Moderator Visionis Artificialis TMV-6000/7000
Administratio remota
Monitorium condicionis
Operatio et sustentatio remota
Imperium Salutis
CONTACTA NOSDescriptio Producti
Moderator visionis seriei TMV notionem modularem adhibet, processores Intel Core a sexta ad undecimam generationem mobiles/computatrales flexibiliter sustinens. Multis portibus Gigabit Ethernet et POE, necnon GPIO multi-canalibus isolatis expandibilibus, multis portibus serialibus isolatis, et multis modulis moderationis fontis lucis instructus, optime scenaria applicationum visionis vulgarium sustinere potest.
Instructa QDevEyes – suggestu operationis et sustentationis intelligenti in scenariis applicationum IPC intento – suggestus copiam applicationum functionalium in quattuor dimensionibus integrat: supervisione, imperio, sustentatione, et operatione. IPC administrationem fasciculorum remotam, monitorium machinarum, et functiones operationis et sustentationis remotae praebet, necessitatibus operationis et sustentationis variorum scenariorum occurrens.
TMV-6000
TMV-7000
TMV-6000
| Modellum | TMV-6000 | |
| CPU | CPU | Processores mobiles Intel® sextae octavae/undecimae generationis Core / Pentium / Celeron |
| TDP | 35W | |
| Socket | SoC | |
| Microprocessus | Microprocessus | Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Sustentatio Temporis Custodis) |
| Memoria | Socket | 1 * Slot SO-DIMM non-ECC, DDR4 canalis dualis usque ad 2400MHz |
| Capacitas Maxima | 16GB, Singulum Maximum 16GB | |
| Graphica | Moderator | Intel® HD Graphics |
| Aethernet | Moderator | Duo microprocessores Intel i210-AT/i211-AT; I219-LM LAN (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Microprocessores (10/100/1000 Mbps, RJ45; POE sustinent) |
| Repositorium | M.2 | 1 * M.2 (Key-M, sustinet 2242/2280 SATA vel PCIe x4/x2 NVME SSD)1 * M.2 (clavis-M, sustinet 2242/2280 SATA SSD) |
| Expansin Slots | Arca expansionis | ①6 * COM (terminales Phoenix insertabiles 30-pin verno onusti, RS232/422/485 ad libitum (per BOM selectum), functio isolationis optoelectronicae RS422/485 ad libitum) +16 * GPIO (terminales Phoenix insertabiles 36-pin verno onusti, 8* ingressus isolationis optoelectronicae, 8* egressus isolationis optoelectronicae sustinent (egressus relais/opto-isolatus ad libitum)) |
| ②32 * GPIO (2 terminales Phoenix insertabiles 36-pin verrilis onusti), sustinent 16 * input isolationis optoelectronicae, 16 * output isolationis optoelectronicae (exitus relais/opto-isolatus optionalis)) | ||
| ③4 canales lucis (moderatio RS232), impulsum externum sustinent, potentia totalis emissa 120W; canalis singularis maximum impulsum 24V 3A (72W) sustinet, obscurationem continuam 0-255, et moram impulsus externi <10us)1 * Ingressus potentiae (terminales Phoenix 5.08 4pin cum clauso) | ||
| Notae: Arca expansionis ①② una ex duabus amplificari potest, arca expansionis ③ usque ad tres in uno TMV-7000 amplificari potest. | ||
| M.2 | 1 * M.2 (Clavis-B, modulos 3042/3052 4G/5G sustinet) | |
| Mini PCIe | 1 * Mini PCIe (WIFI/3G/4G sustinet) | |
| I/O anterior | Aethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, functionem POE sustinet (facultativam), IEEE 802.3af/IEEE 802.3at sustinet, portus singularis MAX. ad 30W, P = MAX. summa ad 50W) |
| USB | 4 * USB 3.0 (Typus-A, 5Gbps) | |
| Ostendere | 1 *HDMI: resolutio maxima usque ad 3840*2160 @ 60Hz1 * DP++: resolutio maxima usque ad 4096*2304 @ 60Hz | |
| Audio | 2 * Jack 3.5mm (Exitus Linearis + Microphonum) | |
| Serialis | Duo RS232 (DB9/M) | |
| SIM | 2 * foramina pro scheda Nano SIM (SIM1) | |
| I/O posterior | Antenna | 4 * Foramen antennae |
| Fons Potentiae | Typus | DC, |
| Tensio Potentiae Ingressae | 9 ~ 36VDC, P≤240W | |
| Coniunctor | 1 * Coniunctor quattuor aciculorum, P=5.00/5.08 | |
| Accumulator RTC | Cellula Nummaria CR2032 | |
| Auxilium Systematis Operativi | Fenestrae | VI/VIIth：Fenestrae 7/8.1/10VIII/IXthFenestrae 10/11 |
| Linux | Linux | |
| Custos | Exitus | Restitutio Systematis |
| Intervallum | Programmabile per programmatum ab 1 ad 255 secundas | |
| Mechanica | Materia clausurae | Radiator: Mixtura aluminii, Arca: SGCC |
| Dimensiones | 235mm (L) * 156mm (L) * 66mm (A) sine arca expansionis | |
| Pondus | Pondus netum: 2.3 kgArca expansionis (Netto): 1kg | |
| Montatio | Ferrivia DIN / In armario / In mensa | |
| Ambitus | Systema Dissiptionis Caloris | Refrigeratio Passiva Sine Ventilatore |
| Temperatura Operativa | -20~60℃ (SSD Industrialis) | |
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | |
| Humiditas Relativa | 10 ad 90% RH (non condensans) | |
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | |
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | |
TMV-7000
| Modellum | TMV-7000 | |
| CPU | CPU | CPU Intel® sextae generationis nonae Core / Pentium / Celeron pro computatris personalibus |
| TDP | 65W | |
| Socket | LGA1151 | |
| Microprocessus | Microprocessus | Intel® Q170/C236 |
| BIOS | BIOS | AMI UEFI BIOS (Sustentatio Temporis Custodis) |
| Memoria | Socket | Duo fissurae SO-DIMM non-ECC, DDR4 canalis duplicis usque ad 2400MHz |
| Capacitas Maxima | 32GB, Singulum Maximum 16GB | |
| Aethernet | Moderator | Duo microprocessores Intel i210-AT/i211-AT; I219-LM LAN (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Microprocessores (10/100/1000 Mbps, RJ45; POE sustinent) |
| Repositorium | M.2 | 1 * M.2 (Key-M, sustinet 2242/2280 SATA vel PCIe x4/x2 NVME SSD)1 * M.2 (clavis-M, sustinet 2242/2280 SATA SSD) |
| Expansin Slots | Arca expansionis | ①6 * COM (terminales Phoenix insertabiles 30-pin verno onusti, RS232/422/485 ad libitum (per BOM selectum), functio isolationis optoelectronicae RS422/485 ad libitum) +16 * GPIO (terminales Phoenix insertabiles 36-pin verno onusti, 8* ingressus isolationis optoelectronicae, 8* egressus isolationis optoelectronicae sustinent (egressus relais/opto-isolatus ad libitum)) |
| ②32 * GPIO (2 terminales Phoenix insertabiles 36-pin verrilis onusti), sustinent 16 * input isolationis optoelectronicae, 16 * output isolationis optoelectronicae (exitus relais/opto-isolatus optionalis)) | ||
| ③4 canales lucis (moderatio RS232), impulsum externum sustinent, potentia totalis emissa 120W; canalis singularis maximum impulsum 24V 3A (72W) sustinet, obscurationem continuam 0-255, et moram impulsus externi <10us)1 * Ingressus potentiae (terminales Phoenix 5.08 4pin cum clauso) | ||
| Notae: Arca expansionis ①② una ex duabus amplificari potest, arca expansionis ③ usque ad tres in uno TMV-7000 amplificari potest. | ||
| M.2 | 1 * M.2 (Clavis-B, modulos 3042/3052 4G/5G sustinet) | |
| Mini PCIe | 1 * Mini PCIe (WIFI/3G/4G sustinet) | |
| I/O anterior | Aethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE (10/100/1000Mbps, RJ45, functionem POE sustinet (facultativam), IEEE 802.3af/IEEE 802.3at sustinet, portus singularis MAX. ad 30W, P = MAX. summa ad 50W) |
| USB | 4 * USB 3.0 (Typus-A, 5Gbps) | |
| Ostendere | 1 *HDMI: resolutio maxima usque ad 3840*2160 @ 60Hz1 * DP++: resolutio maxima usque ad 4096*2304 @ 60Hz | |
| Audio | 2 * Jack 3.5mm (Exitus Linearis + Microphonum) | |
| Serialis | Duo RS232 (DB9/M) | |
| SIM | 2 * foramina pro scheda Nano SIM (SIM1) | |
| Fons Potentiae | Tensio Potentiae Ingressae | 9 ~ 36VDC, P≤240W |
| Auxilium Systematis Operativi | Fenestrae | VI/VIIth：Fenestrae 7/8.1/10VIII/IXthFenestrae 10/11 |
| Linux | Linux | |
| Mechanica | Dimensiones | 235mm (L) * 156mm (L) * 66mm (A) sine arca expansionis |
| Ambitus | Temperatura Operativa | -20~60℃ (SSD Industrialis) |
| Temperatura Reponendi | -40~80℃ (SSD Industrialis) | |
| Humiditas Relativa | 10 ad 90% RH (non condensans) | |
| Vibratio Inter Operationem | Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, fortuitum, 1hr/axe) | |
| Impetus Inter Operationem | Cum SSD: IEC 60068-2-27 (30G, dimidia sinus, 11ms) | |
ATT-H31C
TMV-7000
EXEMPLA ACQUIRE
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