Tsamaiso e hole
Tlhokomelo ea maemo
Ts'ebetso le tlhokomelo e hole
Taolo ea Tšireletseho
Taolo ea pono ea letoto la TMV e amohela mohopolo oa modular, o ts'ehetsa ka bonolo li-processor tsa Intel Core 6th ho isa ho 11th molokong oa mobile/desktop. E na le likou tse ngata tsa Gigabit Ethernet le POE, hammoho le GPIO e arohaneng ea liteishene tse ngata, likou tse ngata tse arohaneng tsa serial, le li-module tse ngata tsa taolo ea mohloli oa leseli, e ka ts'ehetsa ka botlalo maemo a ts'ebeliso ea pono ea mantlha.
E na le QDevEyes - e shebaneng le ts'ebetso ea ts'ebetso ea IPC e sebetsang ka bohlale le sethala sa tlhokomelo, sethala se kopanya lisebelisoa tse ngata tse sebetsang ka likarolo tse 'nè: tsamaiso, taolo, tlhokomelo le ts'ebetso. E fana ka IPC ka taolo ea li-remote batch, tlhokomelo ea lisebelisoa, le ts'ebetso ea hole le mesebetsi ea tlhokomelo, ho finyella litlhoko tsa ts'ebetso le tlhokomelo ea maemo a fapaneng.
Mohlala | TMV-6000 | |
CPU | CPU | Intel® 6-8/11th Generation Core / Pentium/Celeron mobile CPU |
TDP | 35W | |
Soketeng | SoC | |
Chipset | Chipset | Intel® Q170/C236 |
BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
Mohopolo | Soketeng | 1 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 ho fihla ho 2400MHz |
Boholo ba Bokhoni | 16GB, Single Max. 16 GB | |
Litšoantšo | Molaoli | Intel® HD Graphics |
Ethernet | Molaoli | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; tšehetso POE) |
Polokelo | M.2 | 1 * M.2(Key-M, tšehetsa 2242/2280 SATA kapa PCIe x4/x2 NVME SSD)1 * M.2(key-M, tšehetsa 2242/2280 SATA SSD) |
Eketsa Slots | Lebokose la ho atolosa | ①6 * COM (30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 boikhethelo (khetha ke BOM) , RS422/485 Optoelectronic isolation function optional)+16 * GPIO (36pin Spring-loaded plug-in Phoenix terminals) 8 * Optoelectronic isolation input, 8* Optoelectronic isolation output (Ho ikhethela relay/opto-isolated output)) |
②32 * GPIO (2 * 36pin plug-in ea Phoenix e laetsoeng ke li-terminals, ts'ehetso ea 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (Khetho ea boikhethelo / tlhahiso e ikemetseng)) | ||
③4 * liteishene tsa mohloli o khanyang (taolo ea RS232, Ts'ehetso ea ts'ebetso ea kantle, matla a tlhahiso ea kakaretso ea 120W; Seteishene se le seng se ts'ehetsa palo e kholo ea tlhahiso ea 24V 3A (72W), 0-255 dimming e senang mohato, le ho lieha ho tsoa kantle <10us)1 * Ho kenya matla (4pin 5.08 litheminale tsa Phoenix tse notletsoeng) | ||
Lintlha: Lebokose la katoloso ①② le ka atolosoa e 'ngoe ea tse peli, Lebokose la Katoloso③ le ka atolosoa ho isa ho tse tharo ho TMV-7000 e le 'ngoe. | ||
M.2 | 1 * M.2 (Key-B, tšehetso ea 3042/3052 4G/5G module) | |
PCIe e nyane | 1 * PCIe e nyane (tšehetso ea WIFI/3G/4G) | |
Pele I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45, tšehetsa POE ka boikhethelo, tšehetsa IEEE 802.3af/ IEEE 802.3at, boema-kepe bo le bong MAX. ho isa ho 30W, kakaretso ea P=MAX. ho isa ho 50W) |
USB | 4 * USB3.0 (Mofuta-A, 5Gbps) | |
Pontšo | 1 * HDMI: qeto e phahameng ho fihla ho 3840 * 2160 @ 60Hz1 * DP++: qeto e phahameng ho fihla ho 4096*2304 @ 60Hz | |
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Seriale | 2 * RS232 (DB9/M) | |
SIM | 2 * Nano SIM card slot (SIM1) | |
Ka morao I/O | Antenna | 4 * Sekoti sa antenna |
Phepelo ea motlakase | Mofuta | DC, |
Matla a ho Kena ka Matla | 9 ~ 36VDC, P≤240W | |
Sehokedi | 1 * 4Pin Connector, P=5.00/5.08 | |
Battery ea RTC | CR2032 Coin Cell | |
Tšehetso ea OS | Windows | 6/7thTlhaloso: Windows 7/8.1/108/9thTlhaloso: Windows 10/11 |
Linux | Linux | |
Mohlokomedi | Sephetho | Reset ea sistimi |
Karohano | E ka rarolloa ka Software ho tloha ho 1 ho isa ho 255 sec | |
Mechini | Boitsebiso bo Koaheletsoeng | Radiator: Aluminium alloy, Lebokose: SGCC |
Litekanyo | 235mm(L) * 156mm(W) * 66mm(H) ntle le lebokose la katoloso | |
Boima ba 'mele | Nete: 2.3 kgLebokose la katoloso Nete: 1kg | |
Ho phahamisa | DIN seporo /Rack mount / Desktop | |
Tikoloho | Sistimi ea ho futhumatsa mocheso | Pholiso e sa Feleng ea Fanless |
Mocheso oa ho sebetsa | -20~60℃ (SSD ea Industrial) | |
Mocheso oa polokelo | -40~80℃ (SSD ea Industrial) | |
Mongobo o Batlang | 10 ho isa ho 90% RH (e sa fokotseheng) | |
Vibration Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, ka tšohanyetso, 1hr/axis) | |
Ho tsieleha Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) |
Mohlala | TMV-7000 | |
CPU | CPU | Intel® 6-9th Generation Core / Pentium/Celeron Desktop CPU |
TDP | 65W | |
Soketeng | LGA1151 | |
Chipset | Chipset | Intel® Q170/C236 |
BIOS | BIOS | AMI UEFI BIOS (Support Watchdog Timer) |
Mohopolo | Soketeng | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 ho fihla ho 2400MHz |
Boholo ba Bokhoni | 32GB, Single Max. 16 GB | |
Ethernet | Molaoli | 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; tšehetso POE) |
Polokelo | M.2 | 1 * M.2(Key-M, tšehetsa 2242/2280 SATA kapa PCIe x4/x2 NVME SSD)1 * M.2(key-M, tšehetsa 2242/2280 SATA SSD) |
Eketsa Slots | Lebokose la ho atolosa | ①6 * COM (30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 boikhethelo (khetha ke BOM) , RS422/485 Optoelectronic isolation function optional)+16 * GPIO (36pin Spring-loaded plug-in Phoenix terminals) 8 * Optoelectronic isolation input, 8* Optoelectronic isolation output (Ho ikhethela relay/opto-isolated output)) |
②32 * GPIO (2 * 36pin plug-in ea Phoenix e laetsoeng ke li-terminals, ts'ehetso ea 16 * Optoelectronic isolation input, 16 * Optoelectronic isolation output (Khetho ea boikhethelo / tlhahiso e ikemetseng)) | ||
③4 * liteishene tsa mohloli o khanyang (taolo ea RS232, Ts'ehetso ea ts'ebetso ea kantle, matla a tlhahiso ea kakaretso ea 120W; Seteishene se le seng se ts'ehetsa palo e kholo ea tlhahiso ea 24V 3A (72W), 0-255 dimming e senang mohato, le ho lieha ho tsoa kantle <10us)1 * Ho kenya matla (4pin 5.08 litheminale tsa Phoenix tse notletsoeng) | ||
Lintlha: Lebokose la katoloso ①② le ka atolosoa e 'ngoe ea tse peli, Lebokose la Katoloso③ le ka atolosoa ho isa ho tse tharo ho TMV-7000 e le 'ngoe. | ||
M.2 | 1 * M.2 (Key-B, tšehetso ea 3042/3052 4G/5G module) | |
PCIe e nyane | 1 * PCIe e nyane (tšehetso ea WIFI/3G/4G) | |
Pele I/O | Ethernet | 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45, tšehetsa POE ka boikhethelo, tšehetsa IEEE 802.3af/ IEEE 802.3at, boema-kepe bo le bong MAX. ho isa ho 30W, kakaretso ea P=MAX. ho isa ho 50W) |
USB | 4 * USB3.0 (Mofuta-A, 5Gbps) | |
Pontšo | 1 * HDMI: qeto e phahameng ho fihla ho 3840 * 2160 @ 60Hz1 * DP++: qeto e phahameng ho fihla ho 4096*2304 @ 60Hz | |
Audio | 2 * 3.5mm Jack (Line-Out + MIC) | |
Seriale | 2 * RS232 (DB9/M) | |
SIM | 2 * Nano SIM card slot (SIM1) | |
Phepelo ea motlakase | Matla a ho Kena ka Matla | 9 ~ 36VDC, P≤240W |
Tšehetso ea OS | Windows | 6/7thTlhaloso: Windows 7/8.1/108/9thTlhaloso: Windows 10/11 |
Linux | Linux | |
Mechini | Litekanyo | 235mm(L) * 156mm(W) * 66mm(H) ntle le lebokose la katoloso |
Tikoloho | Mocheso oa ho sebetsa | -20~60℃ (SSD ea Industrial) |
Mocheso oa polokelo | -40~80℃ (SSD ea Industrial) | |
Mongobo o Batlang | 10 ho isa ho 90% RH (e sa fokotseheng) | |
Vibration Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-64 (3Grms@5~500Hz, ka tšohanyetso, 1hr/axis) | |
Ho tsieleha Nakong ea Ts'ebetso | Ka SSD: IEC 60068-2-27 (30G, halofo ea sine, 11ms) |
E sebetsa hantle, e bolokehile ebile e ka tšeptjoa. Thepa ea rona e tiisa tharollo e nepahetseng bakeng sa tlhokahalo efe kapa efe. Rua molemo ho tsoa ho boitsebelo ba indasteri ea rona mme o hlahise boleng bo eketsehileng - letsatsi le letsatsi.
Tobetsa Bakeng sa Lipatlisiso