TMV-6000/ 7000 Apparatus Visio Controller

Features:

  • Subsidium Intel ® 6 ad 9th Core™ I7/i5/i3 Desktop CPU
  • Ex paribus Q170/C236 industriae gradus chipset
  • DP+HDMI dual 4K ostentus interface, synchrono/asynchronous duplicem ostentationem sustinens
  • 4 USB 3.0 interfaces
  • Duo DB9 Vide portus
  • 6 Gigabit retis interfaces, inter 4 ad libitum POEs
  • 9V~ 36V ampla intentione potentia input
  • Libitum activum / passivum caloris dissipationis modi

  • Remota procuratio

    Remota procuratio

  • Conditio magna

    Conditio magna

  • Operatio remota et sustentationem

    Operatio remota et sustentationem

  • Salus Imperium

    Salus Imperium

Product Description

TMV series visionis moderatoris conceptum modularem adhibet, molliter sustinens Core Intel 6th ad 11th mobilem/desktop processors. Multimodis Gigabit Ethernet et POE portibus instructus, necnon GPIO multi- canali semotus, multiplex Vide portus solitarius, et multiplex fons lucis moderandi modulorum, potest perfecte sustinere applicationes missionum visio amet.

QDevEyes instructus - applicatione missionis intelligentis operandi et sustentationis suggestum IPC focused, suggestum in quattuor dimensionibus applicationum functionis integrat opes: vigilantiam, imperium, sustentationem et operationem. IPC batch remotam administrationem, vigilantiam machinam, et remotam operandi et sustentationis functiones praebet, occurrens necessitates operationis et sustentationis diversarum missionum.

INTRODUCTIO

Engineering Drawing

Tabularium Download

TMV-6000
TMV-7000
TMV-6000
Model TMV-6000
CPU CPU Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU
TDP 35W
Socket SoC
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memoria Socket 1 * Non-ECC SO-DIMM Slote, Dual Channel DDR4 usque ad 2400MHz
Max capacitas 16GB, Single Max. 16GB
Graphics Controller Intel® HD Graphics
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (Mbps 10/100/1000, RJ45; support POE)
Repono M.2 1 * M.2 (Key-M,support 2242/2280 SATA or Plu x4/x2 NVME SSD)1 * M.2 (key-M,support 2242/2280 SATA SSD)
Expansin justo Expansion arca 6 * COM(30pin obturaculum ver-onustum in Phoenix terminales, RS232/422/485 ad libitum (selectis per BOM),RS422/485 Optoelectronic munus optional)+16* GPIO(36pin ver-onustum obturaculum-in Phoenix terminals,support 8 * Optoelectronic solitudo input,8 * Optoelectronic absque output (Libitum Nullam / opto-semotus output)
②32 * GPIO(2*36pin ver-onustum obturaculum-in Phoenix terminals,support 16* Optoelectronic solitudo input,16* Optoelectronic solitudo output (Libitum Nullam/opto-semotus output)
③4* fons lucis ductus(RS232 control,Support externam excitato, summa output potentia 120W; Unius canalis maximam sustinet 24V 3A (72W) output, 0-255 sine labe obscurante, et mora felis externa <10us)1 * Power input(4pin 5.08 Phoenix terminals with clausum)
Notae: Capsula Expansio dilatari potest unum e duobus, capsula expansio dilatari potest usque ad tres in uno TMV-7000.
M.2 1 * M.2 (Key-B, 3042/3052, 4G/5G moduli)
Mini Plu 1 * Mini Plu (auxilio WIFI/3G/4G)
Ante I / O * Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE munus optional,support IEEE 802.3af/ IEEE 802.3at,single portum MAX. ad 30W,total P=MAX. ad 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Ostendere 1 *HDMI: max senatus ad 3840*2160 @ 60Hz1 * DP++: max solutionis usque ad 4096*2304@60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Vide 2 * RS232 (DB9/M)
SIM 2 * Nano Sim card socors (SIM1)
Tergo I / O * Antenna 4* Antennae foramen
Potestas Supple Type DC,
Potentia Input Voltage 9 ~ 36VDC, P≤240W
Connector 1 * 4Pin Connector, P=5.00/5.08
RTC Pugna CR2032 Coin Cell
OS Support Windows 6/7thFenestra 7/8.1/108/9th: Windows 10/11
Linux Linux
Watchdog Output Ratio Reddere
Intervallum Programmabilis via Software ab 1 ad 255 sec
Mechanica Claude Material Radiator: Aluminium stannum, Box: SGCC
Dimensiones 235mm(L) * 156mm(W) * 66mm(H) sine expansione capsulae
Pondus Net: 2.3 kgLaxamentum arca Net: 1kg
Adscendens DIN rail/Rack Mount / Desktop
Environment Calor dissipatio Ratio Fanless Passive Refrigerationem
Operating Temperature -20~ 60℃ (Industrial SSD)
Repono Temperature -40~ 80℃ (Industrial SSD)
Relativum Umor X ad XC% RH (non-condensatione)
Vibratio Per Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis)
Inpulsa Per Operationem Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms)
TMV-7000
Model TMV-7000
CPU CPU Intel® 6-9th Core / Pentium/ Celeron Desktop CPU
TDP 65W
Socket LGA1151
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memoria Socket 2 * Non-ECC SO-DIMM Slote, Dual Channel DDR4 usque ad 2400MHz
Max capacitas 32GB, Single Max. 16GB
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (Mbps 10/100/1000, RJ45; support POE)
Repono M.2 1 * M.2 (Key-M,support 2242/2280 SATA or Plu x4/x2 NVME SSD)1 * M.2 (key-M,support 2242/2280 SATA SSD)
Expansin justo Expansion arca 6 * COM(30pin obturaculum ver-onustum in Phoenix terminales, RS232/422/485 ad libitum (selectis per BOM),RS422/485 Optoelectronic munus optional)+16* GPIO(36pin ver-onustum obturaculum-in Phoenix terminals,support 8 * Optoelectronic solitudo input,8 * Optoelectronic absque output (Libitum Nullam / opto-semotus output)
②32 * GPIO(2*36pin ver-onustum obturaculum-in Phoenix terminals,support 16* Optoelectronic solitudo input,16* Optoelectronic solitudo output (Libitum Nullam/opto-semotus output)
③4* fons lucis ductus(RS232 control,Support externam excitato, summa output potentia 120W; Unius canalis maximam sustinet 24V 3A (72W) output, 0-255 sine labe obscurante, et mora felis externa <10us)1 * Power input(4pin 5.08 Phoenix terminals with clausum)
Notae: Capsula Expansio dilatari potest unum e duobus, capsula expansio dilatari potest usque ad tres in uno TMV-7000.
M.2 1 * M.2 (Key-B, 3042/3052, 4G/5G moduli)
Mini Plu 1 * Mini Plu (auxilio WIFI/3G/4G)
Ante I / O * Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE munus optional,support IEEE 802.3af/ IEEE 802.3at,single portum MAX. ad 30W,total P=MAX. ad 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Ostendere 1 *HDMI: max senatus ad 3840*2160 @ 60Hz1 * DP++: max solutionis usque ad 4096*2304@60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Vide 2 * RS232 (DB9/M)
SIM 2 * Nano Sim card socors (SIM1)
Potestas Supple Potentia Input Voltage 9 ~ 36VDC, P≤240W
OS Support Windows 6/7thFenestra 7/8.1/108/9th: Windows 10/11
Linux Linux
Mechanica Dimensiones 235mm(L) * 156mm(W) * 66mm(H) sine expansione capsulae
Environment Operating Temperature -20~ 60℃ (Industrial SSD)
Repono Temperature -40~ 80℃ (Industrial SSD)
Relativum Umor X ad XC% RH (non-condensatione)
Vibratio Per Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis)
Inpulsa Per Operationem Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms)

ATT-H31C

TMV-6000_20231226_00

TMV-7000

TMV-7000_20231226_00

  • SAMPLES IMPETRA

    Efficax, incolumis, certa. Nostrae instrumenti solutionem pro quacumque necessitate recte spondet. Prodest industriae nostrae peritia et pretii generare addita - cotidie.

    Click For InquisitionisClick more
    TOP