Ukusetshenziswa kwe-APQ 4u Industrial PC IPC400 kwi-Wafer Dicing Machines

Isingeniso Sangemuva

Imishini ye-Wafer Dicing ingubuchwepheshe obubucayi bokukhiqiza i-semiconductor, okuthinta ngokuqondile isivuno se-chip nokusebenza. Le mishini isikwa ngokunembile futhi ihlukanise ama-chip amaningi ku-wafer esebenzisa ama-lasers, ukuqinisekisa ubuqotho kanye nokwenza ukusebenza kwe-chip ngayinye ezindaweni ezilandelwayo zokufaka kanye nezigaba zokuhlola ezilandelayo. Lapho imboni ithuthuka ngokushesha, kunezidingo ezandayo zokunemba okuphezulu, ukusebenza kahle, kanye nokusimama kwemvelo emishini yokudambisa.

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Izidingo ezibalulekile zemishini ye-wafer dicing

Abakhiqizi njengamanje bagxile kwizinkomba ezimbalwa zokhiye we-Wafer Dicing Machines:

Ukusika Ukucaciswa: Ukunemba kweleveli ye-nanometer-level, okuthinta ngqo i-chip isivuno nokusebenza.

Isivinini sokusika: Ukusebenza kahle okuphezulu ukuze uhlangabezane nezidingo zokukhiqizwa kwabantu abaningi.

UsikeniUmonakalo: Incishiswe ukuqinisekisa ikhwalithi ye-chip ngesikhathi senqubo yokusika.

Izinga le-automation: Izinga eliphakeme le-automation ukuze linciphise ukungenelela okwenziwa ngesandla.

Ukuthembeka: Ukusebenza okuzinzile kwesikhathi eside ukunciphisa amanani okuhluleka.

Khokhisa: Izindleko zokulungiswa okuphansi ukwenza ngcono ukusebenza kahle kokukhiqiza.

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Imishini edayisiwe ye-Wafer, njengemishini yokunemba, ihlanganisa ama-subsystem angaphezu kweshumi, kufaka phakathi:

  • Ikhabethe lokusatshalaliswa kwamandla
  • Ikhabethe laseLaser
  • Uhlelo lokunyakaza
  • Uhlelo lokulinganisa
  • Uhlelo lokubona
  • I-Laser Beam Delivery System
  • Umthwalo we-wafer nokufayela
  • I-COAPLE NE-CLEANER
  • Iyunithi yokomisa
  • Iyunithi Yokunikezela nge-Fluid

 

Uhlelo lokulawula lubalulekile njengoba luphatha yonke inqubo, kufaka phakathi ukusetha izindlela zokusika, ukulungisa amandla we-laser, nokubheka inqubo yokusika. Izinhlelo zanamuhla zokulawula nazo zidinga ukusebenza okufana nokugxila kwe-auto, ukulinganisa okuzenzakalelayo, kanye nokuqapha kwangempela.

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Ama-PC wezimboni njengeyunithi yokulawula okuyisisekelo

Ama-PC wezimboni (ama-IPCs) ajwayele ukusetshenziswa njengeyunithi yokulawula e-CORE emishinini ye-wafer dicing, futhi kufanele ahlangabezane nalezi zidingo ezilandelayo:

  1. I-computing yokusebenza ephezulu: Ukuphatha ukusika okusheshayo kanye nezidingo zokucubungula idatha.
  2. Imvelo Eqinile Yokusebenza: Ukusebenza okuthembekile ezimweni ezinzima (izinga lokushisa eliphakeme, umswakama).
  3. Ukuthembeka okuphezulu nokuphepha: Amandla anamandla okulwa nokuphazanyiswa ukuqinisekisa ukunemba nokuphepha okusikayo.
  4. Ukunakwa kanye nokuhambisana: Ukusekelwa kokuxhumana okuningi kanye namamojula wokuthuthuka okulula.
  5. Ukuvumelatgakata: Ukuvumelana nezimo zokuhlangabezana namamodeli we-Wafer we-Wafer Deping Machine nezidingo zokukhiqiza.
  6. Ukusebenziseka kalula kanye nokunakekelwa: Isikhombimsebenzisi esisebenziseka kalula kanye nokulungiswa okulula ukunciphisa izindleko.
  7. Uhlelo olusebenzayo lokupholisa: Ukuhlanzeka okusebenzayo kokushisa ukuze kuqinisekiswe ukusebenza okuzinzile.
  8. Ukuphathakwa: Ukusekelwa kwezinhlelo zokusebenza okusebenzayo kanye nesoftware yezimboni ukuhlanganiswa okulula.
  9. Ukusebenza kwezindleko: Amanani anengqondo ngenkathi uhlangabezana nezidingo ezingenhla ukuze zilungele izingqinamba zesabelomali.

 

I-APQ Classic 4U IPC:

Uchungechunge lwe-IPC400

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Le khasiI-APQ IPC400i-chassis ebekwe yi-classic 4U ebekiwe evumelana namazinga wezimboni. Yenzelwe womabili ama-Systems afakwe odongeni futhi afakwe ngaphakathi futhi anikezela ngesisombululo esisebenza ngemali esinezimboni ezinezinketho ezigcwele zama-backplanes, izimpahla zamandla, namadivayisi okugcina. Ixhasa ubukhuluUkucaciswa kwe-ATX, okubandakanya ubukhulu obujwayelekile, ukuthembeka okuphezulu, kanye nokukhethwa okucebile kwe-i / o interface (kufaka phakathi amachweba amaningi we-serial, amachweba we-USB, nokubonisa okuphumayo). Ingahlalisa ama-Slots afinyelela ku-7.

Izici ezibalulekile zochungechunge lwe-IPC400:

  1. I-Chassis enobumba ngokugcwele ngo-19-inch 4u rack-ntack.
  2. IsekelaI-Intel® 2nd kuya ku-13th Generation Desktop CPUS.
  3. Ihambisana namabhodi ajwayelekile we-ATX kanye nama-4u Power Supplies.
  4. Isekela kuze kufike kuma-7 wokuphakama okuphezulu kokuphakama ukuze ahlangabezane nezidingo ezahlukahlukene zezimboni.
  5. Idizayini evumelana ngumsebenzisi nge-Tool-Free Movie yabalandeli bohlelo lwangaphambili.
  6. I-PCIE-free PCIE EXPINSION DADINTION DACKATION PARCKET NGOKUQHAWULA KAKHULU.
  7. Kufika ku-8 anti-vibration kanye ne-strust-inch hard drive ama-hard drive.
  8. Ongakukhetha 2 x 5.25-Inch Drive Bays.
  9. Iphaneli yangaphambili enamachweba e-USB, ukushintshwa kwamandla, nezinkomba zokulungiswa kohlelo okulula.
  10. I-alamu ye-anti-tamper kanye nomnyango wangaphambi kokhiye ukuvimbela ukufinyelela okungagunyaziwe.
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Amamodeli anconyiwe asanda kunconywa weMishini ye-Wafer Dicing

Ukuthayipha Isifanekiso Ukumisa
I-4U rack-mack ipc IPC400-Q170 IPC400 Chassis / Q170 Chipset / 2 LAN / 6 USB 3.2 Gen1 + 2 USB 2.0 / HDMI + DP / I5-6500 / DDR4 8GB / DDR4 812GB / 2 x RS232 / 300W ATX PSU
I-4U rack-mack ipc IPC400-Q170 IPC400 Chassis / Q170 Chipset / 2 LAN / 6 USB 3.2 Gen1 + 2 USB 2.0 / Hdmi + DP / 2 X vs23g / m.2 sata 512gb / 2 x RS232 / 300W atx PSU
I-4U rack-mack ipc IPC400-H81 IPC400 Chassis / H81 Chipset / 2 LAN / 2 USB 3.2 Gen1 + 4 USB 2.0 / HDMI + DVI-D / I5-4460 / DDR3 8GB / M.2 STA 512GB / 2 x RS232 / 300W ATX PSU
I-4U rack-mack ipc IPC400-H81 IPC400 Chassis / H81 Chipset / 2 LAN / 2 USB 3.2 Gen1 + 4 USB 2.0 / HDMI + DVI-D / I7-4770 / DDR3 8GB / M.2 Sata 512GB / 2 x RS232 / 300W ATX PSU

 

Uma unentshisekelo kwinkampani yethu nemikhiqizo yethu, zizwe ukhululekile ukuxhumana nommeleli wethu waphesheya kwezilwandle, i-Robin.

Email: yang.chen@apuqi.com

I-WhatsApp: +86 18351628738


Isikhathi sePosi: Nov-08-2024
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