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Tac-MMM
Remote procuratio
Condition Cras
Remotis operatio et sustentationem
Tuto imperium
Contact UsProduct Description
In era intelligentes vestibulum, robot moderatoris sunt clavis ad consequi efficiens et precise imperium. Nos launched potens et fideles robot moderatorem - Tac series, ad auxilium conatibus aedificare a competitive utilitatem in intelligentes vestibulum. Et Tac series instructa in Pentium 6th ad 11th generationem mobile / Desktop processors, occurrens variis perficientur elit. It has strong computing performance, flexible AI configuration, multi-channel high-speed communication, compact size, flexible installation, wide temperature working ability, and modular combination for easy maintenance and management. Palm amplitudo ultra parva volumine apta applications in angustum spatia, occurrens necessitatibus agvs, autonomae agit, et magis universa applications in mobile industriae agros ut portubus et parvum spatium scaenarum. At the same time, equipped with the QDevEyes Qiwei – (IPC) intelligent operation and maintenance platform that focuses on IPC application scenarios, the platform integrates rich functional applications in the four dimensions of regulatory control and maintenance, providing IPC with remote batch management, device monitoring, and remote operation and maintenance functions, meeting the operation and maintenance needs in different scenarios.
| Exemplar | Tac-MMM | ||||
| Processus ratio | Som | Nano | TX2 NX | Xaverius NX | Xaverius NX 16GB |
| AI Euismod | CDLXXII gflops | 1,33 TFLOPS | XXI tops | ||
| GPU | CXXVIII-Core NVIDIA Maxwell ™ Architecture GPU | CCLVI-Core NVIDIA Pascal ™ Architecture GPU | CCCLXXXIV-Core NVIDIA Volta ™ Architecture GPU cum XLVIII Tensor Cores | ||
| GPU Max frequency | 921MHz | 1.3 GHz | MC MHz | ||
| CPU | Core quad-Core Arm® cortex®, A57 mpcore processus | Dual-Core NVIDIA Denvertm II LXIV-Bit CPU et Quad-Core Arm® Cortex®-A57 MPCore Processor | VI-Core NVIDIA Carmel Arm® V8.2 LXIV-bit CPU 6MB L2 + 4MB L3 | ||
| CPU Max frequency | 1.43GHz | Denver II: II GHz Cortex-A57: II GHz | 1.9 GHz | ||
| Memoria | 4GB LXIV-bit lpddr4 25.6GB / S | 4GB CXXVIII-bit lpddr4 51.2GB / s | 8GB CXXVIII-bit LPDDR4X 59.7GB / S | 16GB CXXVIII-bit LPDDR4X 59.7GB / S | |
| TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
| Processus ratio | Som | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
| AI Euismod | XX tops | XL tectis | LXX tectis | C tops | |
| GPU | DXII-Core NVIDIA Ampere Architecture GPU cum XVI tensor cors | MXXIV-Core NVIDIA Ampere architectura GPU Cum XXXII Tensor coros | MXXIV-Core NVIDIA Ampere architectura GPU Cum XXXII Tensor coros | ||
| GPU Max frequency | DCXXV MHz | DCCLXV MHZ | CMXVIII MHz |
| |
| CPU | VI-Core Arm® Cortex® A78AE V8.2 LXIV-bit CPU 1.5MB L2 + 4MB L3 | VI-Core Arm® Cortex® a78ae V8.2 LXIV-bit CPU 1.5MB L2 + 4MB L3 | VIII-Core Arm® Cortex® A78ae v8.2 LXIV-bit CPU 2MB L2 + 4MB L3 | ||
| CPU Max frequency | 1.5 GHz | II GHz | |||
| Memoria | 4GB LXIV-bit lpddr5 XXXIV GB / s | 8GB CXXVIII-bit lpddr5 LXVIII GB / s | 8GB CXXVIII-bit Lpddr5 102.4 GB / S | 16GB CXXVIII-bit Lpddr5 102.4 GB / S | |
| TDP | 7W - 10W | 7W - 15w | 10W - 20W | 10W - 25W | |
| Ethernet | Moderator | I * GBE Lan Chip (LAN signum ex ratio-on-module), 10/100/1000 Mbps2 * Pentium 10/100/1000®I210, at, 10/100/1000 Mbps | |||
| Repono | emmc | 16GB Emmc 5.1 (Orin Nano et Orin NX Soms non Support Emmc) | |||
| M.2 | I * M.2 Key-M (NVME SSD, MMCCLXXX), (Orin Nano et Orin NX Soms est PCIE x4 signum, cum aliis Soms est PCIE x1 signa) | ||||
| TF Slote | I * TF Card Slote (Orin Nano et Orin NX Soms non Support TF Card) | ||||
| Expansion Foramina | Mini PCIE | I * Mini PCIE Slote (PCIE X1 + USB 2.0, cum I * Nano Sim Card) (Nano SOM non PCIE x1 signum) | |||
| M.2 | I * M.2 Key-B Slote (USB 3.0, cum I * Nano Sim card, MMMLII) | ||||
| Ante I / O | Ethernet | II * RJ45 | |||
| USB | IV * USB3.0 (type-a) | ||||
| Dispono | I * HDMI: Resolutio usque ad 4k @ 60Hz | ||||
| Button | I * Power Puga pyga + Power ducitur I * Ratio Reset button | ||||
| Latus I / o | USB | I * USB 2.0 (Micro USB, OTG) | |||
| Button | I * Recovery Button | ||||
| Antenna | IV * antennae foraminis | ||||
| Sim | II * Nano Sim | ||||
| Internum I / O | Serialis | II * Rs232 / Rs485 (Com1 / II, Wafer, Jumper SWITCH) I * Rs232 / TTL (COM3, Wafer, DESULTOR Switch) | |||
| Pwrbt | I * Power Button (Wafer) | ||||
| Pwrled | I * Power LED (Wafer) | ||||
| Audio | I * Audio (line-de + microform, wafer) I * ampli, III-w (per alveum) in IV-ω loads (laganum) | ||||
| GPIO | I * XVI bits dio (8xdi et 8xdo, laganum) | ||||
| Can bus | I * can (lagana) | ||||
| Fan | I * CPU fan (Wafer) | ||||
| POPULUM | Genus | DC ad | |||
| Power initus intentione | XII ~ 28v DC | ||||
| Iungo | Terminatio obstructionum, 2pin, P = 5.00 / 5.08 | ||||
| RTC altilium | CR2032 Coin Cell | ||||
| OS Support | Linux | Nano / TX2 NX / Xaverii NX: Jetpack 4.6.3ORIN Nano / Orin NX: Jetpack 5.3.1 | |||
| Mechanica | Clausura | Radiator: Aluminium Alloy, Box: SGCC | |||
| Dimensiones | 150.7mm (L) * 144.5mm (W) 45mm * (h) | ||||
| Adscensio | Desktop, din-rail | ||||
| Enormitas | Calor dissipatio ratio | Fan Minus Design | |||
| Operating temperatus | -20 ~ LX ℃ cum 0.7 m / s airflow | ||||
| Storage temperatus | -40 ~ LXXX ℃ | ||||
| Relativus humiditas | X ad XCV% (non-condensing) | ||||
| Vibratio | 3Glms @ V ~ 500Hz, Random, 1hr / axis (IEC 60068-2-64) | ||||
| Inpulsa | 10G, dimidium Sine, 11ms (IEC 60068-2-27) | ||||
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