CMT Series Industrial Motherboard
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Core APQ moduli CMT-Q170 et CMT-TGLU saltum in pacto repraesentant, altum operandi solutiones computandi applicationes ubi spatium ad premium destinatum est. CMT-Q170 cateri moduli ad operas computandas exigendi cum auxilio VI Intel® ad 9th Gen Core processors, ab Intel® Q170 coris muniti sunt propter superiorem stabilitatem et compatibilitatem. Duas DDR4-2666MHz notat SO-DIMM foramina quae ad 32GB memoriae tractandae sunt, eamque aptam facit ad intensivam processus notitiae et multitatis. Lato interfaces I/O interfaces inclusis Plu, DDI, SATA, TTL et LPC, modulus ad professionalem expansionem praeparatur. Usus magni certaminis COM-Expressi iungentis transmissionem praebet summus velocitatis signum, dum defalta fluitans designatio ad compatibilitatem electromagneticam auget, faciens electionem CMT-Q170 robustam ad applicationes ad operationes certas et stabiles requirendas.
Ex altera parte, modulus CMT-TGLU formandus est ad ambitus mobilis et spatio constrictos, sustinens Intel® 11th Gen Core™ i3/i5/i7-U processus mobiles. Modulus hic instructus est socors DDR4-3200MHz SO-DIMM, adiuvans usque ad 32GB memoriae ut tincidunt gravibus notitiis edendi necessitates. Similem parti suae, locupletem litem I/O interfaciei praebet ad amplam expansionem professionalem et adhibet altam fidem COM-Expressi iungentis pro signo transmissionis constantis velocitatis. Consilium moduli prioritizat integritatem et repugnantiam impedimenti insignem, ut stabilis et efficax effectus per varias applicationes perficiatur. Collective, APQ CMT-Q170 et CMT-TGLU nuclei moduli necessarii sunt pro tincidunt quae- rendo pacto, summus effectus computandi solutiones in roboticis, visionis machinae, computatione portabili, et aliis applicationibus specialibus in quibus efficientia et fides eminentia sunt.
| Exemplar | CMT-Q170/C236 | |
| Processus Ratio | CPU | Intel®6~9th Generatio CoreTMDesktop CPU |
| TDP | 65W | |
| Socket | LGA1151 | |
| Chipset | Intel®Q170/C236 | |
| BIOS | AMI 128 Mbit SPI | |
| Memoria | Socket | 2 * SO-DIMM Slote, Dual Channel DDR4 usque ad 2666MHz |
| capacitas | 32GB, Single Max. 16GB | |
| Graphics | Controller | Intel®HD Graphics530/Intel®UHD Graphics 630 (dependens CPU) |
| Ethernet | Controller | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Expansion I / O * | Plu | 1 * Plu x16 gen3, bifurcatabilis 2 x8 . 2* Plu x4 Gen3, bifurcatabilis 1 x4/2 x2/4 x1 1 * Plu x4 Gen3, bifurcatabilis 1 x4/2 x2/4 x1 (Libitum NVMe, Default NVMe) 1 * Plu x4 Gen3, bifurcatabilis 1 x4/2 x2/4 x1(Libitum 4 * SATA, Default 4 * SATA) 2 * Plu x1 Gen3 . |
| NVMe | 1 Portus (PCIe x4 Gen3+SATA Ill, Libitum 1 * Plu x4 Gen3, bifurcatabile 1 x4/2 x2/4 x1, Default NVMe) | |
| DIABOLUS | 4 Portus support SATA Ill 6.0Gb/s (Libitum 1 * Plu x4 Gen3, bifurcatabile 1 x4/2 x2/4 x1, Default 4 * SATA) | |
| USB3.0 | 6 Portus | |
| USB2.0 | 14 Portus | |
| Audio | 1 * HDA | |
| Ostendere | 2 * DDI 1 * eDP | |
| Vide | 6 * UART(COM1/2 9-Wire) | |
| GPIO | 16* TIBUL DIO . | |
| Other | 1 * SPI | |
| 1 * LPC | ||
| 1 * SMBUS | ||
| 1 * I2C | ||
| 1 * SYS FAN | ||
| 8 * USB GPIO Power On/Off | ||
| Internus I / O * | Memoria | 2 * DDR4 SO-DIMM Slote |
| B2B Connector | 3 * 220Pin COM-Express connector | |
| FLABELLUM | 1 * CPU FAN (4x1Pin, MX1.25) | |
| Potestas Supple | Type | ATX: Vin, VSB; AT: Vin |
| Supple intentione | Vin:12V VSB:5V | |
| OS Support | Windows | Windows 7/10 |
| Linux | Linux | |
| Watchdog | Output | Ratio Reddere |
| Intervallum | Programmable 1 ~ 255 sec | |
| Mechanica | Dimensiones | 146.8mm * 105mm |
| Environment | Operating Temperature | -20 ~ 60℃ |
| Repono Temperature | -40 ~ 80℃ | |
| Relativum Umor | 10 ad 95% RH. | |
| Exemplar | CMT-TGLU | |
| Processus Ratio | CPU | Intel®11thGeneratio CoreTMi3/i5/i7 Mobile CPU |
| TDP | 28W | |
| Chipset | SOC | |
| Memoria | Socket | 1 * DDR4 SO-DIMM Slot, usque ad 3200MHz |
| capacitas | Maximilianus. 32GB | |
| Ethernet | Controller | 1 * Intel®i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel®i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Expansion I / O * | Plu | 1 * Plu x4 Gen3, Bifurcatable to 1 x4/2 x2/4 x1 I * Plu x4 (ex CPU, solum auxilium SSD) 2 * Plu x1 Gen3 . I * Plu x1 (Libitum I * DIABOLUS) |
| NVMe | I Portus (Ex CPU, tantum auxilium SSD) | |
| DIABOLUS | 1 Portus subsidium SATA Ill 6.0Gb/s (Libitum 1 * Plu x1 Gen3) | |
| USB3.0 | 4 Portus | |
| USB2.0 | 10 Portus | |
| Audio | 1 * HDA | |
| Ostendere | 2 * DDI 1 * eDP | |
| Vide | 6 * UART (COM1/2 9-Wire) | |
| GPIO | 16* TIBUL DIO . | |
| Other | 1 * SPI | |
| 1 * LPC | ||
| 1 * SMBUS | ||
| 1 * I2C | ||
| 1 * SYS FAN | ||
| 8 * USB GPIO Power On/Off | ||
| Internus I / O * | Memoria | 1 * DDR4 SO-DIMM Slote |
| B2B Connector | 2 * 220Pin COM-Express connector | |
| FLABELLUM | 1 * CPU FAN (4x1Pin, MX1.25) | |
| Potestas Supple | Type | ATX: Vin, VSB; AT: Vin |
| Supple intentione | Vin:12V VSB:5V | |
| OS Support | Windows | Windows 10 |
| Linux | Linux | |
| Mechanica | Dimensiones | 110mm * 85mm |
| Environment | Operating Temperature | -20 ~ 60℃ |
| Repono Temperature | -40 ~ 80℃ | |
| Relativum Umor | 10 ad 95% RH. | |
CMT-Q170
CMT-TGLU
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