E7 Pro-Q170 vehiculum Road collaboration controller

Features:

Pentium 6th ad 9th Ge Core / Pentium / CPU Desktop CPU, TDP 65W, lga1700
Equipped cum Intel® Q170 chipset
II Intel Gigabit Ethernet interfaces
II DDR4 sic-Dimm foramina, supporting usque ad 64GB
IV DB9 Serial portus (com1 / II Support Rs232 / Rs422 / Rs485)
M.2 et 2.5-inch triplici ferreus coegi repono firmamentum
III Display Outputs VGA, DVI-D, DP, supporting usque ad 4k @ 60Hz resolutio
4g / 5G / WiFi / BT Wireless functionality Expansion Support
MXM, Adoor OMNIBUS Expansion Support
Libitum PCIE / PCI vexillum expansion socors firmamentum
DC18-60V Wide Voltage Input, Rated Power Options DC / DCCC / 1000W

Remote procuratio
Condition Cras
Remotis operatio et sustentationem
Tuto imperium

Product Description

Et APQ Industrial Product, E7 Pro Series Q170 Platform vehiculum-Road collaboration Controller, est embedded industriae PC disposito specifically pro vehiculum-via collaboration applications, optimum stabilitatem et compatibility. Hoc moderatoris subsidiis Intel® 6th ad 9th Gen Core / Pentium / CPUS CPUS cum LGA1700 Package et TDP de 65W. Intel® Q170 chipset, quod providet II Intel Gigabit Ethernet interfaces in summus celeritate, firmum network iunctio, occurrens in networking transmissione necessitatibus vehiculo-via cooperationem applications. Equipped II DDR4 ita, Dimm foramina, is sustinet usque ad 64GB de memoria, offering ampla memoria opibus ad magnum notitia processus et multitasking res. In terms of expandability, in E7 Pro serie Q170 Platform praebet opes de interfaces et expansion capabilities, inter IV DB9 Serial portus (Rs422 / II Support Rs232 / Rs422 / II Support) pro opportuno nexu ad variis cogitationes. Etiam sustinet M.2 et 2.5-inch coegi Bais, providente multiple repono options ad occursum notitia repono et tergum necessitates. Wireless Functionality Expansion Support for 4G / 5G / WiFi / BT ensures firmum wireless communicationis hospites. Et libitum PCIE / PCI vexillum expansion foramina ulterius augendae moderatoris expandability. Nam ostentationem, in E7 Pro serie Q170 Platform features III Display Outputs, inter VGA, DVI-D, et DP interfaces, supporting usque ad 4k @ 60Hz resolutio in manifesta, lenis visual experientia. Non utitur a DC18-60V wide voltage initus, cum rated potentia options de DC / DCCC / 1000w, catering ad variis potentia consummatio necessitates.

In summary, in APQ E7 Pro series Q170 platform vehiculum-via collaboration moderatoris, cum suis eximia perficientur, fortis stabilitatem, et otium in conventu, providet certamine, efficiens ad users in industriae automation, intelligentes in industria in industriae, et in intelligentes, intelligentes in Industration, et dolor urbe sectors. Eam ACTIS industries in Achieving Digital Transformation et Upgrading.

Introductio

Ipsum drawing

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Exemplar		E7 Pro
CPU	CPU	Pentium^®VI / VII / VIII / 9th generationem core / Pentium / CPU CPU
	TDP	65W
	PENICULUS	Lga1151
	Chipset	Q170
	Bios	Ami Uefi Bios (Support Watchdog Timer)
Memoria	PENICULUS	II * Non-ECC U-DIMM Slote, Dual Channel DDR4 ad 2133MHz
Memoria	MAG	64GB, Max. 32GB
Graphics	Moderator	Pentium^®HD Graphics
Ethernet	Moderator	I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps) I * Intel I219-LM / V GBE Lan Chip (10/100/1000 Mbps)
Repono	DIABOLUS	III SATA3.0, velox Release 2.5 "Ferreus Orbis BaiS (T≤7mm), Support Raid 0, I, V
Repono	M.2	I * M.2 Key-M (Pcie x4 Gen. III + Sata3.0, NVME / SATA SSD Auto Detect, 2242/2260/2280)
Expansion foramina	Pcie socors	①: II * PCIE X16 (x8 / x8) + II * PCI ②: II * PCIE X16 (x8 / x8) + I * Pcie x4 (x4) PS: ①, ② unum ex duobus, expansionem card longitudo ≤ 320mm, TDP ≤ 450w
	Adoor / MXC	I * Adoor Bus (libitum IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
	Mini PCIE	I * Mini PCIE (PCIE x1 Gen II + USB 2.0, cum I * Sim card)
	M.2	I * M.2 Key-B (Pcie x1 Gen II + USB3.0, cum I * Sim card, 3042/3052)
Ante I / O	Ethernet	II * RJ45
	USB	VI USB3.0 (Type-A, 5GBPS)
	Dispono	I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60Hz I * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60Hz I * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB) II * Rs232 (Com3 / IV, DB9 / M)
	Button	I * Power Puga pyga + Power ducitur I * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)
Tergo I / O	Antenna	VI * antennae foraminis
Internum I / O	USB	II * USB2.0 (laganum, internum I / o)
	Lcd	I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
	Tfront Panel	I * TF_Panel (III * USB 2.0 + Fapan, Wafer)
	Fronte Panel	I * fapan (PWR + + DUXERIT, Wafer)
	Speaker	I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (COM5 / VI, Wafer, 8x2Pin, Phd2.0)
	GPIO	I * 16bit GPio (Wafer)
	Lpc	I * LPC (Wafer)
	DIABOLUS	III SATA3.0 7P Connector
	Power	III * DIABOLUS potentia (SATA_PWR1 / II / III, Wafer)
	Sim	II * Nano Sim
	Fan	II * Sys Fan (Wafer)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	XVIII 60VDC, P = DC / DCCC / 1000W (Default 800W)
	Iungo	I * 3pin iungo, P = 10.16
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	VI / 7th Core ™: Fenestra 7/10/11 VIII / 9th Core ™: Windows 10/11
OS Support	Linux	Linux
Watchdog	Output	Ratio Reset
Watchdog	Intervallum	Programmable I ~ CCLV sec
Mechanica	Clausura	Radiator: Aluminium Alloy, Box: SGCC
	Dimensiones	363mm (L) * 270mm (W) 169mm (h)
	Pondus	Net: 10.48 kg Summa: 11.38 kg (includit packaging)
	Adscensio	Wall mounted, Desktop
Enormitas	Calor dissipatio ratio	Fatlless passive refrigerationem (CPU) II * 9cm PWM fan (internum)
	Operating temperatus	-20 ~ LX ℃ (Industrial SSD)
	Storage temperatus	-40 ~ LXXX ℃ (Industrial SSD)
	Relativus humiditas	X ad XC% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CC, CE / FCC, Rohs

E7 Pro-Q170_Specsheet_apq

E7 Pro-Q170_Specsheet_apq

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Summus celeritate Gigabit Ethernet

Industrial PC quia vehiculum-via

Intel Q170 chipset platform

Magna memoria capacity firmamentum

Vide portum connectivity

Display 4k Support

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Effective, incolumem et reliable. Nostrum apparatu polliceri ius solutio ad aliquem postulationem. Prodesse ex industria peritia et generate addidit valorem - quotidie.

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