Mobile Platform

Mobile Platform

CPU:

  • Intel Atom Dynamic Platform
  • Mobile Intel Mobile Platform
  • Intel Desktop Desktop Platform
  • Intel Xeon Super Platform
  • Nvidia Jetson Platform
  • Rockchips Microelectronics

PCH:

  • B75
  • H81
  • Q170
  • H110
  • H310C
  • H470
  • Q470
  • H610
  • Q670

Screen Size:

  • 7"
  • 10.1"
  • 10.4"
  • 11.6"
  • 12.1"
  • 13.3"
  • 15"
  • 15.6"
  • 17"
  • 18.5"
  • 19"
  • 19.1"
  • 21.5"
  • 23.8"
  • 27"

Consilium:

  • 800*600
  • 1024*768
  • 1280*800
  • 1280*1024
  • 1366*768
  • 1440* 900
  • 1920*1080

Tactus screen:

  • Capacative / Resistente Tactus Screen
  • Resistentia Tactus Screen
  • Capacivam Tactus Screen
  • Vitro temperato

Product Features:

  • IP65
  • Nulla Fan
  • Plu
  • PCI
  • M.2
  • 5G
  • POE
  • Lux Source
  • GPIO
  • CAN
  • Dual Web Space
  • INCURSUS
  • E6 Embedded Industrial PC

    E6 Embedded Industrial PC

    Features:

    • Utitur Intel® 11th-U suggestu mobili CPU

    • Integrates dual Intel® Gigabit retis cards
    • Duo interfaces Veligera Transportis ostentationem
    • Dual ferreus coegi repositione subsidia, cum 2.5" ferreus coegi featuring a consilio viverra-e
    • ApQ aDoor Bus moduli expansion subsidia
    • Sustinet WiFi / 4G wireless expansion
    • Sustinet 12~28V dc amplitudine intentionis potestatis copia
    • Corpus compactum, consilium vanum, cum heatsink delapsum