Mobile Platform

Mobile Platform

Sipiyu:

  • Intel Atomu Yiyi Platform
  • Intel Mobile Mobile Platform
  • Platform Ojú-iṣẹ Intel
  • Intel Xeon Super Platform
  • Nvidia Jetson Platform
  • Rockchips Microelectronics

PCH:

  • B75
  • H81
  • Q170
  • H110
  • H310C
  • H470
  • Q470
  • H610
  • Q670

Iwọn iboju:

  • 7"
  • 10.1"
  • 10.4"
  • 11.6"
  • 12.1"
  • 13.3"
  • 15"
  • 15.6"
  • 17"
  • 18.5"
  • 19"
  • 19.1"
  • 21.5"
  • 23.8"
  • 27"

Ipinnu:

  • 800*600
  • 1024*768
  • 1280*800
  • 1280*1024
  • 1366*768
  • 1440*900
  • Ọdun 1920*1080

Afi ika te:

  • Iboju Fọwọkan Capacitive/Resistive
  • Iboju Fọwọkan Resistive
  • Iboju Fọwọkan Capacitive
  • Gilasi ibinu

Awọn ẹya ara ẹrọ ọja:

  • IP65
  • Ko si Fan
  • PCIe
  • PCI
  • M.2
  • 5G
  • POE
  • Orisun Imọlẹ
  • GPIO
  • LE
  • Meji Lile Drive
  • RAID
  • E6 PC ise ifibọ

    E6 PC ise ifibọ

    Awọn ẹya:

    • Nlo Intel® 11th-U mobile Syeed Sipiyu

    • Ṣepọ awọn kaadi nẹtiwọki Intel® Gigabit meji
    • Meji eewọ àpapọ atọkun
    • Ṣe atilẹyin ibi ipamọ dirafu meji, pẹlu dirafu lile 2.5 ”ti o nfihan apẹrẹ fa-jade
    • Atilẹyin APQ aDoor Bus module imugboroosi
    • Ṣe atilẹyin imugboroosi alailowaya WiFi / 4G
    • Atilẹyin 12 ~ 28V DC jakejado foliteji ipese agbara
    • Ara iwapọ, apẹrẹ alafẹfẹ, pẹlu heatsink yiyọ kuro