Lihlahisoa

TAC-3000

TAC-3000

Likaroloana:

  • Ho ts'oara boto ea mantlha ea NVIDIA ® JetsonTMSO-DIMM
  • Taolo e phahameng ea AI, ho fihla ho 100TOPS matla a komporo
  • Ka ho lula ka har'a 3 Gigabit Ethernet le 4 USB 3.0
  • Khetho ea 16bit DIO, 2 RS232/RS485 COM e ka lokisoang
  • E ts'ehetsa katoloso ea ts'ebetso ea 5G/4G/WiFi
  • Ts'ehetsa phetisetso ea motlakase oa DC 12-28V ka bophara
  • Moralo o kopaneng haholo bakeng sa fan, kaofela ke tsa mochini o matla haholo
  • Mofuta oa tafole e tšoaroang ka letsoho, ho kenya DIN

  • Tsamaiso e hole

    Tsamaiso e hole

  • Tlhokomelo ea maemo

    Tlhokomelo ea maemo

  • Ts'ebetso le tlhokomelo e hole

    Ts'ebetso le tlhokomelo e hole

  • Taolo ea Tšireletseho

    Taolo ea Tšireletseho

TLHALOSO EA SEHLAHISOA

Mehleng ea tlhahiso e bohlale, balaoli ba liroboto ke senotlolo sa ho fihlela taolo e nepahetseng le e nepahetseng. Re hlahisitse molaoli oa liroboto tse matla le tse tšepahalang - letoto la TAC, ho thusa likhoebo ho haha ​​​​monyetla oa tlholisano molemong oa tlhahiso e bohlale. Letoto la TAC le na le li-processor tsa Intel Core 6th ho isa ho 11th tsa mobile/desktop, tse fihlelang litlhoko tse fapaneng tsa ts'ebetso. E na le ts'ebetso e matla ea komporo, tlhophiso ea AI e feto-fetohang, puisano e potlakileng ea liteishene tse ngata, boholo ba komporo, ts'ebetso e feto-fetohang, bokhoni ba ho sebetsa ba mocheso o pharaletseng, le motsoako oa modular bakeng sa tlhokomelo le taolo e bonolo. Bophahamo bo boholo ba palema bo boholo bo loketseng bakeng sa lits'ebetso tse libakeng tse moqotetsane, tse fihlelang litlhoko tsa li-AGV, ho khanna ka mokhoa o ikemetseng, le lits'ebetso tse ling tse Complex libakeng tsa indasteri tse tsamaeang joalo ka likou le libaka tse nyane tsa sebaka. Ka nako e ts'oanang, e nang le QDevEyes Qiwei - (IPC) sethaleng se bohlale sa ts'ebetso le tlhokomelo se shebaneng le maemo a kopo ea IPC, sethala se kopanya mekhoa e metle ea ts'ebetso likarolong tse 'nè tsa taolo ea taolo le tlhokomelo, ho fana ka IPC ka tsamaiso ea batch e hole, sesebelisoa. tlhokomelo, le mesebetsi ea ts'ebetso le tlhokomelo e hole, ho fihlela litlhoko tsa ts'ebetso le tlhokomelo maemong a fapaneng.

LIEKETSENG

Setšoantšo sa Boenjiniere

Fumana faele

Mohlala

TAC-3000

Sistimi ea processor

SOM

Nano

TX2 NX

Xavier NX

Xavier NX 16GB

Ts'ebetso ea AI

472 GFLOPS

1.33 LITŠOANTŠISO

21 LIHLOOHO

GPU

GPU ea meralo ea NVIDIA Maxwell™ ea 128-core

GPU ea kaho ea NVIDIA Pascal™ ea 256-core

GPU ea meralo ea 384-core NVIDIA Volta™ e nang le 48 Tensor Cores

GPU Max Frequency

921MHz

1.3 GHz

1100 MHz

CPU

Quad-core ARM® Cortex®-A57 MPCore processor

Dual-core NVIDIA DenverTM 2 64-bit CPU le quad-core Arm® Cortex®-A57 MPCore processor

6-core NVIDIA Carmel
Arm® v8.2 64-bit CPU
6MB L2 + 4MB L3

CPU Max Frequency

1.43GHz

Denver 2: 2 GHz

Cortex-A57: 2 GHz

1.9 GHz

Mohopolo

4GB 64-bit LPDDR4 25.6GB/s

4GB 128-bit LPDDR4 51.2GB/s

8GB 128-bit

LPDDR4x 59.7GB/s

16GB 128-bit LPDDR4x 59.7GB/s

TDP

5W-10W

7.5W - 15W

10W - 20W

Sistimi ea processor

SOM

Orin Nano 4GB

Orin Nano 8GB

Orin NX 8GB

Orin NX 16GB

Ts'ebetso ea AI

20 LIHLOOHO

40 LIHLOOHO

70 LIHLOOHO

100 LIHLOOHO

GPU

Moralo oa 512-core NVIDIA Ampere
GPU e nang le 16 Tensor Cores
1024-core NVIDIA Ampere
GPU ea kaho
ka 32 Tensor Cores
1024-core NVIDIA Ampere
GPU ea kaho
ka 32 Tensor Cores

GPU Max Frequency

625 MHz

765 MHz

918 MHz

 

CPU

6-core Arm® Cortex® A78AE v8.2 64-bit CPU

1.5MB L2 + 4MB L3

6-core Arm®
Cortex® A78AE
v8.2 64-bit CPU
1.5MB L2 +
4MB L3
8-core Arm®
Cortex®
A78AE v8.2 64-bit
CPU 2MB L2
+ 4MB L3

CPU Max Frequency

1.5 GHz

2 GHz

Mohopolo

4GB 64-bit LPDDR5 34 GB/s

8GB 128-bit LPDDR5 68 GB/s

8GB 128-bit

LPDDR5

102.4 GB/s

16GB 128-bit

LPDDR5

102.4 GB/s

TDP

7W - 10W

7W - 15W

10W - 20W

10W - 25W

Ethernet

Molaoli

1 * GBE LAN Chip (pontšo ea LAN e tsoang ho System-on-Module), 10/100/1000 Mbps2 * Intel®I210-AT, 10/100/1000 Mbps

Polokelo

eMMC

16GB eMMC 5.1 (Orin Nano le Orin NX SOM ha li tšehetse eMMC)

M.2

1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano le Orin NX SOMs ke lets'oao la PCIe x4, ha li-SOM tse ling e le lets'oao la PCIe x1)

TF slot

1 * TF Card Slot (Orin Nano le Orin NX SOM ha li tšehetse TF Card)

Katoloso

Slots

PCIe e nyane

1 * Mini PCIe Slot (PCIe x1+USB 2.0, e nang le 1 * Nano SIM Card) (Nano SOM ha e na lets'oao la PCIe x1)

M.2

1 * M.2 Key-B Slot (USB 3.0, e nang le 1 * Nano SIM Card, 3052)

Pele I/O

Ethernet

2 * RJ45

USB

4 * USB3.0 (Mofuta-A)

Pontšo

1 * HDMI: Qeto e fihlang ho 4K @ 60Hz

Konopo

1 * Konopo ea Matla + Matla a LED
1 * Konopo ea ho tsosolosa tsamaiso

Lehlakore la I/O

USB

1 * USB 2.0 (Micro USB, OTG)

Konopo

1 * Konopo ea ho hlaphoheloa

Antenna

4 * Sekoti sa antenna

SIM

2 * Nano SIM

Ka hare I/O

Seriale

2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch)

PWRBT

1 * Konopo ea Matla (wafer)

HLAHALA

1 * Matla a LED (sephaphatha)

Audio

1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (kanale ka 'ngoe) ho 4-Ω Loads (wafer)

GPIO

1 * 16 bits DIO (8xDI le 8xDO, sephaphatha)

KA bese

1 * KA (sephaphatha)

MOTSAMAI

1 * CPU FAN (sephaphatha)

Phepelo ea motlakase

Mofuta

DC, AT

Matla a ho Kena ka Matla

12 ~ 28V DC

Sehokedi

Sebaka sa boemelo, 2Pin, P=5.00/5.08

Battery ea RTC

CR2032 Coin Cell

Tšehetso ea OS

Linux

Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1

Mechini

Boitsebiso bo Koaheletsoeng

Radiator: Aluminium alloy, Lebokose: SGCC

Litekanyo

150.7mm(L) * 144.5mm(W) * 45mm(H)

Ho phahamisa

Desktop, DIN-rail

Tikoloho

Sistimi ea ho futhumatsa mocheso

Moralo o fokolang oa fan

Mocheso oa ho sebetsa

-20 ~ 60 ℃ ka phallo ea moea ea 0.7 m/s

Mocheso oa polokelo

-40 ~ 80 ℃

Mongobo o Batlang

10 ho isa ho 95% (ha e fokotsehe)

Ho thothomela

3Grms@5~500Hz, ka tšohanyetso, 1hr/axis (IEC 60068-2-64)

Ho tshoha

10G, halofo ea sine, 11ms (IEC 60068-2-27)

 

Ho tsepamisa maikutlo ho indasteri

Khoebo e ile ea atolosetsoa lekaleng la indasteri, ea qala moralo oa "modular" bakeng sa likhomphutha tsa indasteri, ea fumana karolo e phahameng ka ho fetisisa ea mmaraka karolong ea taolo ea li-locker naheng ka bophara.

Mofani oa litšebeletso tse khethehileng tsa lisebelisoa tse bohlale

K'hamphani ea pele ea liindasteri ea k'homphieutha e thathamisitsoeng ho New Third Board, e fane ka setifikeiti sa khoebo ea theknoloji e phahameng le setifikeiti sa ho kopanya sesole le sechaba, ea fihlela tsamaiso ea naha ea 'maraka, 'me ea atolosoa khoebong ea mose ho maoatle.

Mofani oa litšebeletso tsa komporo ea indasteri ea AI

Ntlo-kholo e Chengdu e ile ea fallela setsing sa indasteri sa Suzhou, e shebane le kaho e bonolo ea digitalization le ho kenya ts'ebetsong ea IPC + ts'ebetso le software ea tlhokomelo. E fanoe e le "SME e Khethehileng, e Lefisitsoeng, e Ikhethang le e Ncha" 'me e behiloe har'a lik'hamphani tse 20 tse holimo ka ho fetisisa tsa komporo ea Chaena.

Mofani oa litšebeletso tsa komporo ea indasteri ea AI

E-Smart IPC e etella pele mokhoa o mocha oa li-PC tsa indasteri ka theknoloji, e lema libaka tsa ts'ebeliso ea indasteri ka botebo, 'me e sebetsana le lintlha tse bohloko tsa indasteri ka litharollo tse kopaneng tsa software le hardware.

TAC-3000

  • FUMANE LIMAKATSO

    E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Thepa ea rona e tiisa tharollo e nepahetseng bakeng sa tlhokahalo efe kapa efe. Rua molemo ho tsoa ho boitsebelo ba indasteri ea rona mme o hlahise boleng bo eketsehileng - letsatsi le letsatsi.

    Tobetsa Bakeng sa LipatlisisoTobetsa ho feta
    LIHLAHISO

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