E7 Pro Series Q170, Q670 Edge AI Platform
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Conditio magna
Operatio remota et sustentationem
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APQ E7 Pro Series Vires E7 Pro-Q670 et E7 Pro-Q170 rostra componit, solutiones provectae pro ore computandi et systematis viae collaborationis vehiculi praebens. E7 Pro-Q670 suggestum machinatum est ad extremum operandi applicationes computantes, processus Intel® LGA1700 12/13th generationis processus. Hoc suggestum est specimen ad algorithmorum tractandum complexum AI et magnas notitiarum volumina efficaciter expediendas, firmata validi evolutionis interfaces ut Plu, mini Plu, et M.2 foramina ad usum applicationis necessariorum. Ingenium suum inanis passivum refrigerandi consilium efficit quietam operationem et certas effectus per periodos extensos, idoneos faciens ad culturas computandas ore exigendo.
Ex altera parte, suggestum E7 Pro-Q170 specialiter destinatur ad cooperationem vehiculorum viarum, adhibendis Intel® LGA1511 VI ad IX processuum generationis iuxta Intel® Q170 corpulenti ut eximiam vim computativam praebeat pro processui real-time et decernendo. in modernis translationis systematibus. Cum suis facultatibus communicationis comprehensivis, inclusis interfaces et portubus retis, in pluribus altum celeritatem, E7 Pro-Q170 faciliorem reddit compagem inconsutilem cum amplis machinis. Accedit, eius facultas ampliandi functionem wireless, inclusam 4G/5G, WIFI, et Bluetooth, pro remota vigilantia et administratione permittit, augens efficientiam intelligentium administrationis negotiationis et applicationes autonomas incessus. Simul, E7 Pro Series suggestae versatilem et potentem fundamentum praebent pro amplo studiorum industriarum applicationibus, ostendens APQ munus innovationis et qualitatis in foro industrialis PC.
| Exemplar | E7 Pro | |
| CPU | CPU | Intel® 6/7/8/9th Generation Core / Pentium/ Celeron Desktop CPU |
| TDP | 65W | |
| Socket | LGA1151 | |
| Chipset | Q170 | |
| BIOS | AMI UEFI BIOS (Support Watchdog Timer) | |
| Memoria | Socket | 2 * Non-ECC U-DIMM Slote, Dual Channel DDR4 usque ad 2133MHz |
| Max capacitas | 64GB, Single Max. 32GB | |
| Graphics | Controller | Intel® HD Graphics |
| Ethernet | Controller | 1 * Intel i210-AT GbE LAN Chip (10/100/1000 Mbps)1 * Intel i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
| Repono | DIABOLUS | 3 * 2.5" SATA, Velox emissio sinus orbis ferreus (T≤7mm) ), Suscipe RADIX 0, 1, 5 |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
| Expansion justo | Plu Slote | Support Plu moduli card(1* Plu x 16+1* Plu x4/1* Plu x16+3*PCI/2* Plu x8+2*PCI)PS: Expansion Card longitudinem limited 320mm, TDP limitata 450W |
| aDoor/MXM | 2* APQ MXM /aDoor Bus (Libitum MXM 4 * LAN/4 * POE/6 * COM/16 * GPIO card expansion) | |
| Mini Plu | 1 * Mini Plu (PCIe2.0 x1 + USB 2.0, cum 1* Nano Sim Card socors) | |
| M.2 | 1 * M.2 Key-B (PCIe2.0 x1 + USB3.0, with 1 * SIM Card, 3042/3052 ) | |
| Ante I / O * | Ethernet | 2 * RJ45 |
| USB | 6 * USB3.0 (Type-A, 5Gbps) | |
| Ostendere | 1 * DVI-D: max solutione usque ad annum 1920*1200 @ 60Hz1 * VGA (DB15/F): vulgare solutionis usque ad 1920*1200 @ 60Hz 1 * DP: max resolutio ad 4096*2160 @ 60Hz | |
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
| Vide | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch)2 * RS232 (COM3/4, DB9/M) | |
| Button | I * Power Puga pyga + Power LEDI * Ratio Reddere Puga pyga (deprime 0,2 ad 1s ut sileo et tenere usque ad 3s patet CMOS) | |
| Tergo I / O * | Antenna | 6* Antennae foramen |
| Internus I / O * | USB | 2 * USB2.0 (laganum, Internum I/O) |
| LCD | 1 * LVDS (laganum) : vulgare solutionis usque ad 1920*1200 @ 60Hz | |
| TFront Panel | 1 * TFPanel (3* USB 2.0 + FPANEL, laganum) | |
| Front Panel | 1 * Front Panel (laganum) | |
| Orator | 1 * Orator (2-W (per alveum)/8-Ω Loads, laganum) | |
| Vide | 2 * RS232 (COM5/6, laganum, 8x2pin, PHD2.0) | |
| GPIO | 1* 16bit GPIO (laganum); | |
| LPC | 1 * LPC (laganum) ; | |
| DIABOLUS | 3 * SATA3.0 7P Connector | |
| SATA Power | 3 * SATA Power (SATA_PWR1/2/3, laganum) | |
| SIM | 2 * Nano SIM | |
| FLABELLUM | 2* SYS FLABELLUM (laganum) ; | |
| Potestas Supple | Type | DC, AT/ATX |
| Potentia Input Voltage | 18~62VDC， P=600/800/1000W | |
| Connector | 1 * 3Pin Connector, P=10.16 | |
| RTC Pugna | CR2032 Coin Cell | |
| OS Support | Windows | 6/7th Core™: Windows 7/10/118/9th Core™: Windows 10/11 |
| Linux | Linux | |
| Watchdog | Output | Ratio Reddere |
| Intervallum | Programmable 1 ~ 255 sec | |
| Mechanica | Claude Material | Radiator: Aluminium, Box: SGCC |
| Dimensiones | 363mm(L) * 270mm(W) * 169mm(H) | |
| Pondus | Net: 10.48 kg, Summa: 11.38 kg (Include packaging) | |
| Adscendens | VESA, Wallmount, Desk adscendens | |
| Environment | Calor dissipatio Ratio | Fanless (CPU)2*9cm PWM FLABELLUM (Internum) |
| Operating Temperature | -20~ 60℃ (SSD or M.2 at) | |
| Repono Temperature | -40~80℃ | |
| Relativum Umor | 5 ad 95% RH. | |
| Vibratio Per Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis) | |
| Inpulsa Per Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms) | |
| Certification | CCC, CE/FCC, RoHS | |
| Exemplar | E7 Pro | |
| CPU | CPU | Intel® 12th/13th Gen Core/Pentium/Celeron desktop processor |
| TDP | 65W | |
| Socket | LGA1700 | |
| Chipset | Q670 | |
| BIOS | AMI 256 Mbit SPI | |
| Memoria | Socket | 2 * Non-ECC SO-DIMM Slote, Dual Channel DDR4 usque ad 3200MHz |
| Max capacitas | 64GB, Single Max. 32GB | |
| Graphics | Controller | Intel® UHD Graphics |
| Ethernet | Controller | 1 * Intel i219-LM 1GbE LAN Chip (LAN1, 10/100/1000 Mbps, RJ45)1 * Intel i225-V 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps, RJ45) |
| Repono | DIABOLUS | 3 * SATA3.0, Velox emissio sinus orbis rigidi (T≤7mm), Support RAD 0, 1, 5 |
| M.2 | 1 * M.2 Key-M (PCIe x4 Gen 4 + SATA3.0, NVMe/SATA SSD Auto Detect, 2242/2260/2280) | |
| Expansion justo | Plu Slote | Support Plu moduli card(1* Plu x 16+1* Plu x4/1* Plu x16+3*PCI/2* Plu x8+2*PCI)PS: Expansion Card longitudinem limited 320mm, TDP limitata 450W |
| aDoor | aDoor1 for expansion serial function(ex:COM/CAN)aDoor2 ad expansionem APQ aDoor expansion moduli AR series | |
| Mini Plu | 1 * Mini PCI-E Slote (PCIe x1+USB, Wifi/3G/4G fultus, cum 1 * Nano Sim Card Slote)1 * Mini PCI-E Slote (PCIe x1+USB, Wifi/3G/4G fultus, cum 1 * Nano Sim Card Slote) | |
| M.2 | 1 * M.2 Clavis-E socors (PCIe+USB, Wifi+BT,2230) | |
| Ante I / O * | Ethernet | 2 * RJ45 |
| USB | 2 * USB3.2 Gen 2x1 (Type-A, 10Gbps)6 * USB3.2 Gen 1x1 (Type-A, 5Gbps) | |
| Ostendere | 1 * HDMI1.4b: vulgare solutionis usque ad 4096*2160@30Hz1 * DP1.4a: resolutio max usque ad 4096*2160@60Hz | |
| Audio | Realtek ALC269Q-VB6 5.1 Channel HDA Codec1 * Line-Ot + MIC 3.5mm Jack | |
| Vide | 2 * RS232/485/422 (COM1/2, DB9/M, Full Lanes, BIOS Switch)2 * RS232 (COM3/4, DB9/M, Full Lanes) | |
| Button | I * Puga pyga Power / LED1 * AT/ATX Button 1 * OS Button Recipe I * Ratio Reddere Puga pyga | |
| Tergo I / O * | Antenna | 6* Antennae foramen |
| Internus I / O * | USB | 6 * USB2.0 (laganum, Internum I/O) |
| LCD | 1 * LVDS (laganum): LVDS Resolutio usque ad 1920*1200@60Hz . | |
| Front Panel | 1 * FPanel (FPANEL, PWR+RST+LED, laganum, 5 x 2pin, P=2.0) | |
| Audio | 1 * Audio (Header, 5x2pin, 2.54mm)1 * Orator (2W 8Ω, laganum, 4x1pin, PH2.0) | |
| Vide | 2 * RS232 (COM5/6, laganum, 8x2pin, PHD2.0) | |
| GPIO | 1*16 frena DIO (8xDI et 8xDO, laganum, 10x2pin, PHD2.0). | |
| LPC | 1 * LPC (laganum, 8x2Pin, PHD2.0) | |
| DIABOLUS | 3 * SATA3.0 7P Connector, usque ad 600MB/s | |
| SATA Power | 3 * SATA Power (laganum, 4x1Pin, PH2.0) | |
| SIM | 2 * Nano SIM | |
| FLABELLUM | 2 * SYS FAN (4x1Pin, KF2510-4A) | |
| Potestas Supple | Type | DC, AT/ATX |
| Potentia Input Voltage | 18~62VDC，P=600/800/1000W | |
| Connector | 1 * 3Pin Connector, P=10.16 | |
| RTC Pugna | CR2032 Coin Cell | |
| OS Support | Windows | Windows 10/11 |
| Linux | Linux | |
| Watchdog | Output | Ratio Reddere |
| Intervallum | Programmable 1 ~ 255 sec | |
| Mechanica | Claude Material | Radiator: Aluminium, Box: SGCC |
| Dimensiones | 363mm(L) * 270mm(W) * 169mm(H) | |
| Pondus | Net: 10.48 kg, Summa: 11.38 kg (Include packaging) | |
| Adscendens | VESA, Wallmount, Desk adscendens | |
| Environment | Calor dissipatio Ratio | Fanless (CPU)2*9cm PWM FLABELLUM (Internum) |
| Operating Temperature | -20~ 60℃ (SSD or M.2 at) | |
| Repono Temperature | -40~80℃ | |
| Relativum Umor | 5 ad 95% RH. | |
| Vibratio Per Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis) | |
| Inpulsa Per Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms) | |
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