TAC-3000
Tsamaiso e hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Tšireletseho
ITEANYE LE RONATLHALOSO EA SEHLAHISOA
Mehleng ea tlhahiso e bohlale, balaoli ba liroboto ke senotlolo sa ho fihlela taolo e nepahetseng le e nepahetseng. Re hlahisitse molaoli oa liroboto tse matla le tse tšepahalang - letoto la TAC, ho thusa likhoebo ho haha monyetla oa tlholisano molemong oa tlhahiso e bohlale. Letoto la TAC le na le li-processor tsa Intel Core 6th ho isa ho 11th tsa moloko oa mobile/desktop, tse fihlelang litlhoko tse fapaneng tsa ts'ebetso. E na le ts'ebetso e matla ea komporo, tlhophiso ea AI e feto-fetohang, puisano e potlakileng ea liteishene tse ngata, boholo ba komporo, ts'ebetso e feto-fetohang, bokhoni ba ho sebetsa ba mocheso o pharaletseng, le motsoako oa modular bakeng sa tlhokomelo le taolo e bonolo. Bophahamo bo boholo ba palema bo boholo bo loketseng bakeng sa lits'ebetso tse libakeng tse moqotetsane, tse fihlelang litlhoko tsa li-AGV, ho khanna ka mokhoa o ikemetseng, le lits'ebetso tse ling tse Complex libakeng tsa indasteri tse tsamaeang joalo ka likou le libaka tse nyane tsa sebaka. Ka nako e ts'oanang, e nang le QDevEyes Qiwei - (IPC) sethaleng se bohlale sa ts'ebetso le tlhokomelo se shebaneng le maemo a kopo ea IPC, sethala se kopanya lisebelisoa tse ruileng tsa ts'ebetso likarolong tse 'nè tsa taolo ea taolo le tlhokomelo, ho fana ka IPC ka tsamaiso ea batch e hole, sesebelisoa. tlhokomelo, le mesebetsi ea ts'ebetso le tlhokomelo e hole, ho fihlela litlhoko tsa ts'ebetso le tlhokomelo maemong a fapaneng.
| Mohlala | TAC-3000 | ||||
| Sistimi ea processor | SOM | Nano | TX2 NX | Xavier NX | Xavier NX 16GB |
| Ts'ebetso ea AI | 472 GFLOPS | 1.33 LITŠOANTŠISO | 21 LIHLOOHO | ||
| GPU | GPU ea meralo ea NVIDIA Maxwell™ ea 128-core | GPU ea kaho ea NVIDIA Pascal™ ea 256-core | GPU ea meralo ea 384-core NVIDIA Volta™ e nang le 48 Tensor Cores | ||
| GPU Max Frequency | 921MHz | 1.3 GHz | 1100 MHz | ||
| CPU | Quad-core ARM® Cortex®-A57 MPCore processor | Dual-core NVIDIA DenverTM 2 64-bit CPU le quad-core Arm® Cortex®-A57 MPCore processor | 6-core NVIDIA Carmel Arm® v8.2 64-bit CPU 6MB L2 + 4MB L3 | ||
| CPU Max Frequency | 1.43GHz | Denver 2: 2 GHz Cortex-A57: 2 GHz | 1.9 GHz | ||
| Mohopolo | 4GB 64-bit LPDDR4 25.6GB/s | 4GB 128-bit LPDDR4 51.2GB/s | 8GB 128-bit LPDDR4x 59.7GB/s | 16GB 128-bit LPDDR4x 59.7GB/s | |
| TDP | 5W-10W | 7.5W - 15W | 10W - 20W | ||
| Sistimi ea processor | SOM | Orin Nano 4GB | Orin Nano 8GB | Orin NX 8GB | Orin NX 16GB |
| Ts'ebetso ea AI | 20 LIHLOOHO | 40 LIHLOOHO | 70 LIHLOOHO | 100 LIHLOOHO | |
| GPU | Moralo oa 512-core NVIDIA Ampere GPU e nang le 16 Tensor Cores | 1024-core NVIDIA Ampere GPU ea kaho ka 32 Tensor Cores | 1024-core NVIDIA Ampere GPU ea kaho ka 32 Tensor Cores | ||
| GPU Max Frequency | 625 MHz | 765 MHz | 918 MHz |
| |
| CPU | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 6-core Arm® Cortex® A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | 8-core Arm® Cortex® A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 | ||
| CPU Max Frequency | 1.5 GHz | 2 GHz | |||
| Mohopolo | 4GB 64-bit LPDDR5 34 GB/s | 8GB 128-bit LPDDR5 68 GB/s | 8GB 128-bit LPDDR5 102.4 GB/s | 16GB 128-bit LPDDR5 102.4 GB/s | |
| TDP | 7W - 10W | 7W - 15W | 10W - 20W | 10W - 25W | |
| Ethernet | Molaoli | 1 * GBE LAN Chip (pontšo ea LAN e tsoang ho System-on-Module), 10/100/1000 Mbps2 * Intel®I210-AT, 10/100/1000 Mbps | |||
| Polokelo | eMMC | 16GB eMMC 5.1 (Orin Nano le Orin NX SOM ha li tšehetse eMMC) | |||
| M.2 | 1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano le Orin NX SOMs ke lets'oao la PCIe x4, ha li-SOM tse ling e le lets'oao la PCIe x1) | ||||
| TF slot | 1 * TF Card Slot (Orin Nano le Orin NX SOM ha li tšehetse TF Card) | ||||
| Katoloso Slots | PCIe e nyane | 1 * Mini PCIe Slot (PCIe x1+USB 2.0, e nang le 1 * Nano SIM Card) (Nano SOM ha e na lets'oao la PCIe x1) | |||
| M.2 | 1 * M.2 Key-B Slot (USB 3.0, e nang le 1 * Nano SIM Card, 3052) | ||||
| Pele I/O | Ethernet | 2 * RJ45 | |||
| USB | 4 * USB3.0 (Mofuta-A) | ||||
| Pontšo | 1 * HDMI: Qeto e fihlang ho 4K @ 60Hz | ||||
| Konopo | 1 * Konopo ea Matla + Matla a LED 1 * Konopo ea ho tsosolosa tsamaiso | ||||
| Lehlakore la I/O | USB | 1 * USB 2.0 (Micro USB, OTG) | |||
| Konopo | 1 * Konopo ea ho hlaphoheloa | ||||
| Antenna | 4 * Sekoti sa antenna | ||||
| SIM | 2 * Nano SIM | ||||
| Ka hare I/O | Seriale | 2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch) | |||
| PWRBT | 1 * Konopo ea Matla (wafer) | ||||
| HLAHALA | 1 * Matla a LED (wafer) | ||||
| Audio | 1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (kanale ka 'ngoe) ho 4-Ω Loads (wafer) | ||||
| GPIO | 1 * 16 bits DIO (8xDI le 8xDO, sephaphatha) | ||||
| KA bese | 1 * KA (sephaphatha) | ||||
| MOTSAMAI | 1 * CPU FAN (sephaphatha) | ||||
| Phepelo ea motlakase | Mofuta | DC, AT | |||
| Matla a ho Kena ka Matla | 12 ~ 28V DC | ||||
| Sehokedi | Sebaka sa boemelo, 2Pin, P=5.00/5.08 | ||||
| Battery ea RTC | CR2032 Coin Cell | ||||
| Tšehetso ea OS | Linux | Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1 | |||
| Mechini | Boitsebiso bo Koaheletsoeng | Radiator: Aluminium alloy, Lebokose: SGCC | |||
| Litekanyo | 150.7mm(L) * 144.5mm(W) * 45mm(H) | ||||
| Ho phahamisa | Desktop, DIN-rail | ||||
| Tikoloho | Sistimi ea ho futhumatsa mocheso | Moralo o fokolang oa fan | |||
| Mocheso oa ho sebetsa | -20 ~ 60 ℃ ka phallo ea moea ea 0.7 m/s | ||||
| Mocheso oa polokelo | -40 ~ 80 ℃ | ||||
| Mongobo o Batlang | 10 ho isa ho 95% (ha e fokotsehe) | ||||
| Ho thothomela | 3Grms@5~500Hz, ka tšohanyetso, 1hr/axis (IEC 60068-2-64) | ||||
| Ho tshoha | 10G, halofo ea sine, 11ms (IEC 60068-2-27) | ||||
Ho tsepamisa maikutlo ho indasteri
Khoebo e ile ea atolosetsoa lekaleng la indasteri, ea qala moralo oa "modular" bakeng sa likhomphutha tsa indasteri, ea fumana karolo e phahameng ka ho fetisisa ea mmaraka karolong ea taolo ea li-locker naheng ka bophara.
Mofani oa litšebeletso tse khethehileng tsa lisebelisoa tse bohlale
K'hamphani ea pele ea liindasteri ea k'homphieutha e thathamisitsoeng ho New Third Board, e fane ka setifikeiti sa khoebo ea theknoloji e phahameng le setifikeiti sa ho kopanya sesole le sechaba, ea fihlela tsamaiso ea naha ea 'maraka, 'me ea atolosoa khoebong ea mose ho maoatle.
Mofani oa litšebeletso tsa komporo ea indasteri ea AI
Ntlo-kholo e Chengdu e ile ea fallela setsing sa indasteri sa Suzhou, se shebane le kaho e bonolo ea digitalization le ho kenya ts'ebetsong ea IPC + ts'ebetso le software ea tlhokomelo. E fuoe tlotla ea ho ba "SME e Khethehileng, e Lefisitsoeng, e Ikhethang le e Ncha" 'me e behiloe har'a lik'hamphani tse 20 tse holimo tsa komporo ea Chaena.
Mofani oa litšebeletso tsa komporo ea indasteri ea AI
E-Smart IPC e etella pele mokhoa o mocha oa li-PC tsa indasteri ka theknoloji, e lema libaka tsa ts'ebeliso ea indasteri ka botebo, 'me e sebetsana le lintlha tse bohloko tsa indasteri ka litharollo tse kopaneng tsa software le hardware.
FUMANE LIMAKATSO
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Thepa ea rona e tiisa tharollo e nepahetseng bakeng sa tlhokahalo efe kapa efe. Rua molemo ho tsoa ho boitsebelo ba indasteri ea rona mme o hlahise boleng bo eketsehileng - letsatsi le letsatsi.
Tobetsa Bakeng sa Lipatlisiso
