E7 Pro series Q170, Q670 Edge AI Platform

Features:

Intel ® lga1511 6 ad 9th processors, supporting core ™ ™ I3 / I5 / I7, Pentium ® et Celeron ® series TDP = 65W
Intel ® Q170 chipset
II Intel Gigabit Network interfaces
II DDR4 sic-Dimm foramina, supporting usque ad 64g
IV DB9 Serial portus (com1 / II subsidiis Rs232 / Rs422 / Rs485)
M. II et 2.5-inch tres dura coegi repono firmamentum
III, modo ostentationem output VGA, DVI-D, DP, usque ad Support 4k @ 60Hz Resolving Power
4g / 5G / WiFi / BT Wireless munus extensio firmamentum
MXC et Adoor Module extensio Support
Libitum PCIE / PCI vexillum expansion socors firmamentum
DC18-62V wide voltage input, rated potentia libitum DC / DCCC / 1000W

Remote procuratio
Condition Cras
Remotis operatio et sustentationem
Tuto imperium

Product Description

Et APQ E7 Pro Series combines vires de E7 Pro-Q670 et E7 Pro-Q170 Platforms, offering provectus Solutions pro Edge Computing et Vehiculum-Road collaboration systems. In E7 Pro-Q670 Platform est Engineered pro High-perficientur Edge Computing Applications, featuring Intel® lga1700 12th / 13 Generatio processors. Haec suggestus est specimen pertractatio complexu AI algorithms et processui magna volumina ex notitia efficiently, sustinuit a robust paro of expansion interfaces ut PCIE, Mini Application et M.2. Fatly passiva frigus consilio ensures quietam operationem et reliable perficientur extenditur periods, faciens idoneam postulantes ora computandi environments.

In alia manu, in E7 Pro-Q170 Platform est specie disposito vehiculum-via collaboration, utilitas Intel® lga1511 6 usque 9th generationem processiones latere in intel® Q170 chipsses ad offer consilium-faciens in modern translationem ratio processus et consilium-faciens in modern translationem ratio processus et arbitrium-faciens in modern translationem ratio processus et arbitrium-faciens in modern translationem ratio. Cum suis comprehensive communicationis capabilities, comprehendo plures summus celeritate network interfaces et Vide portus, in E7 pro-Q170 facilitates seamless connectivity cum amplis cogitationes. Praeterea, ad facultatem ad expand wireless functionality, inter 4g / 5g, WiFi, et Bluetooth, concedit pro remotis vigilantia et administratione, enhancendo in efficientiam et negotiationis administratione et autonomum driving disciplinas. Simul, in E7 Pro Series Platforms providere a versatile et potens fundamenta ad latum ordinata industrialis applications, demonstrat APQ scriptor commitment ad innovation et qualis in Industrial PC forum.

Introductio

Ipsum drawing

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Q170

Q670

Q170

Exemplar		E7 Pro
CPU	CPU	Intel® VI / VII / VIII / 9th Generation Core / Pentium / CPU CPU Pentium Desktop
	TDP	65W
	PENICULUS	Lga1151
	Chipset	Q170
	Bios	Ami Uefi Bios (Support Watchdog Timer)
Memoria	PENICULUS	II * Non-ECC U-DIMM Slote, Dual Channel DDR4 ad 2133MHz
Memoria	MAG	64GB, Max. 32GB
Graphics	Moderator	Intel® HD Graphics
Ethernet	Moderator	I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps)I * Intel I219-LM / V GBE Lan Chip (10/100/1000 Mbps)
Repono	DIABOLUS	III * 2.5 "DIABOLUS, Velox Release Ferreus Orbis BaiS (T≤7mm)), Support Raid 0, I, V
Repono	M.2	I * M.2 Key-M (Pcie x4 Gen. III + Sata3.0, NVME / SATA SSD Auto Detect, 2242/2260/2280)
Expansion foramina	Pcie socors	Support PCIE Module Card (I * PCIE x XVI + I * PCIE x4 / I * PCIE X16 + III * PCI / II * PCIE X8 + II * PCI)PS: Expansion Card Longitudo Press 320mm, TDP limited 450W
	Adoor / MXC	II * APQ MXM / Adoor bus (libitum Mxm IV * LAN / IV * POE / VI * / XVI * GPio Expansion Card)
	Mini PCIE	I * Mini PCIE (Pcie2.0 x1 + USB 2.0, cum I * Nano Sim card socors)
	M.2	I * M.2 Key-B (Pcie2.0 x1 + USB3.0, cum I * Sim card, 3042/3052)
Ante I / O	Ethernet	II * RJ45
	USB	VI USB3.0 (Type-A, 5GBPS)
	Dispono	I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60HzI * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60Hz I * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB)II * Rs232 (Com3 / IV, DB9 / M)
	Button	I * Power Puga pyga + Power duciturI * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)
Tergo I / O	Antenna	VI * antennae foraminis
Internum I / O	USB	II * USB2.0 (laganum, internum I / o)
	Lcd	I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
	Tfront Panel	I * tfpanel (III * USB 2.0 + fpan, lagana)
	Fronte Panel	I * Front Panel (Wafer)
	Speaker	I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (COM5 / VI, Wafer, 8x2Pin, Phd2.0)
	GPIO	I * 16bit GPio (Wafer)
	Lpc	I * LPC (Wafer)
	DIABOLUS	III SATA3.0 7P Connector
	Power	III * DIABOLUS potentia (SATA_PWR1 / II / III, Wafer)
	Sim	II * Nano Sim
	Fan	II * Sys Fan (Wafer)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	XVIII ~ 62VDC, P = DC / DCCC / 1000W
	Iungo	I * 3pin iungo, P = 10.16
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	VI / 7th Core ™: Fenestra 7/10/11VIII / 9th Core ™: Windows 10/11
OS Support	Linux	Linux
Watchdog	Output	Ratio Reset
Watchdog	Intervallum	Programmable I ~ CCLV sec
Mechanica	Clausura	Radiator: Aluminium, Box: SGCC
	Dimensiones	363mm (L) * 270mm (W) 169mm (h)
	Pondus	Net: 10.48 kg, Summa: 11.38 kg (includit packaging)
	Adscensio	Vesa, Wallmount, desk ascendens
Enormitas	Calor dissipatio ratio	Fatless (CPU)II * 9cm PWM fan (internum)
	Operating temperatus	-20 ~ LX ℃ (SSD et M.2 PRAECLUSIO)
	Storage temperatus	-40 ~ LXXX ℃
	Relativus humiditas	V ad XCV% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CC, CE / FCC, Rohs

Q670

Exemplar		E7 Pro
CPU	CPU	Intel® 12th / 13th Gen Core / Pentium / Pentium Desktop Processor
	TDP	65W
	PENICULUS	Lga1700
	Chipset	Q670
	Bios	Amici CCLVI MBit spi
Memoria	PENICULUS	II * Non-ECC ita, Dimm socors, Dual Channel DDR4 usque ad 3200MHz
Memoria	MAG	64GB, Max. 32GB
Graphics	Moderator	Intel® UHD Graphics
Ethernet	Moderator	I * Intel I219-LM 1GBE Lan Chip (LAN1, 10/100/1000 Mbps, RJ45)I * Intel I225-V 2.5GBE Lan Chip (LAN2, 10/100/1000/2500 Mbps, RJ45)
Repono	DIABOLUS	III SATA3.0, velox Release Ferreus Orbis BaiS (T≤7mm), Support Raid 0, I, V
Repono	M.2	I * M.2 Key-M (Pcie x4 Gen. IV + Sata3.0, NVME / SATA SSD Auto Detect, 2242/2260/2280)
Expansion foramina	Pcie socors	Support PCIE Module Card (I * PCIE x XVI + I * PCIE x4 / I * PCIE X16 + III * PCI / II * PCIE X8 + II * PCI)PS: Expansion Card Longitudo Press 320mm, TDP limited 450W
	adoor	Adoor1 ad expansion Serial (ex: Com / Can)Adoor2 ad expansion Apq Adoor Expansion Module ar series
	Mini PCIE	I * Mini PCI-E Slote (PCIE X1 + USB, WiFi / 3G / 4G sustinetur, cum I * Nano Sim card socors)I * Mini PCI-E Slote (PCIE X1 + USB, WiFi / 3G / 4G sustinetur, cum I * Nano Sim card socors)
	M.2	I * M.2 Key-E socors (PCIE + USB, WiFi + BT, MMCCXXX)
Ante I / O	Ethernet	II * RJ45
	USB	II * USB3.2 Gen 2x1 (Type-A, 10Gbps)VI * USB3.2 Gen 1X1 (Type-A, 5GBPS)
	Dispono	I * HDMI1.4B: Max resolutio usque ad (IV) XCVI * MMCLX @ 30HzI * dp1.4a: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	Realtek Alc269Q VB6 5.1 alveo HDA CodecI * Line-Out Mich 3.5MM Jack
	Serialis	II * Rs232 / CDLXXXV / CDXXII (Com1 / II, DB9 / M, Lotes, Bios SWITCH PB)II * Rs232 (Com3 / IV, DB9 / M, plena vicis)
	Button	I * Power Button / DUXERITI * AT / ATX button I * Os Recover button I * Ratio Reset button
Tergo I / O	Antenna	VI * antennae foraminis
Internum I / O	USB	VI * USB2.0 (laganum, internum I / o)
	Lcd	I * LVDs (Wafer): LVDS resolutio usque ad MCMXX * MCC @ 60Hz
	Fronte Panel	I * fapan (fpan, pwr + + DUXERIT, lagae, V x 2pin, p = 2.0)
	Audio	I * Audio (header, 5x2pin, 2.54mm)I * speaker (2W 8ω, laganum, 4x1Pin, Ph22.0)
	Serialis	II * Rs232 (COM5 / VI, Wafer, 8x2Pin, Phd2.0)
	GPIO	I * XVI bits dio (8xdi et 8xdo, laganum, 10x2pin, phd2.0)
	Lpc	I * LPC (Wafer, 8x2Pin, Phd2.0)
	DIABOLUS	III * SATA3.0 7P Connector, usque ad 600MB / S
	Power	III * DIABOLUS Power (Wafer, 4x1Pin, Ph22pin)
	Sim	II * Nano Sim
	Fan	II * sys fan (4x1pin, Kf2510-4a)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	XVIII ~ 62VDC, P = DC / DCCC / 1000W
	Iungo	I * 3pin iungo, P = 10.16
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	10/11 Fenestra
OS Support	Linux	Linux
Watchdog	Output	Ratio Reset
Watchdog	Intervallum	Programmable I ~ CCLV sec
Mechanica	Clausura	Radiator: Aluminium, Box: SGCC
	Dimensiones	363mm (L) * 270mm (W) 169mm (h)
	Pondus	Net: 10.48 kg, Summa: 11.38 kg (includit packaging)
	Adscensio	Vesa, Wallmount, desk ascendens
Enormitas	Calor dissipatio ratio	Fatless (CPU)II * 9cm PWM fan (internum)
	Operating temperatus	-20 ~ LX ℃ (SSD et M.2 PRAECLUSIO)
	Storage temperatus	-40 ~ LXXX ℃
	Relativus humiditas	V ad XCV% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)

E770_Specsheet_apq-Q170_Specsheet_apq

E770_Specsheet_apq-Q170_Specsheet_apq

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E7PRO Q670_Specsheet_apq

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Advanced Connectivity

Summus perficientur computing

High resolutio ostentationem output

Intel LGA1700 Support

Multi-repono optiones

Wireless expansion capabilities

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Effective, incolumem et reliable. Nostrum apparatu polliceri ius solutio ad aliquem postulationem. Prodesse ex industria peritia et generate addidit valorem - quotidie.

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