Products

TMV-6000/ 7000 Apparatus Visio Controller

TMV-6000/ 7000 Apparatus Visio Controller

Features:

  • Subsidium Intel ® 6 ad 9th Core™ I7/i5/i3 Desktop CPU
  • Ex paribus Q170/C236 industriae gradus chipset
  • DP+HDMI dual 4K ostentus interface, synchrono/asynchronous duplicem ostentationem sustinens
  • 4 USB 3.0 interfaces
  • Duo DB9 Vide portus
  • 6 Gigabit retis interfaces, inter 4 ad libitum POEs
  • 9V~ 36V ampla intentione potentia input
  • Libitum activum / passivum caloris dissipationis modi

  • Procuratio remota

    Procuratio remota

  • Conditio magna

    Conditio magna

  • Operatio remota et sustentationem

    Operatio remota et sustentationem

  • Salus Imperium

    Salus Imperium

Product Description

TMV series visionis moderatoris conceptum modularem adhibet, molliter sustinens Core Intel 6th ad 11th mobilem/desktop processors. Multimodis Gigabit Ethernet et POE portibus instructus, necnon GPIO multiflui alvei semotus, multiplex Vide portus solitarius, et multiplex fons lucis moderandi modulorum, potest perfecte sustinere applicationes missionum visio amet.

QDevEyes instructus - applicatione missionis intelligentis operandi et sustentationis suggestum IPC focused, suggestum in quattuor dimensionibus applicationum functionis integrat opes: vigilantiam, imperium, sustentationem et operationem. IPC batch remotam administrationem, vigilantiam machinam, et remotam operandi et sustentationis functiones praebet, occurrens necessitates operationis et sustentationis diversarum missionum.

INTRODUCTION

Engineering Drawing

Tabularium Download

TMV-6000
TMV-7000
TMV-6000
Exemplar TMV-6000
CPU CPU Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU
TDP 35W
Socket SoC
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memoria Socket 1 * Non-ECC SO-DIMM Slote, Dual Channel DDR4 usque ad 2400MHz
Max capacitas 16GB, Single Max. 16GB
Graphics Controller Intel® HD Graphics
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (Mbps 10/100/1000, RJ45; support POE)
Repono M.2 1 * M.2 (Key-M,support 2242/2280 SATA or Plu x4/x2 NVME SSD)1 * M.2 (key-M,support 2242/2280 SATA SSD)
Expansin justo Expansion arca 6 * COM(30pin obturaculum ver-onustum in Phoenix terminales, RS232/422/485 ad libitum (selectis per BOM),RS422/485 Optoelectronic munus optional)+16* GPIO(36pin ver-onustum obturaculum-in Phoenix terminals,support 8* Optoelectronic solitudo input,8* Optoelectronic sine output (Libitum Nullam / opto-semotus output)
②32 * GPIO(2*36pin ver-onustum obturaculum-in Phoenix terminals,support 16* Optoelectronic solitudo input,16* Optoelectronic solitudo output (Libitum Nullam/opto-semotus output)
③4* fons lucis ductus(RS232 control,Support externa CT, summa output potentia 120W; Unius canalis maximam partem 24V 3A (72W) outputum, 0-255 sine labe obscurantem sustinet, et felis externa mora <10us)1 * Power input(4pin 5.08 Phoenix terminals with clausum)
Notae: Capsula Expansio dilatari potest unum e duobus, capsula expansio dilatari potest usque ad tres in uno TMV-7000
M.2 1 * M.2 (Key-B, 3042/3052, 4G/5G moduli)
Mini Plu 1 * Mini Plu (auxilio WIFI/3G/4G)
Ante I / O * Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE munus optional,support IEEE 802.3af/ IEEE 802.3at,single portum MAX. ad 30W,total P=MAX. ad 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Ostendere 1 *HDMI: max senatus ad 3840*2160 @ 60Hz1 * DP++: max solutionis usque ad 4096*2304@60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Vide 2 * RS232 (DB9/M)
SIM 2 * Nano Sim card socors (SIM1)
Tergo I / O * Antenna 4* Antennae foramen
Potestas Supple Type DC,
Potentia Input Voltage 9 ~ 36VDC, P≤240W
Connector 1 * 4Pin Connector, P=5.00/5.08
RTC Pugna CR2032 Coin Cell
OS Support Windows 6/7thFenestra 7/8.1/108/9th: Windows 10/11
Linux Linux
Watchdog Output Ratio Reddere
Intervallum Programmabilis via Software ab 1 ad 255 sec
Mechanica Claude Material Radiator: Aluminium stannum, Box: SGCC
Dimensiones 235mm(L) * 156mm(W) * 66mm(H) sine expansione capsulae
Pondus Net: 2.3 kgLaxamentum arca Net: 1kg
Adscendens DIN rail/Rack Mount / Desktop
Environment Calor dissipatio Ratio Fanless Passive Refrigerationem
Operating Temperature -20~ 60℃ (Industrial SSD)
Repono Temperature -40~ 80℃ (Industrial SSD)
Relativum Umor X ad XC% RH (non-condensatione)
Vibratio Per Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis)
Inpulsa Per Operationem Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms)
TMV-7000
Exemplar TMV-7000
CPU CPU Intel® 6-9th Core / Pentium/ Celeron Desktop CPU
TDP 65W
Socket LGA1151
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memoria Socket 2 * Non-ECC SO-DIMM Slote, Dual Channel DDR4 usque ad 2400MHz
Max capacitas 32GB, Single Max. 16GB
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip (10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip (Mbps 10/100/1000, RJ45; support POE)
Repono M.2 1 * M.2 (Key-M,support 2242/2280 SATA or Plu x4/x2 NVME SSD)1 * M.2 (key-M,support 2242/2280 SATA SSD)
Expansin justo Expansion arca 6 * COM(30pin obturaculum ver-onustum in Phoenix terminales, RS232/422/485 ad libitum (selectis per BOM),RS422/485 Optoelectronic munus optional)+16* GPIO(36pin ver-onustum obturaculum-in Phoenix terminals,support 8* Optoelectronic solitudo input,8* Optoelectronic sine output (Libitum Nullam / opto-semotus output)
②32 * GPIO(2*36pin ver-onustum obturaculum-in Phoenix terminals,support 16* Optoelectronic solitudo input,16* Optoelectronic solitudo output (Libitum Nullam/opto-semotus output)
③4* fons lucis ductus(RS232 control,Support externa CT, summa output potentia 120W; Unius canalis maximam partem 24V 3A (72W) outputum, 0-255 sine labe obscurantem sustinet, et felis externa mora <10us)1 * Power input(4pin 5.08 Phoenix terminals with clausum)
Notae: Capsula Expansio dilatari potest unum e duobus, capsula expansio dilatari potest usque ad tres in uno TMV-7000
M.2 1 * M.2 (Key-B, 3042/3052, 4G/5G moduli)
Mini Plu 1 * Mini Plu (auxilio WIFI/3G/4G)
Ante I / O * Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE munus optional,support IEEE 802.3af/ IEEE 802.3at,single portum MAX. ad 30W,total P=MAX. ad 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Ostendere 1 *HDMI: max senatus ad 3840*2160 @ 60Hz1 * DP++: max solutionis usque ad 4096*2304@60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Vide 2 * RS232 (DB9/M)
SIM 2 * Nano Sim card socors (SIM1)
Potestas Supple Potentia Input Voltage 9 ~ 36VDC, P≤240W
OS Support Windows 6/7thFenestra 7/8.1/108/9th: Windows 10/11
Linux Linux
Mechanica Dimensiones 235mm(L) * 156mm(W) * 66mm(H) sine expansione capsulae
Environment Operating Temperature -20~ 60℃ (Industrial SSD)
Repono Temperature -40~ 80℃ (Industrial SSD)
Relativum Umor X ad XC% RH (non-condensatione)
Vibratio Per Operationem Cum SSD: IEC 60068-2-64 (3Grms@5~500Hz, temere, 1hr/axis)
Inpulsa Per Operationem Cum SSD: IEC 60068-2-27 (30G, dimidii sinus, 11ms)

ATT-H31C

TMV-6000_20231226_00

TMV-7000

TMV-7000_20231226_00

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