 Clavis-M (protocollum SATA2.0, 2280 sustinet) |
| Expansio | Mini PCIe | 1 * Mini PCIe (signa PCIe x1 + USB 2.0 + 1 * SATA 2.0 sustinet, cum spatio pro scheda SIM) |
| Modulus Optionalis | 1A (16 * DI optice isolata + 16 * DO optice isolata + 4 * RS232/RS485 + 2 * CAN)1. | |
| I/O anterior | USB | 1 * USB3.0 (Typus-A) 3 * USB 2.0 (Typus-A) |
| Aethernet | Interfacies RJ45 tres | |
| Ostendere | 1 * Interfacies HDMI (usque ad 1920*1200 @ 60Hz sustinet) | |
| Commutatio | 1 * Bulla potentiae (cum lumine indicatoris potentiae)1 * Interfacies commutatoris potentiae externae | |
| I/O Lateris Sinistri | Commutatio | 1 * AT/ATX commutator basculans (ad activandum/inactivandum automaticum systematis accensionis) |
| Bullae | 1 * Bulla repositionis (preme per 0.2-1 secunda ad incipiendum; preme diu per 3 secunda ad CMOS purgandum)1 * Bulla recuperationis systematis | |
| SIM | 1 * Spatium pro scheda Nano SIM (functio per Mini PCIe sustinetur) | |
| I/O Lateris Dextrae | Potestas | 1 * Interfacies ingressus potentiae (12~28V, 2P, P=5.08mm) |
| Portus Seriales | 2 * RS232/485 (COM1/2, P=2.5mm, RS485 isolationem opticam aut praesidium contra fulmina non sustinet)1. | |
| Fons Potentiae | Typus | DC |
| Tensio Ingressa | 12~28V | |
| Socket | 1 * receptaculum potentiae bi-clavorum (P=5.08mm) | |
| Accumulator RTC | Pila button CR2032 | |
| Auxilium Systematis | Fenestrae | Fenestrae 7/10 |
| Linux | Linux | |
| Canis Custos | Exitus | Systema Restitutum |
| Intervallum | Programmabile, 1~255 secunda | |
| Structura | Materia Chassis | Dissipator caloris: Mixtura aluminiiLaminae superiores/inferiores: Chalybs galvanizatus Basis: Chalybs galvanizatus |
| Dimensiones | 139mm (L) * 95.5mm (L) * 43mm (A) | |
| Optiones Installationis | Muralis, ferriviis affixus, escritorio affixus | |
| Ambitus | Systema Refrigerationis | Refrigeratio passiva sine ventilatore |
| Temperatura Operativa | -20~60℃ (cum SSD industriali) | |
| Temperatura Reponendi | -40~80℃ (cum SSD industriali) | |
| Humiditas | 5 ad 90% RH (non condensans) | |
| Resistentia Vibrationis | IEC 60068-2-64 (3Grms@5~500Hz, passim, 1hr/axis SSD) | |
| Resistentia ad Ictus | IEC 60068-2-27 (30G, dimidii sinus, 11ms，使用SSD) | |
Nota ①: Cum modulus expansionis 1A selectus est, COM1/2 adhiberi non potest.
| Modellum | AK41xx | ||
| Moduli Centrales | Jetson AGX Orin 32GB, 200 TOPS | Jetson AGX Orin 64GB, 275 TOPS | |
| Aethernet | Moderator | 1 * 10GbE, 10/100/1000/10000 Mbps (Interfacies Nativa) | |
| 1 * Intel® i210-AT, 10/100/1000 Mbps | |||
| 1 * Intel® i210-AT, 10/100/1000 Mbps (Quattuor interfacies communes per commutatorem) | |||
| Repositorium | M.2 | 1 * M.2 Key-M (PCle x4 Gen 3, NVMe SSD, 2280) | |
| TF | 1 * Slot pro charta TF | ||
| Areae Expansionis | M.2 | 1 * Clavis M.2-B (USB 5Gbps, cum 1 * Foramine pro Scheda SIM, 3052) | |
| 1 * Clavis M.2-E (TTL, 2230) | |||
| Mini PCIe | 1 * Mini PCIe (USB 2.0, cum 1 * Foramine pro Scheda SIM) | ||
| I/O anterior | Aethernet | Sex * RJ45 | |
| USB | 4 * USB 5Gbps (Typus-A) | ||
| 4 * USB 2.0 (Typus-A) | |||
| Ostendere | 1 * HDMI: Resolutio usque ad 4096x2160 @ 30Hz | ||
| LED | 1 * LED CURSUS | ||
| 1 * ERR LED | |||
| 1 * LED status potentiae | |||
| Globulus | 1 * Bulla Potestatis Accendi/Exstinguendi | ||
| 1 * Bulla Recuperationis | |||
| 1 * Bulla Restitutionis | |||
| I/O Lateralis | USB | 1 * USB 5Gbps (Typus-C) | |
| 1 * USB 2.0 (Micro USB, Debug) | |||
| 1 * USB 2.0 (Micro USB, Deprehensio) | |||
| PSON | 1 * PSON (Terminales Inseribiles, P=3.5mm) | ||
| GMSL | 8 * GMSL2 (FAKRA) | ||
| TF | 1 * Slot pro charta TF | ||
| SIM | 2 * Foramina pro Schedulis SIM | ||
| Audio | 2 * Jack 3.5mm (MIC + Line_Out) | ||
| Serialis | 4 * RS232/485 (COM1/2/3/4, Terminales Inseribiles, P=2.54mm) | ||
| POSSUM | 2 * CAN FD (Terminales Inseribiles, P=2.54mm) | ||
| GPIO | GPIO 8-bit (Terminales Inseribiles, P=2.54mm) | ||
| SPI | 1 * SPI (Terminales Inseribiles, P=2.54mm) | ||
| I2C | 1 * I2C (Terminales Inseribiles, P=2.54mm) | ||
| Ingressus/Egressus Internus | FPANEL | 1 * FPANEL (Caput) | |
| VENTILATOR | 1 * VENTILATOR SYSTEM (lamella) | ||
| Orator | 1 * Orator (onera 5-W/8-Ω, lamella) | ||
| PotestasCopia | Typus | AT/ATX | |
| Tensio Potentiae Ingressae | 9 ~ 36VDC | ||
| Coniunctor | 1 * Terminales Inseribiles, 2-Pin, P=5.0/5.08mm | ||
| Accumulator RTC | Cellula Nummaria CR2032 | ||
| Auxilium Systematis Operativi | Linux | Ubuntu | |
| Custos | Exitus | Restitutio Systematis | |
| Mechanica | Materia clausurae | Radiator/Arca: Mixtura aluminii, Tegmen superius/infimum: SGCC | |
| Dimensiones | 53mm (L) * 145mm (L) * 186.4mm (A) | ||
| Montatio | Murale, DIN, escritorio | ||
| Ambitus | Systema Dissiptionis Caloris | Refrigeratio PWMAir | |
| Temperatura Operativa | -20~60℃ (SSD Industrialis) | ||
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | ||
| Humiditas Relativa | 5 ad 90% RH (non condensans) | ||
| Vibratio Inter Operationem | Cum SSD Industriali: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | ||
| Impetus Inter Operationem | Cum SSD Industriali: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | ||
Dimensiones Producti
Introitus/Egressus Producti
AK5xxx
AK61xx
AK62xx
AK7170
EXEMPLA ACQUIRE
Efficax, tutus et fidus. Nostra instrumenta solutionem rectam cuilibet necessitati praestant. Fruere peritia nostra in industria et valorem additum crea - quotidie.
Preme pro Inquisitione
