E7L embedded Industrial PC

Features:

  • Pentium 6th ad 9th Core Intel® / Pentium / CPU Desktop CPU, TDP 35W, LGA1151
  • Equipped cum Intel® Q170 chipset
  • II Intel Gigabit Ethernet interfaces
  • II DDR4 sic-Dimm foramina, supporting usque ad 64GB
  • IV DB9 Serial portus (com1 / II Support Rs232 / Rs422 / Rs485)
  • IV Display Outputs: VGA, DVI-D, DP et internum LVDs / EDP, supporting usque ad 4k @ 60Hz resolution
  • Sustinet 4G / 5G / WiFi / BT Wireless Functionality Expansion
  • Sustinet MXC et Adoor OMNIBUS Expansion
  • Libitum PCIE / PCI vexillum expansion slots firmamentum
  • IX ~ 36V DC potentia Supple (libitum 12V)
  • Fatless passive refrigerationem

 


  • Remote procuratio

    Remote procuratio

  • Condition Cras

    Condition Cras

  • Remotis operatio et sustentationem

    Remotis operatio et sustentationem

  • Tuto imperium

    Tuto imperium

Product Description

Et APQ E7L series embedded Industrial PCs, comprehendo in H610, Q670 et Q170 Platforms, stare in fronte de industrialis automation et ora computing solutions. Dailored enim Intel® XII / 13th Ge Core / Pentium / CPUS CPUS, H610 et Q670 Platforms offerre mixtio et potens perficientur et efficientiam, idoneam ad wide de industrialis occasus et ordinata industrialis. Haec platforms facilitate summus celeritate network iunctio cum Dual Intel Gigabit interfaces et suscipio princeps-definitione ostentationem outputs usque ad 4k @ 60Hz, ensuring vivum visuals per varia applications. Cum eorum expansive USB, Vide et PCIE expansion foramina, latere vanae passive refrigerationem consilium, quod praestet reliability, tacet operationem et adaptability ad specifica applicationem.

In alia manu, in Q170 Platform est optimized ad Intel® 6th ad 9th Gen processors, tradens eximia computational potentia et stabilitatem ad notitia-intensive negotium in vehiculo-via collaboration systems et alia industrialis applications. Eam features robust communicationis capabilities, ampla repono, et expandable memoria options ad tractamus complexiones computations et data processus dispensando. Praeterea, in seriem offert wireless functionality expansion, comprehendo 4g / 5g, WiFi et Bluetooth, enhancing connectivity et remotis procuratio elit. Per omnes tabulatis adlevatae, E7L series eminentiam APQ scriptor dedication ad innovation, offering altus-perficientur, customizable solutions ad postulans requisitis industriae automation et ora computing elit.

Introductio

Ipsum drawing

File download

H81
H610
Q170
Q670
H81

Exemplar

E7L

E7dl

CPU

CPU Pentium®IV / 5th Generationem Core / Pentium / CPU CPU Desktop
TDP 35W
PENICULUS Lga1150

Chipset

Chipset Pentium®H81

Bios

Bios Ami Uefi Bios (Support Watchdog Timer)

Memoria

PENICULUS II * Non-ECC ita, Dimm socors, Dual Channel DDR3 ad 1600MHz
MAG 16GB, una max. 8GB

Graphics

Moderator Pentium®HD Graphics

Ethernet

Moderator I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps)

I * Intel I218-LM / V GBE Lan Chip (10/100/1000 Mbps)

Repono

DIABOLUS I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm)
I * Sata2.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)
M.2 I * M.2 Key-M (Sata3.0, MMCCLXXX)

Expansin foramina

PCIE / PCI N / est ①: I * PCIE X16 (X16)

②: II * PCI

PS ①, ①one ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W

MXC / Adoor I * APQ MXM (libitum Mxm IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)

I * Adoor expansion socors

Mini PCIE I * Mini PCIE (Pcie2.0 x1 (Share PCIE Signum cum MXM, libitum) + USB 2.0, cum I * Nano Sim Card)

Ante I / O

Ethernet II * RJ45
USB II * USB3.0 (Type-A, 5GBPS)

IV * USB2.0 (type-a)

Dispono I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60Hz

I * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60Hz

I * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz

Audio II * 3.5mm Jack (line-de + microform)
Serialis II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB)

II * Rs232 (Com3 / IV, DB9 / M)

Button I * Power Puga pyga + Power ducitur

I * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)

Tergo I / O

Antenna IV * antennae foraminis
Sim I * Nano Sim card socors (sim1)

Internum I / O

USB II USB2.0 (Wafer)
Lcd I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
Tfront Panel I * TF_Panel (III * USB 2.0 + Fapan, Wafer)
Fronte Panel I * Front Panel (PWR + + DUXERIT, Wafer)
Speaker I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
Serialis II * Rs232 (Com5 / VI, Wafer)
GPIO I * XVI bits dio (8xdi et 8xdo, laganum)
Lpc I * LPC (Wafer)
DIABOLUS II SATA 7P Connector
Power II * DIABOLUS potentia (SATA_PWR1 / II, Wafer)
Fan I * CPU fan (Wafer)
II * Sys Fan (Wafer)

POPULUM

Genus DC, ad / ATX
Power initus intentione IX ~ 36VDC, P≤240W
Iungo I * 4pin iungo, P = 5.00 / 5.08
RTC altilium CR2032 Coin Cell

OS Support

Fenestras 7/10/11 Fenestra
Linux Linux

Watchdog

Output Ratio Reset
Intervallum Programmable per software ex I ad CCLV sec

Mechanica

Clausura Radiator: Aluminium Alloy, Box: SGCC
Dimensiones 268mm (L) * 194.2mm (W) * 67.7mm (h) 268mm (L) * 194.2mm (W) * 118.5mm (h)
Pondus Net: 4.5 kg

Total: VI kg (includit packaging)

Net: 4.7kg

Summa: 6.2 kg (includit packaging)

Adscensio Vesa, murum mounted, desktop

Enormitas

Calor dissipatio ratio Fatless passive refrigerationem
Operating temperatus -20 ~ LX ℃ (Industrial SSD)
Storage temperatus -40 ~ LXXX ℃ (Industrial SSD)
Relativus humiditas X ad XC% RH (non-condensing)
Vibrationis in operationem Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
Offensio per operationem Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
Certification CC, CE / FCC, Rohs
H610

Exemplar

E7L

E7dl

CPU

CPU Intel® 12/13th generation Core / Pentium / CPU CPU
TDP 35W
PENICULUS Lga1700
Chipset H610
Bios Amici CCLVI MBit spi

Memoria

PENICULUS II * Non-ECC ita, Dimm socors, Dual Channel DDR4 usque ad 3200MHz
MAG 64GB, Max. 32GB

Graphics

Moderator Pentium®UHD Graphics

Ethernet

Moderator I * Intel I219-LM / V 1Gbe Lan Chip (LAN1, 10/100/1000 Mbps)

I * Intel I225-V / LM 2.5GBE Lan Chip (LAN2, 10/100/1000/2500 Mbps)

Repono

DIABOLUS I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm)

I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)

M.2 I * M.2 Key-M (Sata3.0, MMCCLXXX)

Expansion foramina

Pcie socors N / est ①: I * PCIE X16 (X16)②: II * PCIPS: ①,②one ex duobus expansion card longitudo ≤ 185mm, TDP ≤ 130W
aOstium I * Adoor Bus (libitum IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
Mini PCIE I * Mini PCIE (Pcie3.0 X1 + USB 2.0, cum I * Nano Sim Card)

Ante I / O

Ethernet II * RJ45
USB II * USB3.2 Gen2x1 (Type-A, 10Gbps)

II * USB3.2 Gen1x1 (Type-A, 5GBPS)

II * USB2.0 (type-a)

Dispono I * HDMI1.4B: Max resolutio usque ad (IV) XCVI * MMCLX @ 30Hz

I * dp1.4a: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz

Audio II * 3.5mm Jack (line-de + microform)
Serialis II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB)

II * Rs232 (Com3 / IV, DB9 / M, plena vicis)

Button I * Power Puga pyga + Power ducitur

I * AT / ATX button

I * Os Recover button

I * Ratio Reset button

Tergo I / O

Antenna IV * antennae foraminis
Sim I * Nano Sim card socors (sim1)

Internum I / O

USB VI USB2.0 (Wafer)
Lcd I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
Fronte Panel I * fapan (PWR + + DUXERIT, Wafer)
Audio I * Audio (header)

I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)

Serialis II * Rs232 (Com5 / VI, Wafer)
GPIO I * XVI bits dio (8xdi et 8xdo, laganum)
Lpc I * LPC (Wafer)
DIABOLUS III Sata 7P Connector, usque ad 600MB / S
Power III * DIABOLUS Power (Wafer)
Fan I * CPU fan (Wafer)

II * sys fan (Kf2510-4a)

POPULUM

Genus DC, ad / ATX
Power initus intentione IX ~ 36VDC, P≤240W

XVIII ~ 60VDC, P≤400W

Iungo I * 4pin iungo, P = 5.00 / 5.08
RTC altilium CR2032 Coin Cell

OS Support

Fenestras 10/11 Fenestra
Linux Linux

Watchdog

Output Ratio Reset
Intervallum Programmable I ~ CCLV sec

Mechanica

Clausura Radiator: Aluminium Alloy, Box: SGCC
Dimensiones 268mm (L) * 194.2mm (W) * 67.7mm (h) 268mm (L) * 194.2mm (W) * 118.5mm (h)
Pondus Net: 4.5 kgTotal: VI kg (includit packaging) Net: 4.7kgSumma: 6.2 kg (includit packaging)
Adscensio Vesa, murum mounted, desktop

Enormitas

Calor dissipatio ratio Fatless passive refrigerationem
Operating temperatus -20 ~ LX ℃ (Industrial SSD)
Storage temperatus -40 ~ LXXX ℃ (Industrial SSD)
Relativus humiditas X ad XC% RH (non-condensing)
Vibrationis in operationem Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
Offensio per operationem Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
Certification CE / FCC, Rohs
Q170

Exemplar

E7L

E7dl

E7ql

CPU

CPU Pentium®VI / VII / VIII / 9th generationem core / Pentium / CPU CPU
TDP 35W
PENICULUS Lga1151

Chipset

Chipset Q170

Bios

Bios Ami Uefi Bios (Support Watchdog Timer)

Memoria

PENICULUS II * Non-ECC sic-Dimm socors, Dual Channel DDR4 ad 2133MHz
MAG 64GB, Max. 32GB

Graphics

Moderator Pentium®HD Graphics

Ethernet

Moderator I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps)

I * Intel I219-LM / V GBE Lan Chip (10/100/1000 Mbps)

Repono

DIABOLUS I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm)

I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)

Support Raid 0, I
M.2 I * M.2 Key-M (PCIE X4 Gen. III + Sata3.0, NVME / SATA SSD Auto Detect, MMCCLXXX)

Expansin foramina

PCIE / PCI N / est ①: I * PCIE X16 (X16) + I * PCIE x4 (x4)

②: I * PCIE X16 + I * PCI

③: II * PCI

PS: ① ①, ③ unum ex tribus, expansion card longitudinem ≤ 185mm, TDP ≤ 130W
①: II * PCIE X16 (x8 / x8) + II * PCI

②: I * PCIE X16 (X16) + I * PCIE X4 (x4)

PS ①, ② unum ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W

MXC / Adoor I * APQ MXM (libitum Mxm IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
Mini PCIE I * Mini PCIE (PCIE x1 Gen II + USB 2.0, cum I * Sim card)
M.2 I * M.2 Key-B (Pcie x1 Gen II + USB3.0, cum I * Sim card, MMMLII)

Ante I / O

Ethernet II * RJ45
USB VI USB3.0 (Type-A, 5GBPS)
Dispono I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60Hz

I * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60Hz

I * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
Audio II * 3.5mm Jack (line-de + microform)
Serialis II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB)

II * Rs232 (Com3 / IV, DB9 / M)
Button I * Power Puga pyga + Power ducitur

I * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)

Tergo I / O

Antenna IV * antennae foraminis
Sim II * Nano Sim card foramina

Internum I / O

USB II USB2.0 (Wafer)
Lcd I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
Tfront Panel I * TF_Panel (III * USB 2.0 + Fapan, Wafer)
Fronte Panel I * fapan (PWR + + DUXERIT, Wafer)
Speaker I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
Serialis II * Rs232 (Com5 / VI, Wafer)
GPIO I * XVI bits dio (8xdi et 8xdo, laganum)
Lpc I * LPC (Wafer)
DIABOLUS II SATA 7P Connector
Power II * DIABOLUS Power (Wafer)
Fan I * CPU fan (Wafer)

II * Sys Fan (Wafer)

POPULUM

Genus DC, ad / ATX
Power initus intentione IX ~ 36VDC, P≤240W
Iungo I * 4pin iungo, P = 5.00 / 5.08
RTC altilium CR2032 Coin Cell

OS Support

Fenestras VI / 7th Core ™: Fenestra 7/10/11

VIII / 9th Core ™: Windows 10/11
Linux Linux

Watchdog

Output Ratio Reset
Intervallum Programmable per software ex I ad CCLV sec

Mechanica

Clausura Radiator: Aluminium Alloy, Box: SGCC
Dimensiones 268mm (L) * 194.2mm (W) * 67.7mm (h) 268mm (L) * 194.2mm (W) * 118.5mm (h) 268mm (L) * 194.2mm (W) * 159.5mm (h)
Pondus Net: 4.5 kg

Total: VI kg (includit packaging)
Net: 4.7kg

Summa: 6.2 kg (includit packaging)
Net: 4.8 kg

Summa: 6.3 kg (includit packaging)
Adscensio Vesa, murum mounted, desktop

Enormitas

Calor dissipatio ratio Fatless passive refrigerationem
Operating temperatus -20 ~ LX ℃ (Industrial SSD)
Storage temperatus -40 ~ LXXX ℃ (Industrial SSD)
Relativus humiditas X ad XC% RH (non-condensing)
Vibrationis in operationem Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
Offensio per operationem Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
Certification CC, CE / FCC, Rohs
Q670

Exemplar

E7L

E7dl

E7ql

CPU

 

CPU

Pentium®XII / 13 Generatio Core / Pentium / CPU CPU

TDP

35W

PENICULUS

Lga1700

Chipset

Q670

Bios

Amici CCLVI MBit spi

Memoria

PENICULUS

II * Non-ECC ita, Dimm socors, Dual Channel DDR4 usque ad 3200MHz

MAG

64GB, Max. 32GB

Graphics

Moderator

Pentium®UHD Graphics

Ethernet

Moderator

I * Intel I219-LM 1GBE Lan Chip (LAN1, 10/100/1000 Mbps, RJ45)

I * Intel I225-V 2.5GBE Lan Chip (LAN2, 10/100/1000/2500 Mbps, RJ45)

Repono

DIABOLUS

I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm)

I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)

Support Raid 0, I

M.2

I * M.2 Key-M (PCIE X4 Gen. IV + Sata3.0, NVME / DIABOLUS SSD Auto Detect, MMCCLXXX)

Expansion foramina

Pcie socors

N / est

①: I * PCIE X16 (X16) + I * PCIE x4 (x4)

②: I * PCIE X16 + I * PCI

③: II * PCI

PS: ① ①, ③ unum ex tribus, expansion card longitudinem ≤ 185mm, TDP ≤ 130W

①: II * PCIE X16 (x8 / x8) + II * PCI

②: I * PCIE X16 (X16) + I * PCIE X4 (x4)

PS ①, ② unum ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W

adoor

I * Adoor Bus (libitum IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)

Mini PCIE

II * Mini PCIE (PCIE x1 Gen. III + USB 2.0, cum I * Sim card)

M.2

I * M.2 Key-E (PCIE X1 Gen. III + USB 2.0, MMCCXXX)

Ante I / O

Ethernet

II * RJ45

USB

II * USB3.2 Gen2x1 (Type-A, 10Gbps)

VI * USB3.2 Gen 1X1 (Type-A, 5GBPS)

Dispono

I * HDMI1.4B: Max resolutio usque ad (IV) XCVI * MMCLX @ 30Hz

I * dp1.4a: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz

Audio

II * 3.5mm Jack (line-de + microform)

Serialis

II * Rs232 / CDLXXXV / CDXXII (Com1 / II, DB9 / M, Lotes, Bios SWITCH PB)

II * Rs232 (Com3 / IV, DB9 / M, plena vicis)

Button

I * Power Puga pyga + Power ducitur

I * AT / ATX button

I * Os Recover button

I * Ratio Reset button

Tergo I / O

Antenna

IV * antennae foraminis

Sim

II * Nano Sim card foramina

Internum I / O

USB

VI USB2.0 (Wafer)

Lcd

I * LVDs (Wafer): LVDS resolutio usque ad MCMXX * MCC @ 60Hz

Fronte Panel

I * fapan (PWR + + DUXERIT, Wafer)

Audio

I * Audio (header)

I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)

Serialis

II * Rs232 (Com5 / VI, Wafer)

GPIO

I * XVI bits dio (8xdi et 8xdo, laganum)

Lpc

I * LPC (Wafer)

DIABOLUS

III Sata 7P Connector, usque ad 600MB / S

Power

III * DIABOLUS Power (Wafer)

Fan

 

 

I * CPU fan (Wafer)

II * sys fan (Kf2510-4a)

POPULUM

Genus

DC, ad / ATX

Power initus intentione

IX ~ 36VDC, P≤240W

XVIII ~ 60VDC, P≤400W

Iungo

I * 4pin iungo, P = 5.00 / 5.08

RTC altilium

CR2032 Coin Cell

OS Support

Fenestras

10/11 Fenestra

Linux

Linux

Watchdog

Output

Ratio Reset

Intervallum

Programmable I ~ CCLV sec

Mechanica

Clausura

Radiator: Aluminium Alloy, Box: SGCC

Dimensiones

268mm (L) * 194.2mm (W) * 67.7mm (h)

268mm (L) * 194.2mm (W) * 118.5mm (h)

268mm (L) * 194.2mm (W) * 159.5mm (h)

Pondus

Net: 4.5 kg

Total: VI kg (includit packaging)

Net: 4.7kg

Summa: 6.2 kg (includit packaging)

Net: 4.8 kg

Summa: 6.3 kg (includit packaging)

Adscensio

Vesa, murum mounted, desktop

Enormitas

Calor dissipatio ratio

Fatless passive refrigerationem

Operating temperatus

-20 ~ LX ℃ (Industrial SSD)

Storage temperatus

-40 ~ LXXX ℃ (Industrial SSD)

Relativus humiditas

X ad XC% RH (non-condensing)

Vibrationis in operationem

Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)

Offensio per operationem

Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)

Certification

CE / FCC, Rohs

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