Products

TAC-3000 Robot Controller/Vehicle Road Collaboration

TAC-3000 Robot Controller/Vehicle Road Collaboration

Features:

  • Holding NVIDIA ® JetsonTMSO-DIMM connector core board
  • High performance AI controller, up to 100TOPS computing power
  • Default onboard 3 Gigabit Ethernet and 4 USB 3.0
  • Optional 16bit DIO, 2 RS232/RS485 configurable COM
  • Supporting 5G/4G/WiFi function expansion
  • Support DC 12-28V wide voltage transmission
  • A super compact design for a fan, all belong to high-strength machinery
  • Handheld table type, DIN installation

  • Remote management

    Remote management

  • Condition monitoring

    Condition monitoring

  • Remote operation and maintenance

    Remote operation and maintenance

  • Safety Control

    Safety Control

PRODUCT DESCRIPTION

The APQ Vehicle-Road Collaboration Controller TAC-3000 is a high-performance AI controller specifically designed for vehicle-road collaboration applications. This controller utilizes the NVIDIA® Jetson™ SO-DIMM connector core modules, supporting high-performance AI computing with up to 100 TOPS of computational power. It comes standard with 3 Gigabit Ethernet ports and 4 USB 3.0 ports, providing high-speed and stable network connections and data transfer capabilities. The controller also supports a variety of expansion features, including optional 16-bit DIO and 2 configurable RS232/RS485 COM ports, facilitating communication with external devices. It supports expansion for 5G/4G/WiFi capabilities, ensuring stable wireless communication connections. In terms of power supply, the TAC-3000 supports DC 12~28V wide voltage input, adapting to different power environments. Additionally, its fanless ultra-compact design with an all-metal high-strength body is capable of withstanding harsh environmental conditions. It supports both desktop and DIN rail mounting options, allowing for installation and deployment according to actual application needs.

In summary, with its powerful AI computing capabilities, high-speed network connections, rich I/O interfaces, and exceptional expandability, the APQ Vehicle-Road Collaboration Controller TAC-3000 provides stable and efficient support for vehicle-road collaboration applications. Whether in intelligent transportation, autonomous driving, or other related fields, it meets the needs of various complex application scenarios.

 

INTRODUCTION

Engineering Drawing

File Download

Model

TAC-3000

Processor System

SOM

Nano

TX2 NX

Xavier NX

Xavier NX 16GB

AI Performance

472 GFLOPS

1.33 TFLOPS

21 TOPS

GPU

128-core NVIDIA Maxwell™ architecture GPU

256-core NVIDIA Pascal™ architecture GPU

384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores

GPU Max Frequency

921MHz

1.3 GHz

1100 MHz

CPU

Quad-core ARM® Cortex®-A57 MPCore processor

Dual-core NVIDIA DenverTM 2 64-bit CPU
and quad-core Arm® Cortex®-A57 MPCore processor

6-core NVIDIA Carmel Arm® v8.2 64-bit CPU

 6MB L2 + 4MB L3

CPU Max Frequency

1.43GHz

Denver 2: 2 GHz

Cortex-A57: 2 GHz

1.9 GHz

Memory

4GB 64-bit LPDDR4 25.6GB/s

4GB 128-bit LPDDR4 51.2GB/s

8GB 128-bit 
LPDDR4x 59.7GB/s
16GB 128-bit 
LPDDR4x 59.7GB/s

TDP

5W-10W

7.5W - 15W

10W - 20W

Processor System

SOM

Orin Nano 4GB

Orin Nano 8GB

Orin NX 8GB

Orin NX 16GB

AI Performance

20 TOPS

40 TOPS

70 TOPS

100 TOPS

GPU

512-core NVIDIA Ampere
architecture GPU
with 16 Tensor Cores
1024-core NVIDIA Ampere
architecture GPU
with 32 Tensor Cores
1024-core NVIDIA Ampere
architecture GPU
with 32 Tensor Cores

GPU Max Frequency

625 MHz

765 MHz

918 MHz

 

CPU

6-core Arm® Cortex® A78AE v8.2 64-bit CPU

1.5MB L2 + 4MB L3

6-core Arm® Cortex® 
A78AE v8.2 64-bit CPU
1.5MB L2 + 4MB L3
8-core Arm® Cortex® 
A78AE v8.2 64-bit CPU 
2MB L2 + 4MB L3

CPU Max Frequency

1.5 GHz

2 GHz

Memory

4GB 64-bit LPDDR5 34 GB/s

8GB 128-bit LPDDR5 68 GB/s

8GB 128-bit
LPDDR5 102.4 GB/s
16GB 128-bit
LPDDR5 102.4 GB/s

TDP

7W - 10W

7W - 15W

10W - 20W

10W - 25W

Ethernet

Controller

1 * GBE LAN Chip (LAN signal from System-on-Module), 10/100/1000 Mbps2 * Intel® I210-AT, 10/100/1000 Mbps

Storage

eMMC

16GB eMMC 5.1 (Orin Nano and Orin NX SOMs do not support eMMC)

M.2

1 * M.2 Key-M (NVMe SSD, 2280) (Orin Nano and Orin NX SOMs is PCIe x4 signal, while other SOMs is PCIe x1 signal)

TF Slot

1 * TF Card Slot (Orin Nano and Orin NX SOMs do not support TF Card)

Expansion

Slots

Mini PCIe

1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * Nano SIM Card) (Nano SOM do not have PCIe x1 signal)

M.2

1 * M.2 Key-B Slot (USB 3.0, with 1 * Nano SIM Card, 3052)

Front I/O

Ethernet

2 * RJ45

USB

4 * USB3.0 (Type-A)

Display

1 * HDMI: Resolution up to 4K @ 60Hz

Button

1 * Power Button + Power LED
1 * System Reset Button

Side I/O

USB

1 * USB 2.0 (Micro USB, OTG)

Button

1 * Recovery Button

Antenna

4 * Antenna hole

SIM

2 * Nano SIM

Internal I/O

Serial

2 * RS232/RS485 (COM1/2, wafer, Jumper Switch)1 * RS232/TTL (COM3, wafer, Jumper Switch)

PWRBT

1 * Power Button (wafer)

PWRLED

1 * Power LED (wafer)

Audio

1 * Audio (Line-Out + MIC, wafer)1 * Amplifier, 3-W (per channel) into a 4-Ω Loads (wafer)

GPIO

1 * 16 bits DIO (8xDI and 8xDO, wafer)

CAN Bus

1 * CAN (wafer)

FAN

1 * CPU FAN (wafer)

Power Supply

Type

DC, AT

Power Input Voltage

12~28V DC

Connector

Terminal block, 2Pin, P=5.00/5.08

RTC Battery

CR2032 Coin Cell

OS Support

Linux

Nano/TX2 NX/Xavier NX: JetPack 4.6.3Orin Nano/Orin NX: JetPack 5.3.1

Mechanical

Enclosure Material

Radiator: Aluminum alloy, Box: SGCC

Dimensions

150.7mm(L) * 144.5mm(W) * 45mm(H)

Mounting

Desktop、DIN-rail

Environment

Heat Dissipation System

Fan less design

Operating Temperature

-20~60℃ with 0.7 m/s airflow

Storage Temperature

-40~80℃

Relative Humidity

10 to 95% (non-condensing)

Vibration

3Grms@5~500Hz, random, 1hr/axis (IEC 60068-2-64)

Shock

10G, half sine, 11ms (IEC 60068-2-27)

TAC-3000_SpecSheet_APQ

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