Products

TMV-6000/ 7000 Machine Vision Controller

TMV-6000/ 7000 Machine Vision Controller

Features:

  • Support Intel ® 6th to 9th Core ™ I7/i5/i3 Desktop CPU
  • Paired with Q170/C236 industrial grade chipset
  • DP+HDMI dual 4K display interface, supporting synchronous/asynchronous dual display
  • 4 USB 3.0 interfaces
  • Two DB9 serial ports
  • 6 Gigabit network interfaces, including 4 optional POEs
  • Supporting 9V~36V wide voltage power input
  • Optional active/passive heat dissipation methods

  • Remote management

    Remote management

  • Condition monitoring

    Condition monitoring

  • Remote operation and maintenance

    Remote operation and maintenance

  • Safety Control

    Safety Control

Product Description

The TMV series vision controller adopts a modular concept, flexibly supporting Intel Core 6th to 11th generation mobile/desktop processors. Equipped with multiple Gigabit Ethernet and POE ports, as well as expandable multi-channel isolated GPIO, multiple isolated serial ports, and multiple light source control modules, it can perfectly support mainstream vision application scenarios.

Equipped with the QDevEyes – a focused IPC application scenario intelligent operation and maintenance platform, the platform integrates a wealth of functional applications in four dimensions: supervision, control, maintenance, and operation. It provides IPC with remote batch management, device monitoring, and remote operation and maintenance functions, meeting the operational and maintenance needs of different scenarios.

INTRODUCTION

Engineering Drawing

File Download

TMV-6000
TMV-7000
TMV-6000
Model TMV-6000
CPU CPU Intel® 6-8/11th Generation Core / Pentium/ Celeron mobile CPU
TDP 35W
Socket SoC
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memory Socket 1 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz
Max Capacity 16GB, Single Max. 16GB
Graphics Controller Intel® HD Graphics
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE)
Storage M.2 1 * M.2(Key-M,support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M,support 2242/2280 SATA SSD)
Expansin Slots Expansion box ①6 * COM(30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 optional (select by BOM),RS422/485 Optoelectronic isolation function optional)+16 * GPIO(36pin Spring-loaded plug-in Phoenix terminals,support 8* Optoelectronic isolation input,8* Optoelectronic isolation output  (Optional relay/opto-isolated output))
②32 * GPIO(2*36pin Spring-loaded plug-in Phoenix terminals,support 16* Optoelectronic isolation input,16* Optoelectronic isolation output  (Optional relay/opto-isolated output))
③4 * light source channels(RS232 control,Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us)1 * Power input(4pin 5.08 Phoenix terminals with locked)
Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000
M.2 1 * M.2(Key-B, support 3042/3052 4G/5G module)
Mini PCIe 1 * Mini PCIe (support WIFI/3G/4G)
Front I/O Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE function optional,support IEEE 802.3af/ IEEE 802.3at,single port MAX. to 30W,total P=MAX. to 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Display 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Serial 2 * RS232 (DB9/M)
SIM 2 * Nano SIM card slot (SIM1)
Rear I/O Antenna 4 * Antenna hole
Power Supply Type DC,
Power Input Voltage 9 ~ 36VDC, P≤240W
Connector 1 * 4Pin Connector, P=5.00/5.08
RTC Battery CR2032 Coin Cell
OS Support Windows 6/7th:Windows 7/8.1/108/9th:  Windows 10/11
Linux Linux
Watchdog Output System Reset
Interval Programmable via Software from 1 to 255 sec
Mechanical Enclosure Material Radiator: Aluminum alloy, Box: SGCC
Dimensions 235mm(L) * 156mm(W) * 66mm(H) without expansion box
Weight Net: 2.3 kgExpansion box Net: 1kg
Mounting DIN rail /Rack mount / Desktop
Environment Heat Dissipation System Fanless Passive Cooling
Operating Temperature -20~60℃ (Industrial SSD)
Storage Temperature -40~80℃ (Industrial SSD)
Relative Humidity 10 to 90% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)
TMV-7000
Model TMV-7000
CPU CPU Intel® 6-9th Generation Core / Pentium/ Celeron Desktop CPU
TDP 65W
Socket LGA1151
Chipset Chipset Intel® Q170/C236
BIOS BIOS AMI UEFI BIOS (Support Watchdog Timer)
Memory Socket 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 2400MHz
Max Capacity 32GB, Single Max. 16GB
Ethernet Controller 2 * Intel i210-AT/i211-AT;I219-LM LAN Chip ( 10/100/1000 Mbps, RJ45)4 * Intel i210-AT LAN Chip ( 10/100/1000 Mbps, RJ45; support POE)
Storage M.2 1 * M.2(Key-M,support 2242/2280 SATA or PCIe x4/x2 NVME SSD)1 * M.2(key-M,support 2242/2280 SATA SSD)
Expansin Slots Expansion box ①6 * COM(30pin Spring-loaded plug-in Phoenix terminals, RS232/422/485 optional (select by BOM),RS422/485 Optoelectronic isolation function optional)+16 * GPIO(36pin Spring-loaded plug-in Phoenix terminals,support 8* Optoelectronic isolation input,8* Optoelectronic isolation output  (Optional relay/opto-isolated output))
②32 * GPIO(2*36pin Spring-loaded plug-in Phoenix terminals,support 16* Optoelectronic isolation input,16* Optoelectronic isolation output  (Optional relay/opto-isolated output))
③4 * light source channels(RS232 control,Support external triggering, total output power 120W; The single channel supports a maximum of 24V 3A (72W) output, 0-255 stepless dimming, and the external trigger delay <10us)1 * Power input(4pin 5.08 Phoenix terminals with locked)
Notes: Expansion box ①② can be expand one of the two, Expansion box③ can be expanded up to three on one TMV-7000
M.2 1 * M.2(Key-B, support 3042/3052 4G/5G module)
Mini PCIe 1 * Mini PCIe (support WIFI/3G/4G)
Front I/O Ethernet 2 * Intel® GbE(10/100/1000Mbps,RJ45)4 * Intel® GbE(10/100/1000Mbps,RJ45,support POE function optional,support IEEE 802.3af/ IEEE 802.3at,single port MAX. to 30W,total P=MAX. to 50W)
USB 4 * USB3.0 (Type-A, 5Gbps)
Display 1 *HDMI: max resolution up to 3840*2160 @ 60Hz1 * DP++: max resolution up to 4096*2304 @ 60Hz
Audio 2 * 3.5mm Jack (Line-Out + MIC)
Serial 2 * RS232 (DB9/M)
SIM 2 * Nano SIM card slot (SIM1)
Power Supply Power Input Voltage 9 ~ 36VDC, P≤240W
OS Support Windows 6/7th:Windows 7/8.1/108/9th:  Windows 10/11
Linux Linux
Mechanical Dimensions 235mm(L) * 156mm(W) * 66mm(H) without expansion box
Environment Operating Temperature -20~60℃ (Industrial SSD)
Storage Temperature -40~80℃ (Industrial SSD)
Relative Humidity 10 to 90% RH (non-condensing)
Vibration During Operation With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
Shock During Operation With SSD: IEC 60068-2-27 (30G, half sine, 11ms)

ATT-H31C

TMV-6000_20231226_00

TMV-7000

TMV-7000_20231226_00

  • OBTAIN SAMPLES

    Effective, safe and reliable. Our equipment guarantees the right solution for any requirement. Benefit from our industry expertise and generate added value - every day.

    Click For InquiryClick more