Tsamaiso e hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Tšireletseho
Mehleng ea tlhahiso e bohlale, balaoli ba liroboto ke senotlolo sa ho fihlela taolo e nepahetseng le e nepahetseng. Re hlahisitse molaoli oa liroboto tse matla le tse tšepahalang - letoto la TAC, ho thusa likhoebo ho haha monyetla oa tlholisano molemong oa tlhahiso e bohlale. Letoto la TAC le na le li-processor tsa Intel Core 6th ho isa ho 11th tsa mobile/desktop, tse fihlelang litlhoko tse fapaneng tsa ts'ebetso. E na le ts'ebetso e matla ea komporo, tlhophiso ea AI e feto-fetohang, puisano e potlakileng ea liteishene tse ngata, boholo ba komporo, ts'ebetso e feto-fetohang, bokhoni ba ho sebetsa ba mocheso o pharaletseng, le motsoako oa modular bakeng sa tlhokomelo le taolo e bonolo. Bophahamo bo boholo ba palema bo boholo bo loketseng bakeng sa lits'ebetso tse libakeng tse moqotetsane, tse fihlelang litlhoko tsa li-AGV, ho khanna ka mokhoa o ikemetseng, le lits'ebetso tse ling tse Complex libakeng tsa indasteri tse tsamaeang joalo ka likou le libaka tse nyane tsa sebaka. Ka nako e ts'oanang, e nang le QDevEyes Qiwei - (IPC) sethaleng se bohlale sa ts'ebetso le tlhokomelo se shebaneng le maemo a kopo ea IPC, sethala se kopanya mekhoa e metle ea ts'ebetso likarolong tse 'nè tsa taolo ea taolo le tlhokomelo, ho fana ka IPC ka tsamaiso ea batch e hole, sesebelisoa. tlhokomelo, le mesebetsi ea ts'ebetso le tlhokomelo e hole, ho fihlela litlhoko tsa ts'ebetso le tlhokomelo maemong a fapaneng.
Mohlala | TAC-3000 | ||||
Sistimi ea processor | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
Ts'ebetso ea AI | 472 GFLOPS | 1.33 LITŠOANTŠISO | 21 LIHLOOHO | ||
GPU | GPU ea meralo ea NVIDIA Maxwell™ ea 128-core | GPU ea kaho ea NVIDIA Pascal™ ea 256-core | GPU ea meralo ea 384-core NVIDIA Volta™ e nang le 48 Tensor Cores | ||
GPU Max Frequency | 921MHz | 1.3 GHz | 1100 MHz | ||
CPU | Quad-core ARM® Cortex®-A57 MPCore processor | Dual-core NVIDIA DenverTM 2 64-bit CPU le quad-core Arm® Cortex®-A57 MPCore processor | 6-core NVIDIA Carmel Arm® v8.2 64-bit CPU 6MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz Cortex-A57: 2 GHz | 1.9 GHz | ||
Mohopolo | 4GB 64-bit LPDDR4 25.6GB/s | 4GB 128-bit LPDDR4 51.2GB/s | 8GB 128-bit LPDDR4x 59.7GB/s | 16GB 128-bit LPDDR4x 59.7GB/s | |
TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
Sistimi ea processor | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
Ts'ebetso ea AI | 20 LIHLOOHO | 40 LIHLOOHO | 70 LIHLOOHO | 100 LIHLOOHO | |
GPU | Moralo oa 512-core NVIDIA Ampere GPU e nang le 16 Tensor Cores | 1024-core NVIDIA Ampere GPU ea kaho ka 32 Tensor Cores | 1024-core NVIDIA Ampere GPU ea kaho ka 32 Tensor Cores | ||
GPU Max Frequency | 625 MHz | 765 MHz | 918 MHz |
| |
CPU | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm® Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | ||
CPU Max Frequency | 1.5 GHz | 2 GHz | |||
Mohopolo | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
Ethernet | Molaoli | 1 * GBE LAN Chip (pontšo ea LAN e tsoang ho System-on-Module), 10/100/1000 Mbps2 * Intel®I210-AT, 10/100/1000 Mbps | |||
Polokelo | eMMC | 16GB eMMC 5.1 (Orin Nano le Orin NX SOM ha li tšehetse eMMC) | |||
M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano le Orin NX SOMs ke lets'oao la PCIe x4, ha li-SOM tse ling e le lets'oao la PCIe x1) | ||||
TF slot | 1 * TF Card Slot (Orin Nano le Orin NX SOM ha li tšehetse TF Card) | ||||
Katoloso Slots | PCIe e nyane | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, e nang le 1 * Nano SIM Card) (Nano SOM ha e na lets'oao la PCIe x1) | |||
M.2 | 1 * M.2 Key-B Slot (USB 3.0, e nang le 1 * Nano SIM Card, 3052) | ||||
Pele I/O | Ethernet | 2 * RJ45 | |||
USB | 4 * USB3.0 (Mofuta-A) | ||||
Pontšo | 1 * HDMI: Qeto e fihlang ho 4K @ 60Hz | ||||
Konopo | 1 * Konopo ea Matla + Matla a LED 1 * Konopo ea ho tsosolosa tsamaiso | ||||
Lehlakore la I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
Konopo | 1 * Konopo ea ho hlaphoheloa | ||||
Antenna | 4 * Sekoti sa antenna | ||||
SIM | 2 * Nano SIM | ||||
Ka hare I/O | Seriale | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
PWRBT | 1 * Konopo ea Matla (wafer) | ||||
HLAHALA | 1 * Matla a LED (sephaphatha) | ||||
Audio | 1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (kanale ka 'ngoe) ho 4-Ω Loads (wafer) | ||||
GPIO | 1 * 16 bits DIO (8xDI le 8xDO, sephaphatha) | ||||
KA bese | 1 * KA (sephaphatha) | ||||
MOTSAMAI | 1 * CPU FAN (sephaphatha) | ||||
Phepelo ea motlakase | Mofuta | DC, AT | |||
Matla a ho Kena ka Matla | 12 ~ 28V DC | ||||
Sehokedi | Sebaka sa boemelo, 2Pin, P=5.00/5.08 | ||||
Battery ea RTC | CR2032 Coin Cell | ||||
Tšehetso ea OS | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
Mechini | Boitsebiso bo Koaheletsoeng | Radiator: Aluminium alloy, Lebokose: SGCC | |||
Litekanyo | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
Ho phahamisa | Desktop, DIN-rail | ||||
Tikoloho | Sistimi ea ho futhumatsa mocheso | Moralo o fokolang oa fan | |||
Mocheso oa ho sebetsa | -20 ~ 60 ℃ ka phallo ea moea ea 0.7 m/s | ||||
Mocheso oa polokelo | -40 ~ 80 ℃ | ||||
Mongobo o Batlang | 10 ho isa ho 95% (ha e fokotsehe) | ||||
Ho thothomela | 3Grms@5~500Hz, ka tšohanyetso, 1hr/axis (IEC 60068-2-64) | ||||
Ho tshoha | 10G, halofo ea sine, 11ms (IEC 60068-2-27) |
Khoebo e ile ea atolosetsoa lekaleng la indasteri, ea qala moralo oa "modular" bakeng sa likhomphutha tsa indasteri, ea fumana karolo e phahameng ka ho fetisisa ea mmaraka karolong ea taolo ea li-locker naheng ka bophara.
K'hamphani ea pele ea liindasteri ea k'homphieutha e thathamisitsoeng ho New Third Board, e fane ka setifikeiti sa khoebo ea theknoloji e phahameng le setifikeiti sa ho kopanya sesole le sechaba, ea fihlela tsamaiso ea naha ea 'maraka, 'me ea atolosoa khoebong ea mose ho maoatle.
Ntlo-kholo e Chengdu e ile ea fallela setsing sa indasteri sa Suzhou, e shebane le kaho e bonolo ea digitalization le ho kenya ts'ebetsong ea IPC + ts'ebetso le software ea tlhokomelo. E fanoe e le "SME e Khethehileng, e Lefisitsoeng, e Ikhethang le e Ncha" 'me e behiloe har'a lik'hamphani tse 20 tse holimo ka ho fetisisa tsa komporo ea Chaena.
E-Smart IPC e etella pele mokhoa o mocha oa li-PC tsa indasteri ka theknoloji, e lema libaka tsa ts'ebeliso ea indasteri ka botebo, 'me e sebetsana le lintlha tse bohloko tsa indasteri ka litharollo tse kopaneng tsa software le hardware.
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Thepa ea rona e tiisa tharollo e nepahetseng bakeng sa tlhokahalo efe kapa efe. Rua molemo ho tsoa ho boitsebelo ba indasteri ea rona mme o hlahise boleng bo eketsehileng - letsatsi le letsatsi.
Tobetsa Bakeng sa Lipatlisiso