E7S embedded Industrial PC

Features:

Supports Intel® 6th ad 9th Gen Core / Pentium / CPU Desktop CPU, TDP 65W, LGA1151
Equipped cum Intel® Q170 chipset
II Intel Gigabit Ethernet interfaces
II DDR4 sic-Dimm foramina, supporting usque ad 64GB
IV DB9 Serial portus (com1 / II Support Rs232 / Rs422 / Rs485)
IV Display Outputs: VGA, DVI-D, DP et internum LVDs / EDP, supporting usque ad 4k @ 60Hz resolution
Sustinet 4G / 5G / WiFi / BT Wireless Functionality Expansion
Sustinet MXC et Adoor OMNIBUS Expansion
Libitum PCIE / PCI vexillum expansion slots firmamentum
IX ~ 36V DC potentia Supple (libitum 12V)
PWM intelligentes fan active refrigerationem

Remote procuratio
Condition Cras
Remotis operatio et sustentationem
Tuto imperium

Product Description

Et APQ E7s series embedded Industrial PCs, circumdant H81, H610, et Q670 Platforms, sunt metus machinatorem ad Bolster Industrial et Edge Computing Applications. Haec series est disposito ad accommodare rigor exercitiis modern industriae environments, offering a range of processors de Intel 's 4 / 5th ad latest 12th / 13 Generationem Core, Pentium et CPUS. Et versatility E7s series patet in eius firmamentum pro late ordinata ostentationem magnitudinum, summus definitio resolions usque ad 4k @ 60hz, et robust connectivity et multiplici comprehendo portubus in comprehensive notitia communicationis et processui capability. Quisque platform in serie, a H81 scriptor reliable perficientur ad Q670 scriptor secans-ora dispensando potentia, instructa est extensive expansion foramina (PCIE, Mini Fan Refrigerant Systems, Suspendisse.

Et E7s series stat de adaptability et efficientiam, catering ad lata spectro de industrialis applications vndique a fabrica automation ad sophisticated ora computing opus. Et H610 et Q670 tabulatis adlevatae, in maxime, lumine ad seriem, commitment ad futuram-proofing industriae operationes cum suis firmamentum in summus celeritate network hospites et provectus outputs. Praeterea, in serie 'modularis philosophia concedit ad facile customization et scalability, addressing specifica operational opus cum options ad malam aut fansed refrigerationem consilia ad ponere ratio stabilitatem et reliability. Utrum deployed in vestibulum, remotis vigilantia, aut sicut computational backbone of automated systems, ad APQ E7s series embedded industriae PCs offerre a Cordis et Versatems ECOSSYNSMED.

Introductio

Ipsum drawing

File download

H81

Q170

H610

Q670

H81

Exemplar		E7s	E7ds
CPU	CPU	Pentium^®IV / 5th Generationem Core / Pentium / CPU CPU Desktop
	TDP	65W
	PENICULUS	Lga1150
Chipset	Chipset	Pentium^®H81
Bios	Bios	Ami Uefi Bios (Support Watchdog Timer)
Memoria	PENICULUS	II * Non-ECC ita, Dimm socors, Dual Channel DDR3 ad 1600MHz
	MAG	16GB, una max. 8GB
Graphics	Moderator	Pentium^®HD Graphics
Ethernet	Moderator	I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps)I * Intel I218-LM / V GBE Lan Chip (10/100/1000 Mbps)
Repono	DIABOLUS	I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm) I * Sata2.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)
	M.2	I * M.2 Key-M (Sata3.0, MMCCLXXX)
Expansin foramina	PCIE / PCI	N / est	①: I * PCIE X16 (X16)②: II * PCIPS ①, ①one ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W
	MXC / Adoor	I * APQ MXM / Adoor Bus (libitum Mxm IV * LAN / IV * POE / VI * / XVI * GPio Expansion Card)I * Adoor expansion socors
	Mini PCIE	I * Mini PCIE (Pcie2.0 x1 (Share PCIE Signum cum MXM, libitum) + USB 2.0, cum I * Nano Sim Card)
Ante I / O	Ethernet	II * RJ45
	USB	II * USB3.0 (Type-A, 5GBPS)IV * USB2.0 (type-a)
	Dispono	I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60HzI * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60HzI * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB)II * Rs232 (Com3 / IV, DB9 / M)
	Button	I * Power Puga pyga + Power duciturI * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)
Tergo I / O	Antenna	IV * antennae foraminis
	Sim	I * Nano Sim card socors (sim1)
Internum I / o	USB	II USB2.0 (Wafer)
	Lcd	I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
	Tfront Panel	I * TF _panel (III * USB 2.0 + Fapan, Wafer)
	Fronte Panel	I * Front Panel (Wafer)
	Speaker	I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (Com5 / VI, Wafer)
	GPIO	I * XVI bits dio (8xdi et 8xdo, lagana)
	Lpc	I * LPC (Wafer)
	DIABOLUS	II SATA 7P Connector
	Power	II * DIABOLUS potentia (SATA_PWR1 / II, Wafer)
	Fan	I * CPU fan (Wafer) II * Sys Fan (Wafer)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	IX ~ 36VDC, P≤240W
	Iungo	I * 4pin iungo, P = 5.00 / 5.08
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	7/10/11 Fenestra
	Linux	Linux
Watchdog	Output	Ratio Reset
	Intervallum	Programmable per software ex I ad CCLV sec
Mechanica	Clausura	Radiator: Aluminium Alloy, Box: SGCC
	Dimensiones	268mm (L) * 194.2mm (W) * 67.7mm (h)	268mm (L) * 194.2mm (W) * 118.5mm (h)
	Pondus	Net: 4.5 kgTotal: VI kg (includit packaging)	Net: 4.7kgSumma: 6.2 kg (includit packaging)
	Adscensio	Vesa, murum mounted, desktop
Enormitas	Calor dissipatio ratio	PWM Aeris Refrigerant
	Operating temperatus	-20 ~ LX ℃ (Industrial SSD)
	Storage temperatus	-40 ~ LXXX ℃ (Industrial SSD)
	Relativus humiditas	X ad XC% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CC, CE / FCC, Rohs

Q170

Exemplar		E7s	E7ds	E7qs
CPU	CPU	Pentium^®VI / VII / VIII / 9th generationem core / Pentium / CPU CPU
	TDP	65W
	PENICULUS	Lga1151
Chipset	Chipset	Q170
Bios	Bios	Ami Uefi Bios (Support Watchdog Timer)
Memoria	PENICULUS	II * Non-ECC sic-Dimm socors, Dual Channel DDR4 ad 2133MHz
	MAG	64GB, Max. 32GB
Graphics	Moderator	Pentium^®HD Graphics
Ethernet	Moderator	I * Intel I210, ad GBE Lan chip (10/100/1000 Mbps) I * Intel I219-LM / V GBE Lan Chip (10/100/1000 Mbps)
Repono	DIABOLUS	I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm) I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum) Support Raid 0, I
	M.2	I * M.2 Key-M (PCIE X4 Gen. III + Sata3.0, NVME / SATA SSD Auto Detect, MMCCLXXX)
Expansin foramina	PCIE / PCI	N / est	①: I * PCIE X16 (X16) + I * PCIE x4 (x4) ②: I * PCIE X16 + I * PCI ③: II * PCI PS: ① ①, ③ unum ex tribus, expansion card longitudinem ≤ 185mm, TDP ≤ 130W	①: II * PCIE X16 (x8 / x8) + II * PCI ②: I * PCIE X16 (X16) + I * PCIE X4 (x4) PS ①, ② unum ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W
	MXC / Adoor	I * APQ MXM (libitum Mxm IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
	Mini PCIE	I * Mini PCIE (PCIE x1 Gen II + USB 2.0, cum I * Sim card)
	M.2	I * M.2 Key-B (Pcie x1 Gen II + USB3.0, cum I * Sim card, MMMLII)
Ante I / O	Ethernet	II * RJ45
	USB	VI USB3.0 (Type-A, 5GBPS)
	Dispono	I * Dvi-D: Max resolutio usque ad MCMXX * MCC @ 60Hz I * VGA (DB15 / F): Max resolutio usque ad MCMXX * MCC @ 60Hz I * DP: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB) II * Rs232 (Com3 / IV, DB9 / M)
	Button	I * Power Puga pyga + Power ducitur I * Ratio reset puga (tenere usque ad 1s 0,2 ut sileo, et tenere descendit 3s ad purgare cmos)
Tergo I / O	Antenna	IV * antennae foraminis
	Sim	II * Nano Sim card foramina
Internum I / o	USB	II USB2.0 (Wafer)
	Lcd	I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
	Tfront Panel	I * TF_Panel (III * USB 2.0 + Fapan, Wafer)
	Fronte Panel	I * fapan (PWR + + DUXERIT, Wafer)
	Speaker	I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (Com5 / VI, Wafer)
	GPIO	I * XVI bits dio (8xdi et 8xdo, lagana)
	Lpc	I * LPC (Wafer)
	DIABOLUS	II SATA 7P Connector
	Power	II * DIABOLUS Power (Wafer)
	Fan	I * CPU fan (Wafer) II * Sys Fan (Wafer)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	IX ~ 36VDC, P≤240W
	Iungo	I * 4pin iungo, P = 5.00 / 5.08
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	VI / 7th Core ™: Fenestra 7/10/11 VIII / 9th Core ™: Windows 10/11
	Linux	Linux
Watchdog	Output	Ratio Reset
	Intervallum	Programmable per software ex I ad CCLV sec
Mechanica	Clausura	Radiator: Aluminium Alloy, Box: SGCC
	Dimensiones	268mm (L) * 194.2mm (W) * 67.7mm (h)	268mm (L) * 194.2mm (W) * 118.5mm (h)	268mm (L) * 194.2mm (W) * 159.5mm (h)
	Pondus	Net: 4.5 kg Total: VI kg (includit packaging)	Net: 4.7kg Summa: 6.2 kg (includit packaging)	Net: 4.8 kg Summa: 6.3 kg (includit packaging)
	Adscensio	Vesa, murum mounted, desktop
Enormitas	Calor dissipatio ratio	PWM Fan Refrigerant
	Operating temperatus	-20 ~ LX ℃ (Industrial SSD)
	Storage temperatus	-40 ~ LXXX ℃ (Industrial SSD)
	Relativus humiditas	X ad XC% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CC, CE / FCC, Rohs

H610

Exemplar		E7s	E7ds
CPU	CPU	Intel® 12/13th generation Core / Pentium / CPU CPU
	TDP	125W
	PENICULUS	Lga1700
	Chipset	H610
	Bios	Amici CCLVI MBit spi
Memoria	PENICULUS	II * Non-ECC ita, Dimm socors, Dual Channel DDR4 usque ad 3200MHz
	MAG	64GB, Max. 32GB
Graphics	Moderator	Pentium^®UHD Graphics
Ethernet	Moderator	I * Intel I219-LM / V 1Gbe Lan Chip (LAN1, 10/100/1000 Mbps) I * Intel I225-V / LM 2.5GBE Lan Chip (LAN2, 10/100/1000/2500 Mbps)
Repono	DIABOLUS	I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm) I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum)
	M.2	I * M.2 Key-M (Sata3.0, MMCCLXXX)
Expansion foramina	Pcie socors	N / est	①: I * PCIE X16 (X16)②: II * PCIPS: ①,②one ex duobus expansion card longitudo ≤ 185mm, TDP ≤ 130W
	aOstium	I * Adoor Bus (libitum IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
	Mini PCIE	I * Mini PCIE (Pcie3.0 X1 + USB 2.0, cum I * Nano Sim Card)
Ante I / O	Ethernet	II * RJ45
	USB	II * USB3.2 Gen2x1 (Type-A, 10Gbps) II * USB3.2 Gen1x1 (Type-A, 5GBPS) II * USB2.0 (type-a)
	Dispono	I * HDMI1.4B: Max resolutio usque ad (IV) XCVI * MMCLX @ 30Hz I * dp1.4a: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDXXII / CDLXXXV (com1 / II, DB9 / M, plena vicos, BIOF SWITCH PB) II * Rs232 (Com3 / IV, DB9 / M, plena vicis)
	Button	I * Power Puga pyga + Power ducitur I * AT / ATX button I * Os Recover button I * Ratio Reset button
Tergo I / O	Antenna	IV * antennae foraminis
	Sim	I * Nano Sim card socors (sim1)
Internum I / o	USB	VI USB2.0 (Wafer)
	Lcd	I * LVDS (Wafer): Max resolutio usque ad MCMXX * MCC @ 60Hz
	Fronte Panel	I * fapan (PWR + + DUXERIT, Wafer)
	Audio	I * Audio (header) I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (Com5 / VI, Wafer)
	GPIO	I * XVI bits dio (8xdi et 8xdo, lagana)
	Lpc	I * LPC (Wafer)
	DIABOLUS	III Sata 7P Connector, usque ad 600MB / S
	Power	III * DIABOLUS Power (Wafer)
	Fan	I * CPU fan (Wafer) II * sys fan (Kf2510-4a)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	IX ~ 36VDC, P≤240W XVIII ~ 60VDC, P≤400W
	Iungo	I * 4pin iungo, P = 5.00 / 5.08
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	10/11 Fenestra
	Linux	Linux
Watchdog	Output	Ratio Reset
	Intervallum	Programmable I ~ CCLV sec
Mechanica	Clausura	Radiator: Aluminium Alloy, Box: SGCC
	Dimensiones	268mm (L) * 194.2mm (W) * 67.7mm (h)	268mm (L) * 194.2mm (W) * 118.5mm (h)
	Pondus	Net: 4.5 kgTotal: VI kg (includit packaging)	Net: 4.7kgSumma: 6.2 kg (includit packaging)
	Adscensio	Vesa, murum mounted, desktop
Enormitas	Calor dissipatio ratio	PWM Fan Refrigerant
	Operating temperatus	-20 ~ LX ℃ (Industrial SSD)
	Storage temperatus	-40 ~ LXXX ℃ (Industrial SSD)
	Relativus humiditas	X ad XC% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CE / FCC, Rohs

Q670

Exemplar		E7s	E7ds	E7qs
CPU	CPU	Pentium^®XII / 13 Generatio Core / Pentium / CPU CPU
	TDP	65W
	PENICULUS	Lga1700
	Chipset	Q670
	Bios	Amici CCLVI MBit spi
Memoria	PENICULUS	II * Non-ECC ita, Dimm socors, Dual Channel DDR4 usque ad 3200MHz
	MAG	64GB, Max. 32GB
Graphics	Moderator	Pentium^®UHD Graphics
Ethernet	Moderator	I * Intel I219-LM 1GBE Lan Chip (LAN1, 10/100/1000 Mbps, RJ45) I * Intel I225-V 2.5GBE Lan Chip (LAN2, 10/100/1000/2500 Mbps, RJ45)
Repono	DIABOLUS	I * Sata3.0, velox Release 2.5 "Ferreus Orbis Bays (T≤7mm) I * Sata3.0, Internum 2.5 "Ferreus Orbis BaiS (T≤9mm, libitum) Support Raid 0, I, V
	M.2	I * M.2 Key-M (PCIE X4 Gen. IV + Sata3.0, NVME / DIABOLUS SSD Auto Detect, MMCCLXXX)
Expansion foramina	Pcie socors	N / est	①: I * PCIE X16 (X16) + I * PCIE x4 (x4) ②: I * PCIE X16 + I * PCI ③: II * PCI PS: ① ①, ③ unum ex tribus, expansion card longitudinem ≤ 185mm, TDP ≤ 130W	①: II * PCIE X16 (x8 / x8) + II * PCI ②: I * PCIE X16 (X16) + I * PCIE X4 (x4) PS ①, ② unum ex duobus expansion card longitudinem ≤ 185mm, TDP ≤ 130W
	adoor	I * Adoor Bus (libitum IV * LAN / IV * Poe / VI * com / XVI * GPio expansion Card)
	Mini PCIE	II * Mini PCIE (PCIE X1 Gen. III + USB 2.0, cum II * Sim card)
	M.2	I * M.2 Key-E (PCIE X1 Gen. III + USB 2.0, MMCCXXX)
Ante I / O	Ethernet	II * RJ45
	USB	II * USB3.2 Gen2x1 (Type-A, 10Gbps) VI * USB3.2 Gen 1X1 (Type-A, 5GBPS)
	Dispono	I * HDMI1.4B: Max resolutio usque ad (IV) XCVI * MMCLX @ 30Hz I * dp1.4a: Max resolutio usque ad (IV) XCVI * MMCLX @ 60Hz
	Audio	II * 3.5mm Jack (line-de + microform)
	Serialis	II * Rs232 / CDLXXXV / CDXXII (Com1 / II, DB9 / M, Lotes, Bios SWITCH PB) II * Rs232 (Com3 / IV, DB9 / M, plena vicis)
	Button	I * Power Puga pyga + Power ducitur I * AT / ATX button I * Os Recover button I * Ratio Reset button
Tergo I / O	Antenna	IV * antennae foraminis
	Sim	II * Nano Sim card foramina
Internum I / o	USB	VI USB2.0 (Wafer)
	Lcd	I * LVDs (Wafer): LVDS resolutio usque ad MCMXX * MCC @ 60Hz
	Fronte Panel	I * fapan (PWR + + DUXERIT, Wafer)
	Audio	I * Audio (header) I * speaker (II-w (per alveum) / VIII-ω onerat, lagae)
	Serialis	II * Rs232 (Com5 / VI, Wafer)
	GPIO	I * XVI bits dio (8xdi et 8xdo, lagana)
	Lpc	I * LPC (Wafer)
	DIABOLUS	III Sata 7P Connector, usque ad 600MB / S
	Power	III * DIABOLUS Power (Wafer)
	Fan	I * CPU fan (Wafer) II * sys fan (Kf2510-4a)
POPULUM	Genus	DC, ad / ATX
	Power initus intentione	IX ~ 36VDC, P≤240W XVIII ~ 60VDC, P≤400W
	Iungo	I * 4pin iungo, P = 5.00 / 5.08
	RTC altilium	CR2032 Coin Cell
OS Support	Fenestras	10/11 Fenestra
	Linux	Linux
Watchdog	Output	Ratio Reset
	Intervallum	Programmable I ~ CCLV sec
Mechanica	Clausura	Radiator: Aluminium Alloy, Box: SGCC
	Dimensiones	268mm (L) * 194.2mm (W) * 67.7mm (h)	268mm (L) * 194.2mm (W) * 118.5mm (h)	268mm (L) * 194.2mm (W) * 159.5mm (h)
	Pondus	Net: 4.5 kg Total: VI kg (includit packaging)	Net: 4.7kg Summa: 6.2 kg (includit packaging)	Net: 4.8 kg Summa: 6.3 kg (includit packaging)
	Adscensio	Vesa, murum mounted, desktop
Enormitas	Calor dissipatio ratio	PWM Fan Refrigerant
	Operating temperatus	-20 ~ LX ℃ (Industrial SSD)
	Storage temperatus	-40 ~ LXXX ℃ (Industrial SSD)
	Relativus humiditas	X ad XC% RH (non-condensing)
	Vibrationis in operationem	Cum SSD: IEC 60068-2-64 (3Glms @ V ~ 500Hz, Random, 1hr / axis)
	Offensio per operationem	Cum SSD: IEC 60068-2-27 (30g, dimidium Sin (11MS)
	Certification	CE / FCC, Rohs

E7S, H81_Specsheet_apq

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E7S, Q170_Specsheet_apq

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E7S, H610_Specsheet_apq

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E7S, Q670_Specsheet_apq

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Dual Intel Network interfaces

High resolution Outputs

Pentium XII / 13th CPU Support

Dives expansion interfaces

Smert Fan Refrigerant

Versatile Industrial Application

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